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Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus

  • US 6,521,511 B1
  • Filed: 02/26/1999
  • Issued: 02/18/2003
  • Est. Priority Date: 07/03/1997
  • Status: Expired due to Term
First Claim
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1. A device transfer method comprising:

  • a first step of forming a first separation layer on a substrate;

    a second step of forming an object-of-transfer layer containing the device on said first separation layer;

    a third step of forming a second separation layer on said object-of-transfer layer;

    a fourth step of attaching a primary destination-of-transfer part to said second separation layer;

    a fifth step of irradiating said first separation layer with light to cause exfoliation in an inner-layer and/or interface of said first separation layer, and then removing said substrate from said object-of-transfer layer while retaining said first separation layer on said object-of-transfer layer using said first separation layer as a boundary;

    a sixth step of removing said first separation layer from said said object-of-transfer layer;

    a seventh step of attaching a secondary destination-of-transfer part to the bottom of said object-of-transfer layer; and

    an eighth step of removing said primary destination-of-transfer part and said second separation layer from said object-of-transfer layer using said second separation layer as a boundary, whereby said object-of-transfer layer containing said device is transferred to said secondary destination-of-transfer part.

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