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Ultra-thin outline package for integrated circuit

  • US 6,518,885 B1
  • Filed: 10/14/1999
  • Issued: 02/11/2003
  • Est. Priority Date: 10/14/1999
  • Status: Expired due to Term
First Claim
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1. A low-profile integrated circuit package, comprising:

  • a substrate having an aperture;

    at least one conductive trace that includes upper and lower portions disposed on respective upper and lower surfaces of said substrate, said substrate further comprising at least one via electrically connecting said at least one conductive trace portions together, wherein said at least one via is disposed on at least one edge surface of said aperture;

    an integrated circuit disposed in said aperture and being operatively coupled to said upper portion of said at least one conductive trace; and

    an encapsulant provided in the aperture substantially covering said integrated circuit;

    whereby, said lower portion of said at least one conductive trace is adapted for coupling of said low-profile integrated circuit package to a secondary substrate using conventional surface mounting techniques.

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