Edge bead removal/spin rinse dry (EBR/SRD) module

• US 6,516,815 B1
• Filed: 07/09/1999
• Issued: 02/11/2003
• Est. Priority Date: 07/09/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Olgado, Donald, Stevens, Joe, Ko, Alex, Mok, Yeuk-Fai Edwin
• Primary Examiner(s): Stinson, Frankie L.
• Application Number:
  US09/350,212
• Time in Patent Office: 1,313 Days
• Field of Search: 134/147, 134/153, 134/902, 134/94.1, 134/95.3, 134/99.1, 134/103.2, 134/25.4, 134/33
• US Class Current: 134/25.4
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck and the fluid delivery assembly comprises one or more nozzles. The invention also provide a method for etching a substrate, comprising: rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate.

Claims

1. An apparatus for etching a substrate, comprising:

a container;

a substrate support disposed in the container;

a rotation actuator attached to the substrate support;

a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support, wherein the fluid delivery assembly comprises one or more angled nozzles; and

a substrate lift assembly disposed in the container comprising a lift platform and a plurality of arms extending radially from the lift platform.

2. The apparatus of claim 1 wherein the substrate support comprises a vacuum chuck.

3. The apparatus of claim 1 wherein the one or more angled nozzles deliver the etchant to the peripheral portion of the substrate at an angle of incidence less than about 45 degrees.

4. The apparatus of claim 3 wherein the one or more angled nozzles deliver the etchant to a peripheral portion of the substrate at an angle of incidence between about 10 and about 30 degrees.

5. The apparatus of claim 1 wherein the fluid delivery system is selectively connected between an etchant source and a deionized water source.

6. The apparatus of claim 1 wherein the one or more angled nozzles comprises a first set of nozzles connectable to an etchant source and a second set of nozzles connectable to a deionized water source.

7. The apparatus of claim 1 further comprising a deionized water nozzle disposed in the container to deliver deionized water to a central portion of the substrate.

8. The apparatus of claim 1 wherein the substrate lift assembly comprises a plurality of clips disposed at distal ends of the arms.

9. A method for etching a substrate, comprising:

rotating a substrate utilizing a rotatable substrate support comprising a substrate lift assembly having a lift platform and a plurality of arms extending radially from the lift platform;

delivering an etchant to a peripheral portion of the substrate utilizing a fluid delivery assembly having one or more angled nozzles;

delivering a rinsing agent to the substrate after etching; and

spin drying the substrate.

10. The method of claim 9 wherein the substrate is rotated at between about 100 rpm and about 1000 rpm.

11. The method of claim 9 wherein the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate.

12. The method of claim 9 wherein the etchant is delivered to a surface of the substrate at an angle of incidence less than about 45 degrees.

13. The method of claim 9 wherein the etchant is delivered to a front side and a back side of the substrate.

14. The method of claim 9 further comprising delivering deionized water to a central portion of the substrate.

15. An apparatus for delivering an etchant to a peripheral edge of a substrate, comprising:

an enclosure having a substrate support and a rotation actuator attached to the substrate support;

a fluid delivery assembly comprising at least one angled nozzle disposed about a peripheral edge of the substrate; and

a substrate lift assembly connected to the substrate support, wherein the substrate lift assembly comprises a plurality of arms extending radially from a lift platform and a plurality of clips disposed at distal ends of the arms.

16. The apparatus of claim 15 wherein the substrate support comprises a vacuum chuck.

17. The apparatus of claim 15 wherein the at least one angled nozzle delivers the etchant to a peripheral portion of the substrate at an angle of incidence less than about 45 degrees.

18. The apparatus of claim 15 wherein the fluid delivery system is selectively connected between an etchant source and a deionized water source.

19. The apparatus of claim 15 wherein the at least one angled nozzle comprises a first set of angled nozzles connectable to an etchant source and a second set of angled nozzles connectable to a deionized water source.

20. The apparatus of claim 15 further comprising a deionized water nozzle to deliver deionized water to a central portion of the substrate.

21. The apparatus of claim 15 wherein the at least one angled nozzle delivers the etchant to a peripheral portion of the substrate at an angle of incidence between about 10 and about 30 degrees.

22. An apparatus for etching a substrate, comprising:

an enclosure having a substrate support and a rotation actuator attached to the substrate support;

a delivery assembly comprising at least one nozzle to deliver a fluid to a peripheral edge of a substrate at an angle of incidence of less than about 45 degrees; and

a substrate lift assembly disposed in the enclosure comprising a lift platform and a plurality of arms extending radially from the lift platform.

23. The apparatus of claim 22, wherein the delivery assembly comprises a first set of nozzles connectable to an etchant source and a second set of nozzles connectable to a deionized water source.

24. The apparatus of claim 23, wherein the second fluid source comprises deionized water.

25. The apparatus of claim 23, wherein the first fluid source comprises an etchant.

26. The apparatus of claim 23, wherein the delivery assembly comprises at least one pair of vertically aligned nozzles.

27. The apparatus of claim 22, wherein the fluid delivery assembly delivers the fluid to an upper peripheral edge of the substrate.

28. The apparatus of claim 22, wherein the fluid delivery assembly delivers the fluid to a lower peripheral edge of the substrate.

29. The apparatus of claim 22, wherein the fluid delivery assembly delivers the fluid to upper and lower peripheral edges of the substrate.

30. The apparatus of claim 22, further comprising means for spin drying the substrate.

31. The apparatus of claim 22, wherein the substrate is rotated during the delivery of the fluid.

32. The apparatus of claim 22 wherein the at least one nozzle delivers the fluid to a peripheral edge of the substrate at an angle of incidence between about 10 and about 30 degrees.

33. An apparatus for etching a substrate, comprising:

means for supporting a substrate;

means for lifting the substrate, wherein the means for lifting comprises a lift platform and a plurality of arms extending radially from the lift platform;

means for rotating the substrate; and

a delivery assembly for delivering a fluid to a peripheral edge of a substrate disposed on the means for supporting a substrate, wherein the delivery system comprises at least one pair of nozzles connectable to a first fluid source and at least one pair of nozzles connectable to a second fluid source.

34. The apparatus of claim 33, further comprising means for spin drying the substrate.

35. The apparatus of claim 33, wherein the first fluid source comprises an etchant.

36. The apparatus of claim 33, wherein the second fluid source comprises deionized water.

37. The apparatus of claim 33, wherein the fluid is delivered to an upper and lower surface of the substrate at an angle of incidence less than about 45 degrees.

38. The apparatus of claim 33, wherein the fluid is delivered in the direction of the rotation of the substrate.

39. The apparatus of claim 33, wherein the fluid is delivered to an upper surface of the substrate at an angle of incidence less than about 45 degrees.

40. The apparatus of claim 33, wherein the nozzles of each pair are vertically aligned.

41. The apparatus of claim 33, wherein the fluid is delivered to upper and lower surfaces of the substrate at an angle of incidence between about 10 and about 30 degrees.

42. An apparatus for etching a substrate, comprising:

an enclosure having a substrate support and a rotation actuator attached to the substrate support;

a delivery assembly for delivering fluids to a peripheral edge of a substrate disposed on the substrate support, wherein the delivery system comprises at least one set of first angled nozzles connectable to a first fluid source and at least one set of second angled nozzles connectable to a second fluid source; and

a substrate lift assembly disposed in the enclosure comprising a lift platform and a plurality of arms extending radially from the lift platform.

43. The apparatus of claim 42, wherein the at least one set of first angled nozzle delivers a first fluid to an upper peripheral edge of the substrate at an angle of incidence less than about 45 degrees.

44. The apparatus of claim 43, wherein the at least one set of second angled nozzles delivers a second fluid to a lower peripheral edge of the substrate.

46. The apparatus of claim 42, wherein the first and second set of angled nozzles are each connectable to a first fluid source, a second fluid source, or both fluid sources.

47. The apparatus of claim 42, wherein the angled nozzles deliver the fluid to a peripheral portion of the substrate at an angle of incidence less than about 45 degrees.

45. An apparatus for etching a substrate, comprising:

an enclosure having a substrate support and a rotation actuator attached to the substrate support;

a delivery assembly for delivering a fluid to a peripheral edge of a substrate disposed on the substrate support, wherein the delivery system comprises a first set of angled nozzles disposed above an upper surface of the substrate and a second set of angled nozzles disposed below a lower surface of the substrate; and

a substrate lift assembly disposed in the enclosure comprising a lift platform and a plurality of arms extending radially from the lift platform.

48. An apparatus for etching a substrate, comprising:

an enclosure having a substrate support and a rotation actuator attached to the substrate support;

a delivery assembly for delivering a fluid to a peripheral edge of a substrate disposed on the substrate support, wherein the delivery system comprises at least one angled nozzle disposed above an upper surface of the substrate and at least one angled nozzle disposed below a lower surface of the substrate, wherein the angled nozzles deliver the fluid to a peripheral portion of the substrate at an angle of incidence less than about 45 degrees; and

a substrate lift assembly disposed in the enclosure comprising a lift platform and a plurality of arms extending radially from the lift platform.

49. The apparatus of claim 48 wherein the angled nozzles deliver the fluid to a peripheral edge of the substrate at an angle of incidence between about 10 and about 30 degrees.

50. The apparatus of claim 48, wherein the angled nozzles are each connectable to a first fluid source, a second fluid source, or both fluid sources.