Integrated mirror array and circuit device

• US 6,525,864 B1
• Filed: 01/25/2001
• Issued: 02/25/2003
• Est. Priority Date: 07/20/2000
• Status: Expired due to Fees

• Current Assignee: Nayna Networks, Inc.
• Original Assignee: Nayna Networks, Inc.
• Inventors: Gee, Dale A., Nayak, Anup K., Yang, Xiao
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): O'NEILL, GARY WILLIAM
• Application Number:
  US09/770,527
• Time in Patent Office: 761 Days
• Field of Search: 359/290, 359/291, 359/293, 359/295, 359/224, 359/298, 310/36, 310/90, 348/770, 348/771, 348/772
• US Class Current: 359/291
• CPC Class Codes: B81B 7/04 Networks or arrays of similar microstructural devices
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/3556 NxM switch, i.e. regular arrays of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/359 of the position of the moving element itself during switching, i.e. without monitoring the switched beams
• CPC Class Codes: H04Q 11/0005 Switch and router aspects
• CPC Class Codes: H04Q 2011/003 using switches based on microelectro-mechanical systems [MEMS]
• CPC Class Codes: H04Q 2011/0039 Electrical control

Abstract

An integrated circuit and mirror device. The device includes a first substrate comprising a plurality of electrode groups, wherein each of the groups comprises a plurality of electrodes. A mirror array is formed on a second substrate. Each of the mirrors on the array has a mirror surface being able to pivot about a point (e.g., fixed point, region) in space. Each of the mirrors has a backside surface operably coupled to one of the electrode groups. A bonding layer mechanically couples the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups. The device also has a drive circuitry coupled to each electrode groups. The drive circuitry is configured to apply a voltage to any one of the electrodes in each of the electrode groups. The drive circuitry is disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space.

Claims

1. An integrated circuit and mirror device, the device comprising:

a first substrate comprising a plurality of electrode groups, each of the groups comprising a plurality of electrodes;

a mirror array formed on a second substrate, each of the mirrors on the array having a mirror surface being able to pivot about a point in space, each of the mirrors having a backside surface operably coupled to one of the electrode groups;

a bonding layer mechanically coupling the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups;

a drive circuitry coupled to each electrode groups, the drive circuitry being configured to apply a voltage to any one of the electrodes in each of the electrode groups, the drive circuitry being disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space; and

an input/output circuit coupled to each of the electrodes.

2. The device of claim 1 wherein the mirror array comprises at least an eight by eight array of mirrors.

3. The device of claim 2 wherein the mirror array comprises at least a 100 by 100 array of mirrors.

6. The device of claim 1 wherein the bonding layer comprises a plurality of bumps, each of the bumps being spatially positioned between the first substrate and the second substrate to align each of the mirrors to its respective electrode group.

7. The device of claim 1 wherein a plurality of pads couple to the input/output circuit.

8. The device of claim 7 wherein each of the pads is attached to a pin using a process selected from wire bonding or tape bonding.

9. The device of claim 1 further comprising a packaging material holding the first substrate and the second substrate.

4. An integrated circuit and mirror device, the device comprising:

a first substrate comprising a plurality of electrode groups, each of the groups comprising a plurality of electrodes;

a mirror array formed on a second substrate, each of the mirrors on the array having a mirror surface being able to pivot about a point in space, each of the mirrors having a backside surface operably coupled to one of the electrode groups;

a bonding layer mechanically coupling the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups;

a drive circuitry coupled to each electrode groups, the drive circuitry being configured to apply a voltage to any one of the electrodes in each of the electrode groups, the drive circuitry being disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space; and

a sense circuit coupled to each of the electrodes.

20. The device of claim 4 wherein the mirror array comprises at least an eight by eight array of mirrors.

21. The device of claim 4 wherein the mirror array comprises at least a 100 by 100 array of mirrors.

22. The device of claim 4 further comprising a packaging material holding the first substrate and the second substrate.

5. An integrated circuit and mirror device, the device comprising:

a first substrate comprising a plurality of electrode groups, each of the groups comprising a plurality of electrodes;

a mirror array formed on a second substrate, each of the mirrors on the array having a mirror surface being able to pivot about a point in space, each of the mirrors having a backside surface operably coupled to one of the electrode groups;

a bonding layer mechanically coupling the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups;

a drive circuitry coupled to each electrode groups, the drive circuitry being configured to apply a voltage to any one of the electrodes in each of the electrode groups, the drive circuitry being disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space; and

a multiplexing circuit coupled to the drive circuitry.

23. The device of claim 5 wherein the mirror array comprises at least an eight by eight array of mirrors.

24. The device of claim 5 wherein the mirror array comprises at least a 100 by 100 array of mirrors.

25. The device of claim 5 further comprising a packaging material holding the first substrate and the second substrate.

10. An integrated circuit and mirror device, the device comprising:

a first substrate comprising a plurality of electrode groups, each of the groups comprising a plurality of electrodes;

a mirror array formed on a second substrate, each of the mirrors on the array having a mirror surface being able to pivot about a point in space, each of the mirrors having a backside surface operably coupled to one of the electrode groups;

a bonding layer mechanically coupling the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups;

a drive circuitry coupled to each electrode groups, the drive circuitry being configured to apply a voltage to any one of the electrodes in each of the electrode groups, the drive circuitry being disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space;

a sense circuit coupled between each of the electrodes and the drive circuitry;

an input/output circuit coupled to the drive circuitry; and

a plurality of pads coupled to the input/output circuit.

11. The device of claim 10 wherein each of the mirrors comprises a plurality of torsion bars to adjust a spatial orientation of the mirror to pivot the mirror about the point in space.

12. The device of claim 10 wherein the bonding layer comprises a dielectric layer disposed on the plurality of electrode groups.

13. The device of claim 10 wherein the bonding layer comprises a plurality of bumps, each of the bumps being spatially positioned between the first substrate and the second substrate to align each of the mirrors to its respective electrode group.

14. The device of claim 10 wherein the bonding layer is provided by a C4 process.

15. The device of claim 10 wherein the bonding layer is provided by flip chip bumps.

16. The device of claim 10 wherein the bonding layer is provided by a screen printing process.

17. The device of claim 10 wherein the bonding layer is provided by a eutectic layer.

18. The device of claim 10 wherein the bonding layer is provided by a process selected from a deposition process, an ink jet printing process, a photolithography process, or a plating process.

19. An integrated circuit and mirror device, the device comprising:

a first substrate comprising a plurality of active switching devices and an overlying layer comprising a plurality of electrode groups, each of the groups comprising a plurality of electrodes, the plurality of active switching devices including a transistor selected from at least a CMOS device, a bipolar device, a BiCMOS device, or an NMOS device;

a mirror array formed on a second substrate, each of the mirrors on the array having a mirror surface being able to pivot about a point in space, each of the mirrors having a backside surface operably coupled to one of the electrode groups;

a bonding layer mechanically coupling the first substrate to the second substrate, whereupon the backside surface of each mirror faces one of the electrode groups;

a drive circuitry coupled to each electrode groups, the drive circuitry being configured to apply a voltage to any one of the electrodes in each of the electrode groups, the drive circuitry being disposed in the first substrate and being adapted to pivot each of the mirror faces about the point in space;

a sense circuit coupled between each of the electrodes and the drive circuitry;

an input/output circuit coupled to the drive circuitry; and

a plurality of pads coupled to the input/output circuit.