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Etching and cleaning apparatus

  • US 6,517,670 B2
  • Filed: 07/11/2001
  • Issued: 02/11/2003
  • Est. Priority Date: 06/26/1998
  • Status: Expired due to Fees
First Claim
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1. A plasma processing apparatus comprising:

  • a vacuum chamber;

    a gas supply equipment for feeding gas into the vacuum chamber;

    an evacuation equipment for evacuating the vacuum chamber;

    a source of plasma for generating plasma in the vacuum chamber;

    a matching circuit;

    a substrate electrode on which a substrate is placed;

    a high-frequency power source for supplying high-frequency power to the substrate electrode through the matching circuit;

    a voltage monitoring conductor provided in the vicinity of the substrate electrode, said voltage monitoring conductor being coupled to the substrate electrode such as to allow high-frequency power supply;

    said voltage monitoring conductor AC coupled to said substrate electrode with a DC isolated connection; and

    a monitoring circuit for monitoring a direct current potential of the voltage monitoring conductor.

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