Stacked light-mixing LED

• US 6,525,464 B1
• Filed: 09/08/2000
• Issued: 02/25/2003
• Est. Priority Date: 09/08/2000
• Status: Expired due to Term

• Current Assignee: Unity OPTO Technology Company Limited
• Original Assignee: Unity OPTO Technology Company Limited
• Inventors: Chin, Yuan-Cheng
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US09/657,574
• Time in Patent Office: 900 Days
• Field of Search: 313/499, 313/500, 313/502, 313/503, 313/512
• US Class Current: 313/499
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 25/0756 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A stacked light-mixing LED includes a main body, more than one connecting parts, a first chip, and a second chip. Two lights with different wavelength in the visible light spectrum area, such as the yellow light and the blue light, or the green light and the red light, are respectively excited and emitted from the first chip and the second chip. By controlling electrical current and voltage, the two lights respectively excited from the first chip and the second chip can be symmetrically mixed into another wavelength of light in the visible light spectrum area, such white light.

Claims

1. A stacked light-mixing LED comprising:

a main body which is transparent and has a fixed shape;

more than one electrically conductive connecting part extending outwardly from the main body to connect the main body with an electrical power source,

wherein said main body includes an adapted portion adapted to receive a first chip and a second chip, said first and second chips being arranged to be excited to emit lights,

wherein the first chip is stacked on the second chip and opposite extrinsic semiconductor layers of the first and second chips are adjacent each other, and

wherein the first chip and the second chip are stuck together by conductive paste.

2. The stacked light-mixing LED of claim 1 wherein the connecting parts are two supporting parts, and one of the two supporting parts has an indent which forms said adapted portion.

3. The stacked light-mixing LED of claim 1 wherein the first chip is a transparent InGaN chip.

4. The stacked light-mixing LED of claim 1 wherein the first chip comprises different type semiconductors.

5. The stacked light-mixing LED of claim 1 wherein the second chip comprises InGaN on a sapphire substrate.

6. The stacked light-mixing LED of claim 1 wherein the second chip comprises InGaN on an SiC substrate.

7. The stacked light-mixing LED of claim 1 wherein the second chip comprise different type semiconductors.

8. The stacked light-mixing LED of claim 1 wherein the first chip comprises InGaN on a sapphire substrate.

9. The stacked light-mixing LED of claim 1 wherein the first chip comprises InGaN on an SiC substrate.

10. The stacked light-mixing LED of claim 1 wherein the second chip is larger than the first chip and the first chip is stacked on one side of the second chip.

11. The stacked light-mixing LED of claim 1 wherein the size of the first chip and the size of the second chip are almost the same.

12. The stacked light-mixing LED of claim 1 wherein the second chip is a transparent InGaN chip.

13. A stacked light-mixing LED comprising:

a first chip and a second chip connected to an electrical power source and arranged to be excited to emit lights of different wavelength;

wherein the first chip is stacked on the second chip and opposite extrinsic semiconductor layers of the first and second chips are adjacent each other,

and wherein the first chip and the second chip are stuck together by conductive paste.

14. The stacked light-mixing LED of claim 13 wherein the first chip is a transparent InGaN chip.

15. The stacked light-mixing LED of claim 13 wherein the first chip comprises different type semiconductors.

16. The stacked light-mixing LED of claim 13 wherein the second chip comprises InGaN on a sapphire substrate.

17. The stacked light-mixing LED of claim 13 wherein the second chip comprises InGaN on an SiC substrate.