Fabrication of finely featured devices by liquid embossing

• US 6,517,995 B1
• Filed: 03/14/2000
• Issued: 02/11/2003
• Est. Priority Date: 09/14/1999
• Status: Expired due to Term

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Massachusetts Institute of Technology
• Inventors: Hubert, Brian N., Wilhelm, Eric J., Bulthaup, Colin A., Jacobson, Joseph M.
• Primary Examiner(s): Huff, Mark F.
• Assistant Examiner(s): CHACKO DAVIS, DABORAH
• Application Number:
  US09/525,734
• Time in Patent Office: 1,064 Days
• Field of Search: 430/320, 430/322, 430/330, 438/455, 438/754, 101/28, 264/1.1, 264/1.24, 264/1.38, 264/2.3, 264/1.36, 510/175
• US Class Current: 430/320
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 2219/00382 Stamping
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00608 DNA chips
• CPC Class Codes: B01J 2219/0061 The surface being organic
• CPC Class Codes: B01J 2219/00621 by physical means, e.g. trenches, raised areas
• CPC Class Codes: B01J 2219/0063 Other, e.g. van der Waals forces, hydrogen bonding
• CPC Class Codes: B01J 2219/00635 by reactive plasma treatment
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00722 Nucleotides
• CPC Class Codes: B01J 2219/00725 Peptides
• CPC Class Codes: B01J 2219/00731 Saccharides
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C40B 40/06 Libraries containing nucleotides or polynucleotides, or derivatives thereof
• CPC Class Codes: C40B 40/10 Libraries containing peptides or polypeptides, or derivatives thereof
• CPC Class Codes: C40B 40/12 Libraries containing saccharides or polysaccharides, or derivatives thereof
• CPC Class Codes: C40B 60/14 for creating libraries
• CPC Class Codes: G03F 7/0002 : Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: G03F 7/0017 : for the production of embossing, cutting or similar devices; for the production of casting means
• CPC Class Codes: H01L 21/0271 : comprising organic layers
• CPC Class Codes: H01L 21/288 : from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/76802 : by forming openings in dielectrics
• CPC Class Codes: H01L 21/76817 : using printing or stamping techniques
• CPC Class Codes: H10K 19/00 : Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
• CPC Class Codes: H10K 71/13 : using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/20 : Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: H10K 71/231 : by etching of existing layers
• CPC Class Codes: H10K 71/821 : Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer

Abstract

Elastomeric stamps facilitate direct patterning of electrical, biological, chemical, and mechanical materials. A thin film of material is deposited on a substrate. The deposited material, either originally present as a liquid or subsequently liquefied, is patterned by embossing at low pressure using an elastomeric stamp having a raised pattern. The patterned liquid is then cured to form a functional layer. The deposition, embossing, and curing steps may be repeated numerous times with the same or different liquids, and in two or three dimensions. The various deposited layers may, for example, have varying electrical characteristics, interacting so as to produce an integrated electronic component.

Claims

1. A method of fabricating a functional component, the method comprising:

a. providing a thin film of curable liquid material in liquid form;

b. patterning the curable material by embossing the material at low pressure with an elastomeric stamp having a raised pattern thereon;

c. curing the patterned material to form a cured layer; and

d. repeating (a) to (c) with a plurality of materials to form a plurality of cured layers which have varying functional characteristics, the plurality of cured layers interacting so as to produce the functional component.

2. The method of claim 1 wherein the stamp comprises an elastomeric polymeric matrix with a rigidity-conferring material entrained therein.

3. The method of claim 1 further comprising the step of forming the elastomeric stamp by:

a. creating a negative impression of the pattern in a substrate;

b. enclosing the pattern;

c. pouring a liquid elastomeric precursor into the enclosure, the precursor flowing into the negative impression of the pattern

d. curing the elastomeric precursor into an elastomer; and

e. removing the elastomer from the substrate.

4. The method of claim 1 further comprising the step of forming the elastomeric stamp by:

a. providing a photosensitive elastomer;

b. exposing the elastomer to actinic radiation so as to render the pattern; and

c. photochemically developing the exposed elastomer to produce the pattern.

5. The method of claim 1 further comprising cleaning the stamp by applying a curable polymer thereto, curing the curable polymer, and removing the cured polymer from the stamp.

6. The method of claim 1 wherein the curable material is applied as a liquid.

7. The method of claim 6 wherein the liquid is applied onto a smooth, flat support as a bead and drawn into a uniform film.

8. The method of claim 1 wherein the curable material is applied as a non-liquid and subsequently liquefied.

9. The method of claim 8 wherein the material is applied to a support and liquefied by heating the support.

10. The method of claim 8 wherein the material is liquefied by heating the stamp.

11. The method of claim 1 wherein the raised pattern comprises convex surfaces.

12. The method of claim 1 wherein the stamp is applied to the patterned material and removed therefrom with a rocking motion.

13. The method of claim 1 wherein the material is present on a support and is at least partially cured with the stamp held against the support.

14. The method of claim 1 wherein the stamp is removed from the material prior to curing the material, the material retaining the pattern despite removal of the stamp.

15. The method of claim 1 wherein the material is present on an uneven surface, the stamp patterning the material without substantial lateral deflection.

16. The method of claim 1 wherein the material is present on an uneven surface, the stamp having unraised portions which, with raised features of the stamp in contact with the surface, planarize the material in contact with the unraised portions.

17. The method of claim 1 wherein a plurality of contiguous layers is patterned with elastomeric stamps at least some of which have different patterns, at least some of the stamps having raised features in common locations to create vias between non-adjacent layers.

18. The method of claim 17 wherein at least some of the vias extend through a plurality of layers.

19. The method of claim 17 wherein the vias are filled by deposited material forming one of the layers, said material being planarized as said layer is patterned.

20. The method of claim 1 wherein the material of at least one of the cured layers is a suspension of nanoparticles in a carrier liquid.

21. The method of claim 20 wherein the material is cured by evaporating the carrier liquid, the nanoparticles coalescing into a substantially continuous patterned film.

22. The method of claim 21 wherein the nanoparticles are metal, the film being conductive.

23. The method of claim 21 wherein the nanoparticles are semiconductive, the film being semiconductive.

24. The method of claim 1 wherein at least one of the cured layers is soluble in a solvent, and further comprising removing the at least one cured layer by exposure of the component to the solvent.

25. The method of claim 1 wherein, for each cured layer, the stamp is applied at a plurality of locations to produce a two-dimensional repetitive pattern.

26. The method of claim 1 wherein steps (a) to (d) are repeated a plurality of times so that the cured layers are formed repetitively.

27. The method of claim 1 wherein application of the stamp to the thin film results in adherence of material to the raised stamp pattern, the embossing step comprising transferring the adhered material to a substrate for curing.

28. The method of claim 27 wherein transfer is accomplished by application of low pressure to the stamp.

29. The method of claim 1 wherein the thin film is formed by deposition of the curable material in droplet form followed by application of the stamp thereto so as to form a thin film having a pattern complementary to the stamp pattern.

30. The method of claim 1 wherein the functional component is a micromechanical structure.

31. The method of claim 1 wherein the functional component is an integrated circuit, the cured layers comprising conducting, dielectric, and semiconducting layers.

32. The method of claim 1 wherein the functional component is a biochip.

33. The method of claim 1 wherein the functional component is a field-emission display.

34. The method of claim 33 wherein the curable material is a suspension of metal nanoparticles and carbon nanotubes and the pattern comprises first and second sets of interdigitated lines having nanotubes protruding therefrom, the repeating steps comprising applying a suspension of metal nanoparticles so as to cover the first set of interdigitated lines and curing the metal-nanopartic suspension thereover.

35. The method of claim 1 wherein the functional component is an optical waveguide.

36. A method of fabricating a functional component, the method comprising the steps of:

a. providing a thin film of a liquid on a support;

b. patterning the liquid by embossing it at low pressure with an elastomeric stamp having a first raised pattern thereon, the raised pattern displacing the liquid when brought into contact with the support; and

c. bringing into contact with the support a substrate having thereon a second raised pattern, the liquid, where present on the support, adhering to the second raised pattern.

37. The method of claim 36 wherein the liquid comprises a biological material.

38. The method of claim 36 wherein the liquid comprises a biological resist, and further comprising exposing the substrate to a biological material, the biological material not adhering to portions of the substrate that have received the resist.

39. A method for making a multi-layer structure comprising:

a. depositing a first liquid layer;

b. patterning the first liquid layer with a first stamp to form a first patterned liquid layer;

c. curing the first patterned liquid layer to form a first device layer;

d. depositing a second liquid layer over a portion of the first device layer;

e. patterning the second liquid layer with a second stamp to form a second patterned liquid layer; and

f. curing the second patterned liquid layer to form a second device layer.

40. The method of claim 39, wherein at least one of the first device layer and the second device layer is conductive.

41. The method of claim 39, wherein at least one of the first device layer and the second device layer is insulating.

42. The method of claim 39, wherein the first device layer is a conductive layer, the second device layer is an insulating layer, the method further comprising depositing a third liquid layer and curing the third liquid layer to form a third device layer.

43. The method of claim 42, wherein the third device layer is a conductive device layer.