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Packaged MEMS device and method for making the same

  • US 6,519,075 B2
  • Filed: 01/25/2001
  • Issued: 02/11/2003
  • Est. Priority Date: 11/03/2000
  • Status: Expired due to Term
First Claim
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1. A micro-electro-mechanical device comprising:

  • a component layer comprising a frame, a plurality of components disposed in an array in the frame, the components movably coupled to the frame, and a plurality of solder wettable metallized regions on the frame;

    an actuation layer comprising a plurality of actuators for moving the component, a plurality of conductive paths, and a plurality of solder wettable metallized regions, the actuation layer having a plurality-of electrodes laterally aligned for controlling the movement of the components;

    the component layer and the actuation layer bonded together with a bonding solder material by solder joints between metallized regions on the respective layers with a gap spacing and in lateral alignment so that the movement of the component is controlled by an electrical signal applied to the actuator;

    the component layer comprises at least one mirror component and the actuation layer comprises a plurality of electrodes for controlling each mirror; and

    , one or more spacers between the component layer and the actuator layer to control the gap spacing between the layers, the spacers free of the bonding solder material.

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