Application and manufacturing method for a ceramic to metal seal

• US 6,521,350 B2
• Filed: 10/06/2001
• Issued: 02/18/2003
• Est. Priority Date: 06/18/2001
• Status: Active Grant

• Current Assignee: Alfred E. Mann Foundation For Scientific Research
• Original Assignee: Alfred E. Mann Foundation For Scientific Research
• Inventors: Jiang, Guangqiang, Fey, Kate E.
• Primary Examiner(s): Kelly, Cynthia H.
• Assistant Examiner(s): AMAKWE, TAMRA L
• Application Number:
  US09/972,280
• Publication Number:
  US 20020192481A1
• Time in Patent Office: 500 Days
• Field of Search: 428/472, 428/336, 428/629, 228/122, 228/122.1, 228/124.1, 228/124.5, 228/124.6
• US Class Current: 428/472
• CPC Class Codes: B23K 2103/14 Titanium or alloys thereof
• CPC Class Codes: B23K 2103/18 Dissimilar materials
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: B32B 2311/18 Titanium
• CPC Class Codes: C04B 2235/3206 Magnesium oxides or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3208 Calcium oxide or oxide-forming salts thereof, e.g. lime
• CPC Class Codes: C04B 2235/3225 Yttrium oxide or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3229 Cerium oxides or oxide-forming salts thereof
• CPC Class Codes: C04B 2237/123 based on iron group metals, e.g. steel
• CPC Class Codes: C04B 2237/343 Alumina or aluminates
• CPC Class Codes: C04B 2237/346 Titania or titanates
• CPC Class Codes: C04B 2237/348 Zirconia, hafnia, zirconates or hafnates
• CPC Class Codes: C04B 2237/403 Refractory metals
• CPC Class Codes: C04B 2237/60 Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface
• CPC Class Codes: C04B 2237/708 of one or more of the interlayers
• CPC Class Codes: C04B 37/026 consisting of metals or metal salts
• CPC Class Codes: Y10T 428/1259 Oxide
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the metal interlayer material, but that is less than the melting point of either the interlayer material, the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a homogeneous and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.

Claims

1. A component assembly for use in living tissue comprising:

a ceramic part;

a metal part; and

a pure nickel interlayer for bonding said ceramic part to said metal part.

2. The component assembly of claim 1 wherein

said ceramic part is selected from the group consisting of alumina, titania, zirconia, stabilized-zirconia, partially-stabilized zirconia, tetragonal zirconia, magnesia-stabilized zirconia, ceria-stabilized zirconia, yttria-stabilized zirconia, calcia-stabilized zirconia, and yttria-stabilized zirconia.

3. The component assembly of claim 1 wherein

said metal part is selected from the group consisting of titanium and titanium alloys.

4. The component assembly of claim 1 wherein

said interlayer material reacts with and forms a eutectic bond between said metal part and said ceramic part.

5. The component assembly of claim 1 wherein:

said pure interlayer having a thickness of approximately 0.001 inches or less; and

said component assembly is heated to a temperature that is less than the melting point of said metal part or of said pure nickel interlayer, but that is greater than the eutectic melting point, thereby forming a bond.

6. The component assembly of claim 1 wherein

said pure interlayer material is a thin coating of essentially pure nickel that is applied to the surfaces that are to be bonded of either said metal part or said ceramic part, by a chemical process selected from the group consisting of electroless plating and electroplating.

7. The component assembly of claim 1 wherein

said pure interlayer material is a thin coating of essentially pure nickel that is applied to the surfaces that are to be bonded of either said metal part or said ceramic part, by a thermal process selected from the group consisting of sputtering, evaporating, and ion beam enhanced deposition.

8. The component assembly of claim 1 wherein

said essentially pure interlayer material is a thin coating of essentially pure nickel that is applied to the surfaces that are to be bonded of either said metal part or said ceramic part, selected from the group consisting of metallic beads and metallic powder.