Method of assembling a snap lid image sensor package

• US 6,526,653 B1
• Filed: 12/08/1999
• Issued: 03/04/2003
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven
• Primary Examiner(s): Hughes, S. Thomas
• Assistant Examiner(s): Cozart, Jermie E.
• Application Number:
  US09/457,515
• Time in Patent Office: 1,182 Days
• Field of Search: 294/53, 298/30, 298/31, 174/52.2, 174/52.3, 174/52.4
• US Class Current: 29/830
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49876 : by snap fit

Abstract

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Claims

1. A method comprising:

placing a window in a pocket of a molding;

aligning a snap lid with said molding; and

snapping said snap lid onto said molding to hold said window in place, wherein said snap lid comprises a compression ring section comprising a central aperture, a central region of said window being exposed to an ambient environment through said central aperture.

2. The method of claim 1 wherein said snapping said snap lid onto said molding secures said window in said pocket.

3. The method of claim 1 wherein said molding comprises a locking feature and wherein said snap lid comprises a snap, said aligning comprising aligning said snap to extend around said locking feature.

4. The method of claim 3 wherein said snapping comprises sliding said snap against said locking feature.

5. The method of claim 4 wherein said snap comprises a taper which slides against said locking feature.

6. The method of claim 4 wherein said sliding produces stress in said snap lid.

7. The method of claim 6 wherein said snap comprises a tab and said locking feature comprises a lip, said sliding comprising sliding said tab to said lip.

8. The method of claim 7 wherein said stress in said snap lid causes said tab to engage said lip.

9. The method of claim 1 further comprising removing said snap lid from said molding.

10. The method of claim 1 wherein said snapping comprises pressing said snap lid towards said molding.

11. The method of claim 1 wherein said molding further comprises a base, said method further comprising attaching said base to a substrate.

12. The method of claim 11 wherein said substrate comprises a first surface, said attaching comprising attaching said base to a periphery of said first surface with an adhesive layer.

13. The method of claim 12 further comprising attaching an image sensor to said first surface.

14. The method of claim 13 wherein radiation passes through said window and strikes an active area of said image sensor.

15. The method of claim 1 wherein said window is selected from the group consisting of optical glass, germanium, and silicon.

16. The method of claim 1 wherein said window comprises a filter.

17. The method of claim 1 wherein radiation passes through said central aperture, through said window, and strikes an active area of an image sensor.

18. The method of claim 1 wherein said pocket is defined by sides and a shelf of said molding, said sides of said molding being the same width as sides of said window.

19. The method of claim 18 wherein subsequent to said placing, said shelf contacts and supports a peripheral region of an interior surface of said window.

20. The method of claim 1 further comprising applying adhesive to adhere said window in said pocket.

21. The method of claim 1 wherein said pocket is defined by sides and a shelf of said molding, said sides of said molding being shorter than sides of said window.

22. A method comprising:

placing a window in a pocket of a molding, wherein said pocket is defined by sides and a shelf of said molding, said sides of said molding being the same width as sides of said window;

aligning a snap lid with said molding; and

snapping said snap lid onto said molding to hold said window in place,

wherein subsequent to said placing, said shelf contacts and supports a peripheral region of an interior surface of said window, and

wherein subsequent to said snapping, a compression ring section of said snap lid contacts and presses against a peripheral region of an exterior surface of said window.

23. A method comprising:

placing a window in a pocket of a molding, wherein said pocket is defined by sides and a shelf of said molding, said sides of said molding being shorter than sides of said window;

aligning a snap lid with said molding, wherein said snap lid comprises a compression ring section comprising a pocket, said pocket of said compression ring section being defined by sides and a shelf of said snap lid; and

snapping said snap lid onto said molding to hold said window in place.

24. The method of claim 23 wherein subsequent to said snapping, said shelf of said compression ring section presses against a peripheral region of an exterior surface of said window, and wherein said shelf of said molding presses against a peripheral region of an interior surface of said window.

25. A method comprising:

attaching an image sensor to a first surface of a substrate;

coupling bond pads of said image sensor to electrically conductive traces on said first surface of said substrate;

attaching a base of a molding to said first surface of said substrate;

placing a window in a pocket of said molding;

aligning a snap lid with said molding;

snapping said snap lid onto said molding to hold said window in place; and

using an alignment notch of said snap lid to align a lens to said image sensor.