Microsensor having a sensor device connected to an integrated circuit by a solder joint

• US 6,520,014 B1
• Filed: 06/02/2000
• Issued: 02/18/2003
• Est. Priority Date: 06/02/1999
• Status: Expired due to Fees

• Current Assignee: Austria Mikro System International AG
• Original Assignee: Austria Mikro System International AG
• Inventors: Brandl, Manfred
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US09/585,417
• Time in Patent Office: 991 Days
• Field of Search: 734/93, 735/142.3, 735/143.2, 734/31, 735/140.1, 735/141.2, 735/141.3, 736/54, 737/56, 738/665, 257/678, 257/690, 257/723, 257/724, 257/725, 257/726
• US Class Current: 73/493
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/058 Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/131 with electrostatic counterbalancing means
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body

Abstract

In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.

Claims

1. A microsensor for measuring, calibration and compensation electronics, said microsensor comprising a micro-electromechanical sensor device mechanically and electrically connected to an integrated circuit by a single soldered joint disposed between said device and the integrated circuit in a pattern defining a cavity within which a mechanical portion of said device is located, said soldered joint forming the sole electrical connection between the sensor device and said integrated circuit.

2. A microsensor according to claim 1, wherein said portion comprises a capacitor plate.

3. A microsensor according to claim 1 or 2, wherein said portion comprises an electrically conductive flexible bar disposed within said cavity.

4. A microsensor according to claim 3, wherein said flexible bar is a cantilevered element and wherein the microsensor further comprises a capacitor plate formed on the integrated circuit in facing relationship with a proximal end of the conductive cantilevered element to form a reference capacitor.

5. A microsensor according to claim 3, further comprising an electrode formed on the integrated circuit in facing relationship with the flexible bar for applying an electrostatic force to the bar.

6. A microsensor according to claim 4, further comprising an electrode formed on the integrated circuit in facing relationship with the flexible bar at a location intermediate said proximate end and a distal end of the bar for applying an electrostatic force to the bar.

7. A microsensor according to claim 1, wherein said device further comprises a back-etched cuboid of electronically conductive Si spaced from the integrated circuit by a spacer element disposed within said cavity.

8. A microsensor according to claim 1, wherein said cavity is evacuated.

9. A microsensor according to claim 4, further comprising an additional capacitor plate formed on the integrated circuit in facing relationship with a distal end of the conductive cantilevered bar to form an additional capacitor.

10. A microsensor according to claim 6, further comprising an additional capacitor plate formed on the integrated circuit in facing relationship with the distal end of the conductive cantilevered bar to form an additional capacitor.