Piezoelectric/electrostrictive device

• US 6,525,448 B1
• Filed: 09/14/2000
• Issued: 02/25/2003
• Est. Priority Date: 10/01/1999
• Status: Expired due to Fees

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Takeuchi, Yukihisa, Shibata, Kazuyoshi
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US09/661,881
• Time in Patent Office: 894 Days
• Field of Search: 310/321, 310/328, 310/330, 310/331
• US Class Current: 310/328
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/2043 connected at their free ends, e.g. parallelogram type

Abstract

A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections and a fixation section for supporting the thin plate sections. The thin plate and fixation sections are formed from ceramics in an integrated manner. An object is attached between forward end portions of the pair of thin plate sections. Piezoelectric/electrostrictive elements are arranged on respective side surfaces of the pair of thin plate sections. An areal size of a surface of the object opposed to the thin plate sections is larger than an areal size of an object attachment surface of the thin plate sections.

Claims

1. A piezoelectric/electrostrictive device comprising:

a pair of mutually opposing thin plate sections having respective object attachment surfaces that face one another and a fixation section for supporting said thin plate sections, said thin plate sections and said fixation section being formed with ceramics in an integrated manner;

an object attached to said object attachment surfaces between forward end portions of said pair of thin plate sections; and

one or more piezoelectric/electrostrictive elements arranged on at least one thin plate section of said pair of thin plate sections, wherein;

an areal size of a surface of said object opposed to said thin plate sections is larger than an areal size of said object attachment surfaces of said thin plate sections.

2. The piezoelectric/electrostrictive device according to claim 1, wherein said piezoelectric/electrostrictive element has a film-shaped configuration, and is integrated with said thin plate section by means of sintering.

3. The piezoelectric/electrostrictive device according to claim 1, wherein said object is secured to said object attachment surface of said thin plate section by the aid of an adhesive.

4. The piezoelectric/electrostrictive device according to claim 3, wherein said adhesive is composed of an organic resin.

5. The piezoelectric/electrostrictive device according to claim 3, wherein said adhesive is composed of glass, braze, or solder.

6. The piezoelectric/electrostrictive device according to claim 1, wherein said respective object attachment surfaces lie in different planes that are parallel to one another, and an areal size of respective surfaces of said object opposed and attached to said thin plate sections is larger than an areal size of said respective object attachment surfaces of said thin plate sections.