High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles

• US 6,520,030 B1
• Filed: 03/21/2000
• Issued: 02/18/2003
• Est. Priority Date: 08/05/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Jiang, Tongbi, Wu, Zhiqiang
• Primary Examiner(s): Williams, Hezron
• Assistant Examiner(s): THOMPSON, JEWEL VERGIE
• Application Number:
  US09/531,166
• Time in Patent Office: 1,064 Days
• Field of Search: 738/620--86, 738/626.8, 364/556
• US Class Current: 73/862.06
• CPC Class Codes: G01L 1/205 using distributed sensing elements

Abstract

A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.

Claims

1. An electrical pressure-sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject; and

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution.

2. The electrical pressure-sensitive grid of claim 1, wherein the contacting phase layer comprises:

an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix; and

an array of electrodes coupled to the matrix.

3. The electrical pressure-sensitive grid of claim 1, wherein the circuitry phase layer comprises:

an array of electrodes coupled to the matrix; and

,

an array of resistance-measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and to the array of electrodes of the circuitry phase layer.

46. The pressure-sensitive grid of claim 2, wherein the electrodes are bonding pads.

47. The pressure-sensitive grid of claim 1, wherein the circuitry phase layer includes an integrated circuit.

48. The pressure-sensitive grid of claim 2, wherein the filler particles are distributed evenly throughout the contact phase layer.

49. The pressure-sensitive grid of claim 2, wherein the filler particles include at least one of a group consisting of silver, nickel, metal-coated polystyrene or other metal-coated polymer material.

50. The pressure-sensitive grid of claim 1, wherein the contacting phase layer has a resistance change to pressure value of 4% g/mm².

51. The pressure-sensitive grid of claim 1, wherein the contacting phase layer includes at least one of a group consisting of rigid polymeric materials, flexible, elastic polymeric materials, viscous organics, and polymers.

52. The pressure-sensitive grid of claim 51, wherein the rigid polymeric materials include polyimidesiloxane.

53. The pressure-sensitive grid of claim 51, wherein the flexible, elastic polymeric materials include polyurethane and silicone.

54. The pressure-sensitive grid of claim 1, wherein the circuitry phase layer includes a plurality of electrodes and measures a change in the resistance across one or more sections of the contacting phase layer spanned by the electrodes.

4. A high-resolution pattern-recognition device comprising an electrical pressure-sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject; and

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a high-resolution pressure contour distribution.

5. An electrical pressure sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the circuitry phase layer comprises an array of electrodes coupled to the contacting phase layer.

55. The pressure sensitive grid of claim 5, wherein the electrodes are bonding pads.

56. The pressure sensitive grid of claim 5, wherein the circuitry phase layer includes an integrated circuit.

57. The pressure sensitive grid of claim 5, wherein the contacting phase layer includes filler particles that are distributed evenly throughout the contacting phase layer.

58. The pressure sensitive grid of claim 5, wherein the contacting phase layer includes filler particles, the filler particles including at least one of a group consisting of silver, nickel, metal-coated polystyrene or other metal-coated polymer material.

59. The pressure sensitive grid of claim 5, wherein the contacting phase layer has a resistance change to pressure value of 4% g/mm².

60. The pressure sensitive grid of claim 5, wherein the contacting phase layer includes at least one of a group consisting of rigid polymeric materials, flexible, elastic polymeric materials, viscous organics, and polymers.

61. The pressure sensitive grid of claim 60, wherein the rigid polymeric materials include polyimidesiloxane.

62. The pressure sensitive grid of claim 60, wherein the flexible, elastic polymeric materials include polyurethane and silicone.

63. The pressure sensitive grid of claim 5, wherein the electrodes are bonding pads.

6. An electrical pressure sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution;

wherein the circuitry phase layer comprises an array of electrodes coupled to the contacting phase layer; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

64. The pressure sensitive grid of claim 6, wherein the circuitry phase layer includes an integrated circuit.

7. An electrical pressure sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution.

65. The pressure sensitive grid of claim 7, wherein the contacting phase layer includes filler particles that are distributed evenly throughout the contacting phase layer.

66. The pressure sensitive grid of claim 7, wherein the contacting phase layer includes filler particles, the filler particles including at least one of a group consisting of silver, nickel, metal-coated polystyrene or other metal-coated polymer material.

67. The pressure sensitive grid of claim 7, wherein the contacting phase layer has a resistance change to pressure value of 4% g/mm².

68. The pressure sensitive grid of claim 7, wherein the contacting phase layer includes at least one of a group consisting of rigid polymeric materials, flexible, elastic polymeric materials, viscous organics, and polymers.

69. The pressure sensitive grid of claim 68, wherein the rigid polymeric materials include polyimidesiloxane.

70. The pressure sensitive grid of claim 68, wherein the flexible, elastic polymeric materials include polyurethane and silicone.

8. An electrical pressure sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution;

wherein the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the circuitry phase layer comprises an array of electrodes coupled to the contacting phase layer.

71. The pressure sensitive grid of claim 8, wherein the circuitry phase layer measures a change in the resistance across the one or more sections of the contacting phase layer spanned by the electrodes.

72. The pressure sensitive grid of claim 8, wherein the electrodes are bonding pads.

73. The pressure sensitive grid of claim 8, wherein the circuitry phase layer includes an integrated circuit.

74. The pressure sensitive grid of claim 8, wherein the contacting phase layer includes filler particles that are distributed evenly throughout the contacting phase layer.

75. The pressure sensitive grid of claim 8, wherein the contacting phase layer includes filler particles, the filler particles including at least one of a group consisting of silver, nickel, metal-coated polystyrene or other metal-coated polymer material.

76. The pressure sensitive grid of claim 8, wherein the contacting phase layer has a resistance change to pressure value of 4% g/mm².

77. The pressure sensitive grid of claim 8, wherein the contacting phase layer includes at least one of a group consisting of rigid polymeric materials, flexible, elastic polymeric materials, viscous organics, and polymers.

78. The pressure sensitive grid of claim 77, wherein the rigid polymeric materials include polyimidesiloxane.

79. The pressure sensitive grid of claim 77, wherein the flexible, elastic polymeric materials include polyurethane and silicone.

9. An electrical pressure sensitive grid comprising:

a contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution;

wherein the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution;

wherein the circuitry phase layer comprises an array of electrodes coupled to the contacting phase layer; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

10. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject; and

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution.

11. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads.

12. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

13. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads and wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

14. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the matrix has a volume percent of filler particles that increases as a force applied to the matrix increases and a resistance that decreases as the volume percent of filler particles increases.

15. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the matrix has a resistance that decreases as a force applied to the matrix increases.

16. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein the matrix has a volume that decreases as a force applied to the matrix increases.

17. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes coupled to the contacting phase layer, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution; and

wherein a force applied to one or more locations on the matrix causes decreased resistance of the matrix at the one or more locations.

18. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject; and

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer.

19. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads.

20. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

21. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads and wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

22. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a volume percent of filler particles that increases as a force applied to the matrix increases and a resistance that decreases as the volume percent of filler particles increases.

23. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a resistance that decreases as a force applied to the matrix increases.

24. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a volume that decreases as a force applied to the matrix increases.

25. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein a force applied to one or more locations on the matrix causes decreased resistance of the matrix at the one or more locations.

26. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution.

27. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

28. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a volume percent of filler particles that increases as a force applied to the matrix increases and a resistance that decreases as the volume percent of filler particles increases.

29. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a resistance that decreases as a force applied to the matrix increases.

30. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a volume that decreases as a force applied to the matrix increases.

31. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance measuring circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance measuring circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein a force applied to one or more locations on the matrix causes decreased resistance of the matrix at the one or more locations.

32. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject; and

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer.

33. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads.

34. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

35. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer comprises an array of bonding pads and wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

36. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a volume percent of filler particles that increases as a force applied to the matrix increases and a resistance that decreases as the volume percent of filler particles increases.

37. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a resistance that decreases as a force applied to the matrix increases.

38. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the matrix has a volume that decreases as a force applied to the matrix increases.

39. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein a force applied to one or more locations on the matrix causes decreased resistance of the matrix at the one or more locations.

40. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer; and

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution.

41. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the array of electrodes of the circuitry phase layer comprises an array of bonding pads.

42. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a volume percent of filler particles that increases as a force applied to the matrix increases and a resistance that decreases as the volume percent of filler particles increases.

43. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a resistance that decreases as a force applied to the matrix increases.

44. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein the matrix has a volume that decreases as a force applied to the matrix increases.

45. An electrical pressure sensitive grid comprising:

a contacting phase layer comprising an insulating flexible matrix having a plurality of conductive filler particles loaded into the matrix and an array of electrodes coupled to the matrix, the contacting phase layer having a resistance distribution responsive to a contour profile of a contacting subject;

a circuitry phase layer comprising an array of electrodes and an array of resistance detecting circuits, the array of electrodes coupled to the matrix, the circuitry phase layer underneath the contacting phase layer to translate the resistance distribution of the contacting phase layer into a pressure contour distribution, and the array of resistance detecting circuits operatively coupled to the array of electrodes of the contacting phase layer and operatively coupled to the array of electrodes of the circuitry phase layer;

wherein the array of electrodes of the contacting phase layer further comprises an array of bonding pads having a resolution sufficient to permit the accurate rendering of the contour profile as the resistance distribution; and

wherein a force applied to one or more locations on the matrix causes decreased resistance of the matrix at the one or more locations.