Arrangement consisting of a photodiode and an optical fiber

• US 6,524,017 B2
• Filed: 04/24/2001
• Issued: 02/25/2003
• Est. Priority Date: 05/09/2000
• Status: Expired due to Term

• Current Assignee: Lumentum Optics Inc. (Lumentum Holdings Inc.)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Lecocq, Vincent, Tournereau, Alain
• Primary Examiner(s): Sanghavi, Hemang
• Assistant Examiner(s): Knauss, Scott A
• Application Number:
  US09/840,051
• Publication Number:
  US 20010041033A1
• Time in Patent Office: 672 Days
• Field of Search: 385/88-94, 385/49, 359/152, 257/431, 257/432, 257/433, 257/434
• US Class Current: 385/88
• CPC Class Codes: G02B 6/3628 for mounting fibres to supporting carriers G02B6/3608, G02B6/3616 take precedence
• CPC Class Codes: G02B 6/4212 the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material

Abstract

In the arrangement according to the invention, a photodiode (PD) mounted on a submount (SM) and contacted by contact wires (GW) has its photosensitive surface (PS) attached directly to one fiber end by means of an optically transparent adhesive (CG). The fiber (OF) is fastened on a circuit board (BD) to which the contact wires (GW) of the photodiode (PD) are connected. The adhesive joint (CG) between photodiode (PD) and fiber (OF) represents the only mechanical attachment of the photodiode (PD).

Claims

1. An arrangement comprising a photodiode and an optical fiber wherein the photodiode is mounted on a submount and contacted by at least one contact wire and has its photosensitive surface attached directly to one end of the optical fiber by an optically transparent adhesive, wherein the fiber is fastened on a circuit board, and wherein the at least one contact wire of the photodiode is connected to the circuit board, with the adhesive joint between the fiber and the photodiode representing the only mechanical attachment to the photodiode and the submount, and wherein the photodiode and the submount are not mechanically fixed to the circuit board.

2. An arrangement as claimed in claim 1 wherein a pad is arranged between the circuit board and the submount.

3. An arrangement as claimed in claim 2 wherein the pad is made of silicone.

4. A circuit board having an optical fiber fastened thereon, to the end of which the photosensitive surface of a photodiode mounted on a submount and contacted by at least one contact wire is directly attached by an optically transparent adhesive, the circuit board being fitted with semiconductor components which form a control circuit for the photodiode, the at least one contact wire of the photodiode being connected to the circuit board, and the adhesive joint between the fiber and the photodiode representing the only mechanical attachment to the photodiode and the submount which are not mechanically fixed to the circuit board.

5. An arrangement as claimed in claim 4 wherein a pad is arranged between the circuit board and the submount.

6. An arrangement as claimed in claim 5 wherein the pad is made of silicone.

7. A method of coupling an optical fiber to a photodiode, comprising the steps of mounting the photodiode on a submount, contacting the photodiode by means of at least one contact wire, and attaching the photosensitive surface of the photodiode to one end of the optical fiber using an optically transparent adhesive, wherein the fiber and the photodiode are aligned on a three-axis micrometric translation stage and are held in place until the adhesive has set.