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Microsensor having a sensor device connected to an integrated circuit by a solder joint

  • US 6,520,014 B1
  • Filed: 06/02/2000
  • Issued: 02/18/2003
  • Est. Priority Date: 06/02/1999
  • Status: Expired due to Fees
First Claim
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1. A microsensor for measuring, calibration and compensation electronics, said microsensor comprising a micro-electromechanical sensor device mechanically and electrically connected to an integrated circuit by a single soldered joint disposed between said device and the integrated circuit in a pattern defining a cavity within which a mechanical portion of said device is located, said soldered joint forming the sole electrical connection between the sensor device and said integrated circuit.

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