Semiconductor device having chip scale package
First Claim
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1. A semiconductor device comprising:
- a semiconductor chip including a pad disposed on a square first surface;
a circuit board including upper surface contacting the first surface of said semiconductor chip, including a first opening arranged below the pad, and including a wire arranged on a lower surface and electrically connected to the pad;
a first resin arranged on the first opening and coating the pad; and
a second resin disposed on the upper surface of said circuit board, and including an upper surface at a height substantially equal to a height of a second surface of said semiconductor chip at a point apart from a corner of the square first surface of said semiconductor chip.
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Abstract
A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is electrically connected to a wire of the circuit board. The pad is sealed with a first resin. A second resin is disposed on the upper surface of the circuit board. A second resin includes an upper surface at a height substantially equal to a height of a second surface of the semiconductor chip at a point apart from a corner of a square of the first surface of the semiconductor chip.
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Citations
15 Claims
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1. A semiconductor device comprising:
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a semiconductor chip including a pad disposed on a square first surface;
a circuit board including upper surface contacting the first surface of said semiconductor chip, including a first opening arranged below the pad, and including a wire arranged on a lower surface and electrically connected to the pad;
a first resin arranged on the first opening and coating the pad; and
a second resin disposed on the upper surface of said circuit board, and including an upper surface at a height substantially equal to a height of a second surface of said semiconductor chip at a point apart from a corner of the square first surface of said semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification