Process for manufacturing an SOI wafer by oxidation of buried channels

• US 6,518,147 B1
• Filed: 07/25/2000
• Issued: 02/11/2003
• Est. Priority Date: 07/26/1999
• Status: Expired due to Term

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Barlocchi, Gabriele, Villa, Flavio Francesco
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): POMPEY, RON EVERETT
• Application Number:
  US09/625,112
• Time in Patent Office: 931 Days
• Field of Search: 438/429, 438/404, 438/405, 438/413, 438/442, 438/444
• US Class Current: 438/429
• CPC Class Codes: H01L 21/76205 in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
• CPC Class Codes: H01L 21/76208 using auxiliary pillars in the recessed region, e.g. to form LOCOS over extended areas
• CPC Class Codes: H01L 21/76248 using lateral overgrowth techniques, i.e. ELO techniques

Abstract

A process that includes the steps of forming, in a wafer of monocrystalline silicon, first trenches extending between portions of the wafer; etching the substrate to remove the silicon around the first trenches and forming cavities in the substrate; covering the walls of the cavities with an epitaxial growth inhibiting layer; growing a monocrystalline epitaxial layer on top of the substrate and the cavities so as to obtain a monocrystalline wafer embedding buried cavities completely surrounded by silicon; forming second trenches extending in the epitaxial layer as far as the cavities; removing the epitaxial growth inhibiting layer; oxidizing the cavities, forming at least one continuous region of buried oxide; depositing a polysilicon layer on the entire surface of the wafer and inside the second trenches; removing the polysilicon layer on the surface and leaving filling regions inside the second trenches; and oxidizing, on the top, portions of said filling regions so as to form field oxide regions.

Claims

1. A process for manufacturing an SOI wafer, comprising:

forming cavities in a substrate of semiconductor material;

growing an epitaxial layer of monocrystalline type on top of said substrate and said cavities to obtain a wafer of monocrystalline semiconductor material embedding said cavities, said cavities being completely surrounded by said monocrystalline material;

forming second trenches extending in said epitaxial layer up to said cavities; and

oxidizing said cavities to form at least one continuous region of buried oxide.

2. The process of claim 1 wherein forming cavities comprises:

forming first trenches in said substrate;

said first trenches extending between portions of said wafer; and

etching said substrate to remove said semiconductor material around said first trenches.

3. The process of claim 2 wherein said etching is carried out in TMAH.

4. The process of claim 3 wherein said etching is time-controlled.

5. The process of claim 2 wherein forming first trenches comprises:

forming a first hard mask of insulating material; and

anisotropically etching said substrate, using said first hard mask.

6. The process of claim 1, further comprising, after forming said cavities, coating walls of said cavities with a layer inhibiting epitaxial growth.

7. The process of claim 1 wherein forming second trenches comprises forming a hard mask and etching said epitaxial layer.

8. The process of claim 1 further comprising:

filling said second trenches with filling regions of semiconductor material; and

oxidizing upper portions of said filling regions so as to form regions of monocrystalline epitaxial silicon that are insulated at the sides and at the bottom.

9. The process of claim 8 wherein filling said second trenches comprises:

depositing a semiconductor material layer over the entire surface of the wafer; and

removing said semiconductor material layer on said surface of said wafer.

10. The process of claim 1 wherein said cavities extend along the entire area of said wafer.

11. The process of claim 1 wherein said cavities extend only on a part of the area of said wafer.

12. The process of claim 1, further comprising, before forming first trenches, doping said substrate of semiconductor material.

13. A process for manufacturing an SOI wafer, comprising:

forming first trenches in a substrate of semiconductor material;

etching the first trenches to form cavities in the substrate of semiconductor material;

growing an epitaxial layer of monocrystalline silicon on top of the substrate of semiconductor material to cover the trenches and the cavities formed therein;

forming second trenches in the epitaxial layer to extend as far as the cavities; and

oxidizing the cavities to form at least one continuous region of buried oxide.

14. The process of claim 13 wherein etching the first trenches further comprises coating the cavity walls with a layer inhibiting epitaxial growth.

15. The process of claim 14 wherein forming the second trenches comprises subsequently removing the epitaxial growth inhibiting layer from the cavities.

16. The process of claim 15 wherein forming the second trenches further comprises, subsequent to removing the epitaxial growth inhibiting layer, filling the second trenches with filling regions of semiconductor material;

and oxidizing upper portions of the filling regions to form regions of monocrystalline epitaxial silicon that are insulated at the sides and at the bottom.

17. The process of claim 16 wherein filling the second trenches comprises depositing a semiconductor material layer over the entire surface of the wafer, and removing the semiconductor material layer on the surface of the wafer.

18. The process of claim 13, further comprising, prior to forming the first trenches, doping the substrate of semiconductor material.

19. A process for the manufacture of an SOI wafer by oxidation of buried channels, the process comprising:

forming first trenches in a wafer of monocrystalline silicon, the first trenches extending between portions of the wafer;

etching the wafer to remove the silicon around the first trenches and forming cavities in the wafer;

covering the walls of the cavities with an epitaxial growth inhibiting layer;

growing a monocrystalline epitaxial layer on top of the substrate and the cavities so as to obtain a monocrystalline wafer embedding buried cavities that are completely surrounded by silicon;

forming second trenches extending in the epitaxial layer as far as and in communication with the cavities;

removing the epitaxial growth inhibiting layer; and

oxidizing the cavities to form at least one continuous region of buried oxide.

20. The process of claim 19, further comprising depositing a polysilicon layer on the entire surface of the wafer and inside the second trenches, removing the polysilicon layer on the surface and leaving filling regions inside the second trenches;

and oxidizing on the top of the wafer the portions of the filling regions to form field oxide regions.

21. The process of claim 20 wherein forming the first trenches comprises forming a first hard mask of insulating material, and anisotropically etching the substrate using the first hard mask.

22. The process of claim 20 wherein forming the second trenches comprises forming a second hard mask, and etching the epitaxial layer using the second hard mask.

23. A process for manufacturing an SOI wafer, comprising in sequence, the steps of:

forming cavities in a substrate of semiconductor material;

growing an epitaxial layer of monocrystalline type on top of said substrate and said cavities to obtain a wafer of monocrystalline semiconductor material embedding said cavities, said cavities being completely surrounded by said monocrystalline material;

forming second trenches extending in said epitaxial layer up to said cavities; and

oxidizing said cavities to form at least one continuous region of buried oxide.