Microsensor having a sensor device connected to an integrated circuit by a solder joint
First Claim
1. A microsensor for measuring, calibration and compensation electronics, said microsensor comprising a micro-electromechanical sensor device mechanically and electrically connected to an integrated circuit by a single soldered joint disposed between said device and the integrated circuit in a pattern defining a cavity within which a mechanical portion of said device is located, said soldered joint forming the sole electrical connection between the sensor device and said integrated circuit.
1 Assignment
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Accused Products
Abstract
In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.
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Citations
10 Claims
- 1. A microsensor for measuring, calibration and compensation electronics, said microsensor comprising a micro-electromechanical sensor device mechanically and electrically connected to an integrated circuit by a single soldered joint disposed between said device and the integrated circuit in a pattern defining a cavity within which a mechanical portion of said device is located, said soldered joint forming the sole electrical connection between the sensor device and said integrated circuit.
Specification