Silicon-based sensor system

• US 6,522,762 B1
• Filed: 05/12/2000
• Issued: 02/18/2003
• Est. Priority Date: 09/07/1999
• Status: Expired due to Term

• Current Assignee: TDK Corporation
• Original Assignee: Microtronic A/S
• Inventors: Kuhmann, Jochen F., Scheel, Peter, Mullenborn, Matthias
• Primary Examiner(s): Kuntz, Curtis
• Assistant Examiner(s): Ni, Suhan
• Application Number:
  US09/570,434
• Time in Patent Office: 1,012 Days
• Field of Search: 381/174, 381/175, 381/182, 381/191, 381/361, 381/190, 367/181, 367/174, 737/15, 737/16, 731/78, 361/283.3, 361/283.4
• US Class Current: 381/174
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 25/00 Deaf-aid sets , i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception electrical stimulation of auditory nerves to promote the auditory function A61N1/36038; optical stimulation of auditory nerves to promote the auditory function A61N5/0622

Abstract

The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.

Claims

1. A sensor system comprising

a carrier member having a first surface, said first surface holding a first and a second group of contact elements,

a transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the first group so as to obtain electrical contact between the transducer element and the carrier member, and

an electronic device comprising an integrated circuit and at least one contact element, said at least one contact element being aligned with one of the contact elements of the second group so as to obtain electrical contact between the electronic device and the carrier member,

wherein at least one of the contact elements of the first group is electrically connected to at least one of the contact elements of the second group so as to obtain electrical contact between the transducer element and the electronic device;

wherein said transducer element is connected to said carrier member by a conducting sealing ring.

2. A sensor system according to claim 1, wherein the carrier member further comprises a second surface, said second surface holding a plurality of contact elements, wherein at least one of the contact elements of the first or second group is electrically connected to one of the contact elements being held by the second surface.

3. A sensor system according to claim 2, wherein the first and second surfaces are substantially parallel and opposite each other.

4. A sensor system according to claim 1, wherein the carrier member is a Si-based carrier member.

5. A sensor system according to claim 1, wherein the carrier member further comprises an indentation, said indentation being aligned with the active member of the transducer element.

6. A sensor system according to claim 1, wherein the transducer element further comprises a cavity, the active member defining the bottom of said cavity.

7. A sensor system according to claim 5, further comprising an opening between the second surface of the carrier member and the indentation.

8. A sensor system according to claim 1, wherein the transducer element is Si-based.

9. A sensor system according to claim 1, wherein the carrier member, the transducer element, and the electronic device are Si-based.

10. A sensor system according to claim 1, wherein the active member of the transducer element comprises a capacitor, said capacitor being formed by a flexible diaphragm and a substantially stiff back plate, said flexible diaphragm and said substantially stiff back plate being electrically connected to contact elements of the transducer element.

11. A sensor system according to claim 1, wherein the integrated circuit is electrically connected to at least one contact element of the electronic device.

12. A sensor system according to claim 6, wherein the transducer element further comprises a lid, the lid and the active member of the transducer element defining an upper and a lower boundary of the cavity.

13. A sensor system according to claim 1, wherein at least part of an outer surface of the sensor system holds a conductive layer.

14. A sensor system according to claim 13, wherein the conductive layer comprises a metal layer.

15. A sensor system according to claim 13, wherein the conductive layer comprises a conductive polymer layer.

16. A sensor system according to claim 1, wherein the contact elements comprise a solder material, including at least one of Sn, SnAg, SnAu or SnPb.

17. A sensor system according to claim 6, wherein said conducting sealing ring hermetically seals the transducer element.

18. A sensor system comprising

a carrier member having a first surface, said first surface holding a first, a second and a third group of contact elements,

a first transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the first group so as to obtain electrical contact between the first transducer element and the carrier member,

a second transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the second group so as to obtain electrical contact between the second transducer element and the carrier member, and

an electronic device comprising an integrated circuit and at least one contact element, said at least one contact element being aligned with one of the contact elements of the third group so as to obtain electrical contact between the electronic device and the carrier member,

wherein at least one of the contact elements of the first group is electrically connected to at least one of the contact elements of the third group, and wherein at least one of the contact elements of the second is electrically connected to at least one of the contact elements of the third group so as to obtain electrical contact between the first transducer element and the electronic device and between the second transducer element and the electronic device.

19. A sensor system according to claim 18, wherein the carrier member further comprises a second surface, said second surface holding a plurality of contact elements, wherein at least one of the contact elements of the first, second or third group is electrically connected to one of the contact elements being held by the second surface.

20. A sensor system according to claim 19, wherein the first and second surfaces are substantially parallel and opposite each other.

21. A sensor system according to claim 18, wherein the carrier member is a Si-based carrier member.

22. A sensor system according to claim 18, wherein the carrier member further comprises a first and second indentation, the first indentation being aligned with the active member of the first transducer element, the second indentation being aligned with the active member of the second transducer element.

23. A sensor system according to claim 18, wherein each of the first and second transducer elements further comprises a cavity, the bottom of said cavities being defined by the active members of the first and second transducer elements.

24. A sensor system according to 18, wherein the first and second transducer elements are Si-based.

25. A sensor system according to 18, wherein the carrier member, the first and second transducer elements, and the electronic device are Si-based.

26. A sensor system according to 18, wherein each of the active members of the first and second transducer elements comprises a capacitor, said capacitor being formed by a flexible diaphragm and a substantially stiff back plate, said flexible diaphragm and said substantially stiff back plate being electrically connected to contact elements of the respective transducer elements.

27. A sensor system according to claim 18, wherein the integrated circuit is electrically connected to at least one contact element of the electronic device.

28. A sensor system according to claim 18, wherein each of the first and second transducer elements further comprises a lid, wherein the lids and the active members of the first and second transducer elements define an upper and a lower boundary of the respective cavities.

29. A sensor system according to claim 18, wherein at least part of an outer surface of the sensor system holds a conductive layer.

30. A sensor system according to claim 29, wherein the conductive layer comprises a metal layer.

31. A sensor system according to claim 29, wherein the conductive layer comprises a conductive polymer layer.

32. A sensor system according to claim 18, wherein the contact elements comprise a solder material, including at least one of Sn, SnAg, SnAu or SnPb.