Method for handling a plurality of circuit chips

• US 6,514,790 B1
• Filed: 05/29/2001
• Issued: 02/04/2003
• Est. Priority Date: 09/03/1998
• Status: Expired due to Term

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: Haberger, Karl, Landesberger, Christof, Plettner, Andreas
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): YEVSIKOV, VICTOR V
• Application Number:
  US09/786,330
• Time in Patent Office: 616 Days
• Field of Search: 438/106, 438/107, 438/108, 438/109, 438/110, 438/111, 438/113, 438/115, 438/118, 438/122, 438/125, 395/563, 395/800.14, 395/898, 414/935
• US Class Current: 438/106
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape

Abstract

In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.

Claims

1. A method for the handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, comprising the following steps:

picking up a plurality of circuit chips by a plurality of pick up devices;

simultaneously moving a plurality of pick up devices with the picked up circuit chips to one or several supports in such a way that simultaneously with the motion the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement; and

simultaneously placing the circuit chips in the second arrangement onto one or several carriers.

2. The method of claim 1, wherein the respective circuit chips comprise first distances between the circuit chips, when they are in the first arrangement, and wherein the respective circuit chips comprise second distances between the circuit chips, when they are in the second arrangement.

3. The method of claim 2, wherein the first distances are smaller than the second distances.

4. The method of claim 1, wherein the picking up of a respective integrated circuit chip is effected by a respective pick up device by a magnetic clutch, an electrostatic clutch, a vacuum clutch or an adhesive layer on a respective pick up device.

5. The method of claim 1, wherein the respective circuit chips are separated from the auxiliary support by adding energy to the place of connection between the auxiliary support and the circuit chip, if the same are picked up by the respective pick up devices.