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IC package with dual heat spreaders

  • US 6,518,098 B2
  • Filed: 08/29/2001
  • Issued: 02/11/2003
  • Est. Priority Date: 09/01/1998
  • Status: Expired due to Term
First Claim
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1. A method for forming a semiconductor device comprising:

  • providing a semiconductor die connected to exterior leads extending therefrom;

    encapsulating said semiconductor die in a material to form a package having opposing major surfaces, a peripheral edge having a register apparatus therein and a portion of said exterior leads connected to said semiconductor die projecting therefrom;

    forming a pair of heat spreaders, said pair of heat spreaders having at least two posts extending therefrom for contacting at least a portion of a substrate, each heat spreader of said pair of heat spreaders configured to cover a portion of said opposing major surfaces, said pair of heat spreaders providing essentially a sole structural support for at least one of said exterior leads, said pair of heat spreaders comprising register apparatus on at least one peripheral edge thereof for accurate mounting to said opposing major surfaces;

    attaching said pair of heat spreaders to said opposing major surfaces of said package formed by said material encapsulating said semiconductor die by aligning each of said register apparatus of said pair of heat spreaders with said register apparatus of said package to form a a recess extending into said opposing major surfaces and each said pair of heat spreaders;

    positioning said pair of heat spreaders so as to provide and opening between distal end portions of said pair of heat spreaders; and

    performing another encapsulation step for forming a final package having portions of said pair of heat spreaders therein, said exterior leads and portions of said at least two posts extending from said final package.

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