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Method and apparatus for rejuvenating polishing slurry

  • US 6,527,969 B1
  • Filed: 04/19/2000
  • Issued: 03/04/2003
  • Est. Priority Date: 04/23/1999
  • Status: Expired due to Term
First Claim
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1. A method for rejuvenating a polishing slurry to be applied to a chemical-mechanical polishing apparatus for performing chemical-mechanical polishing of wafer, and to be applied to a rejuvenating apparatus, which recovers waste generated by the chemical-mechanical polishing apparatus, rejuvenates polishing slurry, and supplies the rejuvenated polishing slurry to the chemical-mechanical polishing apparatus, the method comprising the steps of:

  • a) separating a high-concentration waste, which contains contaminants at high concentrations discharged from the chemical-mechanical polishing apparatus during polishing, from a low-concentration waste, which contains contaminants at low concentrations discharged from the chemical-mechanical polishing apparatus during rinsing, b) neutralizing the low-concentration waste by a neutralizing agent, thereafter rinsing the rejuvenating apparatus using the neutralized low-concentration waste, c) recovering the polishing slurry from the high-concentration waste;

    d) re-dispersing abrasive grains contained in the polishing slurry recovered; and

    e) mixing the re-dispersed high-concentration waste with fresh polishing slurry, thereafter supplying to the chemical-mechanical polishing apparatus.

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