Integrally connected image sensor packages having a window support in contact with a window and the active area

• US 6,515,269 B1
• Filed: 01/25/2000
• Issued: 02/04/2003
• Est. Priority Date: 01/25/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Arellano, Tony, Hollaway, Roy Dale
• Primary Examiner(s): Allen, Stephone B.
• Assistant Examiner(s): Glass, Christopher W.
• Application Number:
  US09/490,717
• Time in Patent Office: 1,106 Days
• Field of Search: 250/208.1, 250/216, 250/239, 257/434
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

An image sensor package includes an image sensor having an active area, a window, and a window support in contact with the active area and in contact with the window. The window support entirely encloses, and thus protects, the active area of the image sensor. During use, radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. By forming the window and the window support to have a similar refractive index, the amount of reflected radiation is minimized thus enhancing the sensitivity of the image sensor package. Further, the window support completely fills the region between the window and the active area thus eliminating any possibility of moisture condensation within the image sensor package.

Claims

1. A structure comprising:

an image sensor substrate comprising image sensors integrally connected together, said image sensors including an image sensor, said image sensor having an active area;

a window; and

a window support in contact with said active area and in contact with said window.

2. The structure of claim 1 wherein said image sensor comprises a first surface, said structure further comprising bond pads on said first surface, said bond pads defining a central region of said first surface inwards of said bond pads, said active area being located within said central region.

3. The structure of claim 2 wherein said window support is formed on said central region.

4. The structure of claim 2 wherein said window support entirely encloses said active area and does not extend over any of said bond pads.

5. The structure of claim 2 further comprising:

a substrate; and

electrically conductive traces on a first surface of said substrate, a first bond pad of said bond pads being electrically connected to a first trace of said electrically conductive traces.

6. The structure of claim 5 further comprising electrically conductive interconnection balls on a second surface of said substrate, said first bond pad being electrically connected to a first interconnection ball of said electrically conductive interconnection balls.

7. The structure of claim 2 further comprising a leadframe comprising electrically conductive leads, a first bond pad of said bond pads being electrically connected to a first lead of said electrically conductive leads.

8. The structure of claim 1 wherein said active area is a receiver, transmitter or transceiver of radiation, said window support being transparent to said radiation.

9. The structure of claim 8 wherein said window is transparent to said radiation.

10. The structure of claim 1 wherein said window has a first surface and a second surface, said first surface being secured to said window support.

11. The structure of claim 10 wherein said second surface is exposed to an ambient environment.

12. The structure of claim 10 wherein said window further comprises sides extending between said first surface and said second surface, said window further comprising a locking feature formed along said sides.

13. The structure of claim 12 wherein said locking feature is a step.

14. The structure of claim 12 wherein said locking feature includes a shelf extending around said second surface.

15. The structure of claim 14 wherein said shelf is located on a plane parallel to, and located between, a plane defined by said first surface and a plane defined by said second surface.

16. The structure of claim 15 wherein step sides extend between said second surface and said shelf, said shelf and said step sides defining a pocket.

17. The structure of claim 16 further comprising a package body extending into and filling said pocket.

18. The structure of claim 17 wherein said package body in combination with said window support mechanically locks said window in place.

19. The structure of claim 1 wherein a refractive index of said window support approximately equal to a refractive index of said window.

20. The structure of claim 1 wherein said window support completely fills a region between said active area and said window.

21. The structure of claim 20 wherein said structure is a cavityless package.

22. The structure of claim 21 wherein said cavityless package has no dew point.

23. A structure comprising:

an image sensor substrate comprising image sensors integrally connected together, said image sensors including a first image sensor, said first image sensor having an active area;

a window comprising;

a first surface;

a second surface;

sides extending between said first surface and said second surface; and

a locking feature formed along said sides; and

a window support in contact with said active area and in contact with said first surface of said window.

24. A structure comprising:

an image sensor having an active area;

a window comprising;

a first surface;

a second surface;

a shelf extending around said second surface; and

step sides extending between said second surface and said shelf, said shelf and said step sides defining a pocket;

a window support in contact with said active area and in contact with said first surface of said window; and

a package body extending into and filling said pocket.

25. A structure comprising:

an image sensor selected from the group consisting of a CMOS image sensor, a charge coupled device, a pyroelectric ceramic on CMOS and an erasable programmable read-only memory device, said image sensor having an active area and bond pads;

a window; and

a window support in contact with said active area and in contact with said window, wherein said window support entirely encloses said active area and does not extend over any of said bond pads.