Packaged MEMS device and method for making the same
First Claim
1. A micro-electro-mechanical device comprising:
- a component layer comprising a frame, a plurality of components disposed in an array in the frame, the components movably coupled to the frame, and a plurality of solder wettable metallized regions on the frame;
an actuation layer comprising a plurality of actuators for moving the component, a plurality of conductive paths, and a plurality of solder wettable metallized regions, the actuation layer having a plurality-of electrodes laterally aligned for controlling the movement of the components;
the component layer and the actuation layer bonded together with a bonding solder material by solder joints between metallized regions on the respective layers with a gap spacing and in lateral alignment so that the movement of the component is controlled by an electrical signal applied to the actuator;
the component layer comprises at least one mirror component and the actuation layer comprises a plurality of electrodes for controlling each mirror; and
, one or more spacers between the component layer and the actuator layer to control the gap spacing between the layers, the spacers free of the bonding solder material.
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Accused Products
Abstract
A MEMs device comprises a component layer including a frame structure and at least one component movably coupled to the frame and an actuator layer including at least one conductive path and at least one actuator for moving the component. The component layer and the actuator layer are bonded together with solder or other materials in lateral alignment. Advantageously the layers are provided with metallization pads and are bonded together in lateral alignment with predetermined vertical gap spacing by solder bonds between the pads. In a preferred embodiment the MEMs device, however bonded, comprises a component layer, an actuator layer and an intervening spacer. The spacer provides the walls of a cavity between the component and the pertinent actuators to permit movement of the component. The walls cover the bulk of the peripheral boundary of the cavity to provide aerodynamic isolation. Advantageously the walls are conductive to provide electrostatic isolation. The device has particular utility in optical cross connection, variable attenuation and power gain equalization.
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Citations
37 Claims
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1. A micro-electro-mechanical device comprising:
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a component layer comprising a frame, a plurality of components disposed in an array in the frame, the components movably coupled to the frame, and a plurality of solder wettable metallized regions on the frame;
an actuation layer comprising a plurality of actuators for moving the component, a plurality of conductive paths, and a plurality of solder wettable metallized regions, the actuation layer having a plurality-of electrodes laterally aligned for controlling the movement of the components;
the component layer and the actuation layer bonded together with a bonding solder material by solder joints between metallized regions on the respective layers with a gap spacing and in lateral alignment so that the movement of the component is controlled by an electrical signal applied to the actuator;
the component layer comprises at least one mirror component and the actuation layer comprises a plurality of electrodes for controlling each mirror; and
,one or more spacers between the component layer and the actuator layer to control the gap spacing between the layers, the spacers free of the bonding solder material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 22, 23, 24, 25, 26, 37)
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17. A method of making a MEMs device comprising a component layer including an array of components movably coupled to the layer and an actuator layer including at least one conductive path and a plurality of actuators for moving the components, comprising the steps of:
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a) forming a plurality of solder-wettable metallization pads on a surface of the component layer and on a mating surface of the actuator level;
b) applying solder between metallization pads of the respective layers;
c) heating and bonding together the respective layers;
d) determining the gap spacing between respective layers with one or more spacers; and
,e) forming solder joints of predetermined gap spacing as set by the one or more spacers, between the metallization pads of the respective layers, the spacers free of the solder material. - View Dependent Claims (18, 19, 20, 21)
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27. A micro-electro-mechanical (MEMS) device comprising:
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a) a component layer comprising a frame and a plurality of components movably connected to the frame;
b) an actuator layer having at least one actuator for moving at least one component;
c) a bonding layer comprising bonding material to bond the component layer to the actuator layer. d) at least one spacer, to separate the component layer and the actuator layer by a vertical gap spacing, the spacer providing between the actuator and the component a cavity with conductive peripheral walls; and
,e) the component layer, the spacer and the actuator layer attached together with accurate lateral alignment and accurate gap spacing, the spacer free of the bonding material. - View Dependent Claims (28, 29, 30, 31, 32, 33)
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34. A micro-electro-mechanical (MEMs) device comprising:
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a) a component layer comprising a frame and an array of components in the component layer and movably connected to the frame;
b) an actuator layer having an array of actuators for moving the component; and
c) a bonding layer comprising bonding material to bond the component layer to the actuator layer. d) a stiffener frame disposed over the component layer, the frame having side walls bonded to the actuator layer, the frame free of the bonding material. - View Dependent Claims (36)
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35. A micro-electro-mechanical (MEMs) device comprising:
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a) a component layer comprising a frame and at least one component movably connected to the frame;
b) an actuator layer having at least one actuator for moving the component; and
c) a frame disposed over the component layer, the frame having side walls bonded to the actuator layer, wherein the frame comprises at least one transparent plate overlying the component layer.
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Specification