Process for producing semiconductor device

• US 6,518,095 B1
• Filed: 04/12/2000
• Issued: 02/11/2003
• Est. Priority Date: 04/20/1999
• Status: Expired due to Term

• Current Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Original Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Inventors: Akutsu, Yasushi
• Primary Examiner(s): Picardat, Kevin M.
• Application Number:
  US09/548,347
• Time in Patent Office: 1,035 Days
• Field of Search: 438/108, 438/118, 438/119, 438/124, 438/125, 438/126, 438/127
• US Class Current: 438/118
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01045 Rhodium [Rh]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

A process for producing a semiconductor device comprises mounting of a semiconductor element on a circuit board via a thermosetting resin-based adhesive by means of a thermocompression process, wherein the thermocompression process is carried out under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin, provided that pressure P² of the second set of conditions is set to a lower level than the pressure P¹ of the first set of conditions.

Claims

1. A process for producing a semiconductor device, comprising:

connecting a semiconductor element to a circuit board via a thermosetting resin-based adhesive by means of a thermo-compression process;

carrying out the thermo-compression process under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin; and

setting the pressure P² of the second set of conditions at a lower level than the pressure P¹ of the first set of conditions, wherein P¹ and P² have a stepwise pressure profile.

2. A process for producing a semiconductor device, comprising:

connecting a semiconductor element to a circuit board via a thermosetting resin-based adhesive by means of a thermo-compression process;

carrying out the thermo-compression process under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin; and

setting the pressure P² of the second set of conditions at a lower level than the pressure P¹ of the first set of conditions, wherein T¹ and T² have a stepwise temperature profile.

3. A process for producing a semiconductor device, comprising:

connecting a semiconductor element to a circuit board via a thermosetting resin-based adhesive by means of a thermo-compression process;

carrying out the thermo-compression process under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin; and

setting the pressure P² of the second set of conditions at a lower level than the pressure P¹ of the first set of conditions, wherein the semiconductor element is a bare chip, chip size package, or IC module.

4. A process for producing a semiconductor device, comprising:

connecting a semiconductor element to a circuit board via a thermosetting resin-based adhesive by means of a thermo-compression process;

carrying out the thermo-compression process under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin;

setting the pressure P² of the second set of conditions at a lower level than the pressure P¹ of the first set of conditions; and

setting the temperature T² to a higher temperature than T¹, wherein P¹ and P² have a stepwise pressure profile.

5. A process for producing a semiconductor device, comprising:

connecting a semiconductor element to a circuit board via a thermosetting resin-based adhesive by means of a thermo-compression process;

carrying out the thermo-compression process under a first set of conditions (pressure=P¹ and temperature=T¹) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure=P² and temperature=T²) designed to bring about curing of the thermosetting resin; and

setting the pressure P² of the second set of conditions at a lower level than the pressure P¹ of the first set of conditions, wherein P¹ and P² have a stepwise pressure profile and T¹ and T²have a stepwise temperature profile.