Cooling system for a module IC handler

• US 6,525,527 B1
• Filed: 11/16/2000
• Issued: 02/25/2003
• Est. Priority Date: 11/19/1999
• Status: Expired due to Fees

• Current Assignee: Mirae Corporation
• Original Assignee: Mirae Corporation
• Inventors: Park, Chan Ho, An, Tae Sung, Seong, Eun Hyoung
• Primary Examiner(s): Oda, Christine
• Assistant Examiner(s): LEROUX, ETIENNE PIERRE
• Application Number:
  US09/713,028
• Time in Patent Office: 831 Days
• Field of Search: 324/158.1, 165/80.3, 165/80.4, 165/908, 257/714, 257/722, 361/698, 361/699, 361/702, 361/704, 361/691, 361/692, 361/693, 361/694
• US Class Current: 324/750.08
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 1/44 Modifications of instruments for temperature compensation

Abstract

A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and having one or more coupling portions, a plurality of plates provided at one side of the air jet body, and a cover provided at the other side of the air jet body. Since the cooling system rapidly cools the heated module IC, the number of module ICs that fail can be reduced, thus resulting in an improvement in the reliability of the products.

Claims

1. A cooling system for cooling an electronic component, comprising:

an air jet body;

a first plate positioned adjacent to the air jet body so as to form a first air gap therebetween through which air is supplied to cool an electronic component; and

a cover disposed on a side of the air jet body and first plate opposite to a side on which the first air gap is formed, the cover including at least one opening through which air is supplied to the first air gap.

2. The cooling system of claim 1, further comprising:

a source of air in communication with the at least one opening.

3. The cooling system of claim 1, further comprising:

an air supply pipe in communication with the at least one opening, wherein the air supply pipe is in communication with a source of air.

4. The cooling system of claim 3, further comprising:

a vaporizer connected to the air supply pipe;

a refrigerant supply line coupled to the vaporizer and to a source of refrigerant;

a solenoid valve connected to the refrigerant supply line and configured to control a flow of refrigerant through the refrigerant supply line; and

a controller for controlling the solenoid valve.

5. The cooling system of claim 4, further comprising a sensor disposed adjacent to a test socket in which an electronic component is disposed for testing, wherein the sensor is configured to sense a change in temperature of the electronic component and to provide a temperature signal to the controller.

6. The cooling system of claim 1, further comprising:

a base plate to which the air jet is connected.

7. The cooling system of claim 6, wherein the air jet is connected to the base plate via coupling portions provided on the air jet body.

8. The cooling system of claim 1, wherein the air jet body and the first plate extend substantially parallel to one another.

9. The cooling system of claim 8, further comprising a second plate disposed adjacent to the first plate so as to form a second air gap therebetween, through which air is supplied to cool an electronic component, wherein the first plate and second plate extend substantially parallel to one another.

10. The cooling system of claim 9, wherein the first plate includes a groove for receiving therein an end of an electronic component such that air expelled through the first air gap flows along one side of the electronic component and air expelled through the second air gap flows along another side of the electronic component.

11. An air jet for cooling an electronic component, comprising:

an air jet body;

a first plate positioned adjacent to the air jet body so as to form a gap therebetween through which air is supplied to cool an electronic component;

a second plate disposed adjacent to the first plate so as to form a gap therebetween through which air is supplied to cool an electronic component; and

a cover disposed on a side of the air jet body, the first plate and the second plate, opposite to a side on which the air gaps are formed, the cover including an opening through which air is supplied.

12. The air jet of claim 11, wherein the air jet body, the first plate and the second plate all extend substantially-parallel to one another.

13. A cooling system for an electronic component, comprising:

an air supply pipe branched to form at least two branch air supply pipes; and

a fixing plate configured to support each of said at least two branch air supply pipes and having a groove disposed therein configured to receive an electronic component such that air expelled from one of said branch air supply pipes flows along one side of the electronic component and air expelled from another of said branch air supply pipes flows along another side of said electronic component.

14. The cooling system of claim 13, further comprising:

a vaporizer connected to the air supply pipe;

a refrigerant supply line coupled to the vaporizer;

a solenoid valve connected to the refrigerant supply line and configured to control a flow of refrigerant through the refrigerant supply line; and

a controller for controlling the solenoid valve.

15. The cooling system of claim 14, further comprising a sensor disposed adjacent to a test socket in which an electronic component is disposed for testing, wherein the sensor is configured to sense a change in temperature of the electronic component and to send a temperature signal to the controller.