Ceramic multilayer circuit boards mounted on a patterned metal support substrate

• US 6,518,502 B2
• Filed: 05/10/2001
• Issued: 02/11/2003
• Est. Priority Date: 05/10/2001
• Status: Expired due to Term

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: In Lamina Ceramics
• Inventors: Hozer, Leszek, Chen, Hung-tse Daniel, Hammond, Mark Stuart, Tormey, Ellen Schwartz, Thaler, Barry Jay, Frederickson, Gerard, Geller, Bernard Dov
• Primary Examiner(s): Ngo, Hung V.
• Application Number:
  US09/852,901
• Publication Number:
  US 20020166684A1
• Time in Patent Office: 642 Days
• Field of Search: 174/52.2, 174/52.4, 174/52.3, 361/720, 361/760, 361/761, 361/719, 361/718, 257/706, 257/691, 257/700, 257/713
• US Class Current: 174/535
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49163 : with sintering of base
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Claims

1. An unfired electronic component package comprising

a support substrate of a conductive material having openings formed therethrough, said openings at least partially filled with a dielectric stabilization paste,

multiple green tape layers thermally matched to the support substrate, each green tape layer having circuitry printed thereon, said circuitry connected electrically by means of conductive vias in said green tape layers, said green tape layers having an opening therein through to the support substrate sized for insertion of an electronic component directly in contact with the support substrate.

2. A package according to claim 1 wherein said support substrate is coated with a patterned solder ink.

3. A package according to claim 2 wherein said solder ink comprises a silver-palladium powder.

4. A package according to claim 1 wherein said support substrate is a copper clad metal.

5. A package according to claim 1 wherein said dielectric stabilization paste is selected from the group consisting of aluminum oxide, zirconium oxide, and a mixture of aluminum oxide and zirconium oxide powder in an organic vehicle.

6. A package according to claim 1 wherein a low melt temperature glazing glass adheres the green tape layers to the metal support substrate which is coated with a patterned solder ink.

7. A package according to claim 1 wherein said support substrate is electroplated after patterning.

8. A package according to claim 1 wherein said support substrate is electroplated with nickel.

9. An electronic component package comprising

a support substrate of a conductive material having a pattern of openings therein;

a body of an insulating material on a surface of said support substrate, said body formed from a plurality of layers of glass or ceramic having circuitry thereon and bonded together and bonded to said support substrate;

at least one opening in said body extending to said patterned support substrate;

an electronic component mounted in said opening in said body and sealed to the support substrate; and

means for electrically connecting the electronic component to the circuitry in the ceramic body.

10. A package according to claim 9 wherein said support substrate is of a copper clad metal.

11. A package according to claim 9 wherein said support substrate has a patterned solder layer on both sides.

12. A package according to claim 9 wherein said support substrate is electroplated after patterning.

13. A package according to claim 9 wherein said support substrate is electroplated with nickel.