Printed wiring board, and method and apparatus for manufacturing the same

• US 6,518,515 B2
• Filed: 10/12/2001
• Issued: 02/11/2003
• Est. Priority Date: 02/10/1999
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nakai, Izuru, Okada, Toshiharu, Nakamura, Shinji, Hayashi, Hidenori, Nishii, Toshihiro, Yamane, Shigeru, Fujimoto, Toru
• Primary Examiner(s): PALADINI, ALBERT WILLIAM
• Application Number:
  US09/976,376
• Publication Number:
  US 20020020557A1
• Time in Patent Office: 487 Days
• Field of Search: 174/262, 174/261, 174/255, 257/698, 361/767, 361/707, 361/749, 438/129
• US Class Current: 174/262
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2203/1136 Conversion of insulating material into conductive material, e.g. by pyrolysis
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/0032 of organic insulating material
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249996 Ink in pores

Abstract

In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.

Claims

1. An apparatus for manufacturing a printed wiring board comprising:

a laser oscillator for oscillating a laser beam; and

an optical system for condensing the laser beam induced from said laser oscillator in a desired position on a substrate of the printed wiring board to form a hole,

wherein said optical system is provided with a mask for cutting off the laser beam by a maximum limit of 98%.

2. An apparatus for manufacturing a printed wiring board comprising:

a laser oscillator for oscillating a laser beam;

an optical system for condensing the laser beam induced from said laser oscillator in a desired position on a substrate of the printed wiring board; and

a mask for cutting off the laser beam by no more than 98% of the laser beam,

wherein said optical system is provided with a shutter for setting a pulse width of the laser to a predetermined value to allow the laser beam to pass therethrough only for a desired time.

3. An apparatus according to claim 2, wherein the laser beam is applied to the substrate to form a metamorphic layer around the hole.

4. An apparatus for manufacturing a printed wiring board comprising;

a laser oscillator containing gas as a laser medium; and

an optical system for condensing the laser beam induced from said laser oscillator in a desired position on a substrate of the printed wiring board to form a hole,

wherein a time required for expelling gas molecules excited by an oscillation signal from the aperture space for inducing the laser beam is in a range of 20 μ

s to 1 ms after said oscillation signal given to said laser oscillator is turned off.

5. An apparatus according to claim 4, wherein the laser beam is applied to the substrate to form a metamorphic layer around the hole.