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Semiconductor device having chip scale package

  • US 6,525,412 B2
  • Filed: 11/30/2001
  • Issued: 02/25/2003
  • Est. Priority Date: 11/30/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a semiconductor chip including a pad disposed on a square first surface;

    a circuit board including upper surface contacting the first surface of said semiconductor chip, including a first opening arranged below the pad, and including a wire arranged on a lower surface and electrically connected to the pad;

    a first resin arranged on the first opening and coating the pad; and

    a second resin disposed on the upper surface of said circuit board, and including an upper surface at a height substantially equal to a height of a second surface of said semiconductor chip at a point apart from a corner of the square first surface of said semiconductor chip.

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