Information recording tag

• US 6,518,887 B2
• Filed: 02/28/2001
• Issued: 02/11/2003
• Est. Priority Date: 03/09/2000
• Status: Expired due to Term

• Current Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Original Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Inventors: Matsumura, Takashi, Suzuki, Kazuaki
• Primary Examiner(s): Pham, Toan
• Application Number:
  US09/794,099
• Publication Number:
  US 20010020895A1
• Time in Patent Office: 713 Days
• Field of Search: 340/572.8, 340/572.1, 340/572.3, 340/572.5, 340/572.7, 340/568.1, 340/571
• US Class Current: 340/572.8
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07381 with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
• CPC Class Codes: G06K 19/0739 the incapacitated circuit being part of an antenna
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

The information recording tag includes an IC module in which an IC chip and a resonance circuit which is composed of a film capacitor and of an antenna coil are packaged on a substrate, and an adhesive that is applied to the IC module in order to adhere said IC module to an adherend S. The adhesive force between the adhesive and the adherend S is greater than the adhesive force between the insulation film of the film capacitor and the film type electrodes. The information recording tag, that is affixed to a prescribed adherend and used, can be destroyed if an attempt is made to remove it from its adherend after the information recording tag has been affixed to an adherend, in order to prevent improper usage of the information recording tag.

Claims

1. An information recording tag comprising an IC module in which an IC chip and a resonance circuit composed of a film capacitor having a periphery and of an antenna coil are packaged on a substrate, and an adhesive that is applied to the IC module in order to affix said IC module onto an adherend, wherein the adhesive is adhered to film type electrodes of the film capacitor and that the adhesive force between the adhesive and the adherend is greater than the adhesive force between the insulation film of the film capacitor and the film type electrodes.

2. The information recording tag according to claim 1, wherein a spacer material is provided to the periphery of the film capacitor, an adhesive is adhered to the spacer material, and the adhesive force between the adhesive and the adherend is greater than the adhesive force between the adhesive and the spacer material.

3. The information recording tag of claim 2 wherein the film capacitor comprises a mica capacitor.

4. The information recording tag according to claim 1, wherein an adhesive is applied to the IC module while no spacer material is provided thereon.

5. The information recording tag of claim 4 wherein the film capacitor comprises a mica capacitor.

6. The information recording tag according to claim 1, wherein the adhesive force between the adhesive and the adherend is greater than the adhesive force between the, adhesive and the substrate.

7. The information recording tag of claim 6 wherein the film capacitor comprises a mica capacitor.

8. The information recording tag of claim 1 wherein the film capacitor comprises a mica capacitor.