Thermally conducting inductors

• US 6,518,868 B1
• Filed: 08/15/2000
• Issued: 02/11/2003
• Est. Priority Date: 08/15/2000
• Status: Expired due to Fees

• Current Assignee: Galaxy Power Incorporated
• Original Assignee: Galaxy Power Incorporated
• Inventors: Miller, Gerald, Ng, William, Schroter, Bernhard
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US09/639,189
• Time in Patent Office: 910 Days
• Field of Search: 336/83, 336/200, 336/223, 336/65, 336/183, 336/55-62, 361/701-714
• US Class Current: 336/55
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01F 17/043 with two, usually identical or nearly identical parts enclosing completely the coil (pot cores)
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

An inductor for a computer power supply module is provided. The inductor includes a one-piece, single turn winding formed of a material for conducting heat and electrical current. The material having at least about five times the amount of electrically conductive material necessary for conducting electrical current.

Claims

1. An inductive device, adapted to be attached to a pc board having a first side and a second side, whereby heat generating electrical components are disposed on the first side of the board, the inductive device comprising:

an electromagnetic winding having a first and a second side, the first side of the winding adapted to be attached to the second side of the board and the second side of the winding adapted to be connected to a heat sink,

wherein heat flows from the heat generating electrical components on the first side of the board, through the board to the second side of the board, into the first side of the winding, and out the second side of the winding to the heat sink.

2. The device of claim 1 wherein a magnetically permeable housing surrounds the winding.

3. The device of claim 1 wherein the first side and the second side of the winding are parallel, planar surfaces.

4. The device of claim 1 wherein the winding is one-piece and a single turn.

5. The device of claim 1 wherein the winding is formed of brass.

6. The device of claim 1 wherein the cross-sectional area of the winding is at least 5 times greater than is needed for conducting electrical current.

7. The device of claim 2 wherein the winding is adapted to be attached to the second side of the board through a first aperture in the housing and the winding is adapted to be connected to the heat sink through a second aperture in the housing.

8. The device of claim 1 wherein the inductive device is an inductor.

9. The device of claim 1 wherein the inductive device is a transformer.

10. An inductive device, attached to a pc board having a first side and a second side, whereby heat generating electrical components are disposed on the first side of the board, the inductive device comprising:

an electrical winding having a first side and a second side;

an electromagnetic material that is magnetically coupled to the winding, the electromagnetic material having a first and second aperture, whereby the first side of the winding is adapted to be attached to the second side of the board through the first aperture, and the second side of the winding is adapted to be connected to a heat sink through the second aperture,

wherein heat flows from the heat generating electrical components on the the first side of the board, through the board to the second side of the board, through the first aperture to the first side of the winding, and out the second side of the winding, through the second aperture to the heat sink.

11. A method for conducting heat generated from heat generating electrical components mounted on a first side of a pc board to a heat sink coupled to a second side of the pc board, the method comprising the steps of:

attaching a first side of an inductive device to the second side of the board;

connecting a second side of the inductive device to the heat sink; and

generating heat in the heat generating electrical components on the first side of the board,

whereby heat flows from the heat generating electrical components on the first side of the board, through the board to the second side of the board, into the first side of the inductive device, and out the second side of the inductive device to the heat sink.

12. The method of claim 11 wherein a magnetically permeable material surrounds the inductive device.

13. The method of claim 11 wherein the first side and the second side of the inductive device are parallel, planar surfaces.

14. The method of claim 11 wherein the inductive device is one-piece and a single turn.

15. The method of claim 11 wherein the inductive device is formed of brass.

16. The method of claim 11 wherein the cross-sectional area of the inductive device is at least 5 times greater than is needed for conducting electrical current.

17. The method of claim 12 wherein the inductive device is attached to the second side of the board through a first aperture in the magnetically permeable material and the inductive device is connected to the heat sink through a second aperture in the magnetically permeable material.

18. The method of claim 11 wherein the inductive device is an inductor.

19. The method of claim 11 wherein the inductive device is a transformer.

20. A method for conducting heat generated from heat generating electrical components mounted on a first side of a pc board to a heat sink coupled to a second side of the pc board, the method comprising the steps of:

attaching a first side of a magnetically permeable housing to the pc board, the magnetically permeable housing surrounding an inductive device;

connecting a second side of the housing to the heat sink; and

generating heat in the heat generating electrical components mounted on the first side of the board,

whereby heat flows from the heat generating electrical components on the first side of the board, through the board to the second side of the board, into the first side of the housing, and out the second side of the housing to the heat sink.

21. The method of claim 20 wherein said first and second surfaces thermally couple to said circuit board and said heat sink through upper and lower apertures in a housing.

22. An inductive device, adapted to be attached to a pc board having a first side and a second side, whereby heat generating electrical components are disposed on the first side of the board, the inductive device comprising:

an electromagnetic winding;

a magnetically permeable housing surrounding the winding, the housing having a first and a second side, whereby the first side of the housing is adapted to be attached to the second side of the board and the second side of the housing is adapted to be connected to a heat sink,

wherein heat flows from the heat generating electrical components on the first side of the board, through the board to the second side of the board, into the first side of the housing, and out the second side of the housing to the heat sink.

23. An inductive device, adapted to be attached to a pc board, whereby heat generating electrical components are disposed on the board, the inductive device comprising:

an electromagnetic winding having a first and a second side, the first side of the winding adapted to be attached to the heat generating electrical components on the board and the second side of the winding adapted to be connected to a heat sink,

wherein heat flows from the heat generating electrical components on the board, into the first side of the winding, and out the second side of the winding to the heat sink.

24. The device of claim 23 wherein a magnetically permeable housing surrounds the winding.

25. The device of claim 23 wherein the first side and the second side of the winding are parallel, planar surfaces.

26. The device of claim 23 wherein the winding is one-piece and a single turn.

27. The device of claim 23 wherein the winding is formed of brass.

28. The device of claim 23 wherein the cross-sectional area of the winding is at least 5 times greater than is needed for conducting electrical current.

29. The device of claim 24 wherein the winding is adapted to be attached to the heat generating electrical components through a first aperture in the housing and the winding is adapted to be connected to the heat sink through a second aperture in the housing.

30. The device of claim 23 wherein the inductive device is an inductor.

31. The device of claim 23 wherein the inductive device is a transformer.