Ultra-thin outline package for integrated circuit
First Claim
1. A low-profile integrated circuit package, comprising:
- a substrate having an aperture;
at least one conductive trace that includes upper and lower portions disposed on respective upper and lower surfaces of said substrate, said substrate further comprising at least one via electrically connecting said at least one conductive trace portions together, wherein said at least one via is disposed on at least one edge surface of said aperture;
an integrated circuit disposed in said aperture and being operatively coupled to said upper portion of said at least one conductive trace; and
an encapsulant provided in the aperture substantially covering said integrated circuit;
whereby, said lower portion of said at least one conductive trace is adapted for coupling of said low-profile integrated circuit package to a secondary substrate using conventional surface mounting techniques.
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Accused Products
Abstract
The present invention is directed to an ultra-thin outline package for integrated circuits that is much smaller than conventional chip packaging structures. The ultra-thin outline package is particularly useful in fabricating RF or RFID transponders. In an embodiment of the invention, the ultra-thin outline package includes a substrate having an aperture. At least one conductive trace that includes upper and lower portions is disposed on respective upper and lower surfaces of the substrate. The substrate further comprises at least one via electrically connecting the conductive trace portions together. An integrated circuit is disposed in the aperture and is operatively coupled to the upper portion of the conductive trace. An encapsulant is provided in the aperture substantially covering the integrated circuit. The lower portion of the conductive trace is adapted for coupling of the ultra-thin outline package to a secondary substrate using conventional surface mounting techniques. The via connecting the upper and lower trace portions may be disposed either on at least one edge surface of the aperture or on at least one edge surface of the substrate. At least one wire bond electrically couples the integrated circuit to the conductive trace, and the encapsulant covers the integrated circuit and the wire bond. Using printed circuit board material for the substrate, the ultra-thin outline package achieves a vertical profile of approximately 0.3 to 0.375 mm (12 to 15 mils).
92 Citations
32 Claims
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1. A low-profile integrated circuit package, comprising:
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a substrate having an aperture;
at least one conductive trace that includes upper and lower portions disposed on respective upper and lower surfaces of said substrate, said substrate further comprising at least one via electrically connecting said at least one conductive trace portions together, wherein said at least one via is disposed on at least one edge surface of said aperture;
an integrated circuit disposed in said aperture and being operatively coupled to said upper portion of said at least one conductive trace; and
an encapsulant provided in the aperture substantially covering said integrated circuit;
whereby, said lower portion of said at least one conductive trace is adapted for coupling of said low-profile integrated circuit package to a secondary substrate using conventional surface mounting techniques. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A low-profile integrated circuit package, comprising:
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a substrate having an aperture;
at least one conductive trace that includes upper and lower portions disposed on respective upper and lower surfaces of said substrate, said substrate further comprising at least one via electrically connecting said at least one conductive trace portions together, wherein said at least one via is disposed on at least one edge surface of said substrate;
an integrated circuit disposed in said aperture and being operatively coupled to said upper portion of said at least one conductive trace; and
an encapsulant provided in the aperture substantially covering said integrated circuit;
whereby, said lower portion of said at least one conductive trace is adapted for coupling of said low-profile integrated circuit package to a secondary substrate using conventional surface mounting techniques. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A radio frequency (RF) transponder, comprising:
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a low-profile integrated circuit package comprising;
a substrate having at least one conductive trace disposed on a surface thereof;
an integrated circuit coupled to said substrate and being operatively coupled to said at least one conductive trace; and
an encapsulant substantially covering said integrated circuit; and
a secondary substrate having an antenna disposed on a surface thereof, said low-profile integrated circuit package being surface mounted on said secondary substrate in electrical connection with said antenna;
wherein said substrate further comprises an aperture, said integrated circuit being disposed in said aperture; and
wherein said at least one conductive trace further comprises upper and lower portions disposed on respective upper and lower surfaces of said substrate, said substrate further comprising at least one via electrically coupling said at least one conductive trace portions together. - View Dependent Claims (18, 19)
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20. A radio frequency (RF) transponder, comprising:
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a low-profile integrated circuit package comprising;
a substrate having at least one conductive trace disposed on a surface thereof;
an integrated circuit coupled to said substrate and being operatively coupled to said at least one conductive trace; and
an encapsulant substantially covering said integrated circuit; and
a secondary substrate having an antenna disposed on a surface thereof, said low-profile integrated circuit package being surface mounted on said secondary substrate in electrical connection with said antenna;
wherein said substrate comprises at least one hole extending therethrough; and
wherein said at least one conductive trace is disposed on a lower surface of said substrate at least partially blocking said at least one hole. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A low-profile integrated circuit package, comprising:
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a first substrate having at least one hole extending therethrough;
at least one conductive trace disposed on a lower surface of said first substrate at least partially blocking said at least one hole;
an integrated circuit disposed on said first substrate and being operatively coupled to said at least one conductive trace through said at least one hole;
an encapsulant substantially covering said integrated circuit; and
a second substrate having an antenna disposed on a surface thereof and connected with said at least one conductive trace. - View Dependent Claims (31, 32)
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Specification