High current filter feed-through capacitor

• US 6,512,666 B1
• Filed: 12/17/2001
• Issued: 01/28/2003
• Est. Priority Date: 08/21/2001
• Status: Expired due to Fees

• Current Assignee: Knowles Capital Formation, Inc. (Knowles Corporation)
• Original Assignee: Delaware Capital Formation Incorporated (Dover Corporation)
• Inventors: Duva, Frank A.
• Primary Examiner(s): Dinkins, Anthony
• Application Number:
  US10/022,717
• Time in Patent Office: 407 Days
• Field of Search: 361/302, 361/321.2, 361/301.4, 361/303, 361/304, 361/306.3, 361/309, 361/313, 29/254.1, 29/250.3, 29/254.2
• US Class Current: 361/321.2
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

An improved monolithic multilayer ceramic filter capacitor for use with implanted medical devices such as pacemakers and defibrillators. The capacitor includes a parallel stack of positive electrode plates that have sufficient current carrying capability to be directly connected in series with a lead wire from an implanted medical device. Therefore, the capacitor may be used for both filtering and pulsed energy transmission. High current capability is achieved through the use of interleaved electrode plates where the positive electrodes are connected in parallel, and where at least one of the positive electrodes is of sufficiently high conductor density to carry a majority of the current transmitted by the implantable medical device lead.

Claims

1. A high current multilayer ceramic capacitor comprising:

a plurality of layers of a ceramic substrate;

a plurality of electrodes interleaved with intermediate layers of the ceramic substrate;

a high conductive density electrode formed on an exposed surface of a top or bottom layer of the substrate;

means for electrically connecting alternating layers of electrodes to form a set of positive electrodes and a set of ground electrodes;

wherein the high conductive density electrode is one of the positive electrodes; and

wherein the high conductive density electrode is produced by forming a slot in the exposed surface of one of the surface ceramic layers and wherein the slot is filled with conductive material.

2. The capacitor of claim 1, wherein the slot is formed by machining the surface ceramic layer.

3. The capacitor of claim 2, wherein the method of machining is selected from the group consisting of laser or water jet machining.

4. A high current multilayer ceramic capacitor comprising:

a plurality of layers of a ceramic substrate;

a plurality of electrodes interleaved with intermediate layers of the ceramic substrate;

a high conductive density electrode formed on an exposed surface of a top or bottom layer of the substrate;

means for electrically connecting alternating layers of electrodes to form a set of positive electrodes and a set of ground electrodes;

wherein the high conductive density electrode is one of the positive electrodes; and

wherein the positive electrodes have first and second ends, each set of ends being electrically connected in parallel.

5. A high current multilayer ceramic capacitor comprising:

a plurality of layers of a ceramic substrate;

a plurality of electrodes interleaved with intermediate layers of the ceramic substrate;

a high conductive density electrode formed on an exposed surface of a top or bottom layer of the substrate;

means for electrically connecting alternating layers of electrodes to form a set of positive electrodes and a set of ground electrodes;

wherein the high conductive density electrode is one of the positive electrodes; and

wherein the means for electrically connecting the alternating layers of electrodes includes forming an internal connection hole in the plurality of layers and filling the hole with conductive material.

6. A high current multilayer ceramic capacitor comprising:

a plurality of layers of a ceramic substrate;

a plurality of electrodes interleaved with intermediate layers of the ceramic substrate;

a high conductive density electrode formed on an exposed surface of a top or bottom layer of the substrate;

means for electrically connecting alternating layers of electrodes to form a set of positive electrodes and a set of ground electrodes;

wherein the high conductive density electrode is one of the positive electrodes; and

wherein the means for electrically connecting the alternating layers of electrodes includes extending an end of selected positive or ground electrodes to the edges of the ceramic layers and metalizing the exposed edges with a conductive material.

7. The capacitor of claim 6, wherein the ground electrodes are oriented at substantially a right angle to the positive electrodes.

8. A method for forming a multilayer ceramic capacitor comprising the steps of:

forming a plurality of layers of a ceramic substrate, wherein each layer has an upper and lower surface, and each layer is composed of a heat fusible oxide of ceramic powder;

depositing layers of heat fusible electrode material on the upper and lower surfaces of intermediate layers of the ceramic substrate to form a composite stack of layers;

sintering the composite stack of dielectric/electrode layers to form a fused stack;

forming an electrical connection between alternating layers of electrodes to form a set of positive electrodes and a set of ground electrodes;

forming a slot on an exposed surface of a top or bottom layer of the fused stack and filling the slot with heat fusible electrode material to form a high conductive density electrode, wherein the high conductive density electrode is one of the positive electrodes; and

heating the stack to fuse the heat fusible electrode material deposited in the slot.

9. The method of claim 8, further including the steps of forming parallel electrical connections at a set of first ends of the positive electrodes and at a set of second ends of the positive electrodes.