Infrared cutoff film
First Claim
1. An infrared cut-off film having an infrared cut-off layer which is formed on a film by using a coating composition obtained by mixing and dispersing a powder of indium tin oxide in a resin having transparency,wherein the powder of indium tin oxide has a minimum value of a diffused-reflection-functional logarithm, logf(Rd)), at a light wavelength of 470 nm or lower, which logarithm is measured on the basis of the following equation formulated for a diffused reflection light,
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Accused Products
Abstract
An infrared cut-off layer containing an ITO powder is formed on one surface of a base film, to form an infrared cut-off film. The ITO powder has a minimum value of a diffused-reflection-functional logarithm, logf(Rd), at a light wavelength of 470 nm or lower, which logarithm is measured on the basis of the following equation, f(Rd)=(1−Rd)2/2Rd=α/S (Rd: a relative reflectance to a standard sample, α: an absorption coefficient, S: a scattering coefficient, formulated for a diffused reflection light, and the minimum value of −0.1 or less. There is provided an infrared cut-off film having a hue of blue and sufficient transparency.
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7 Claims
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1. An infrared cut-off film having an infrared cut-off layer which is formed on a film by using a coating composition obtained by mixing and dispersing a powder of indium tin oxide in a resin having transparency,
wherein the powder of indium tin oxide has a minimum value of a diffused-reflection-functional logarithm, logf(Rd)), at a light wavelength of 470 nm or lower, which logarithm is measured on the basis of the following equation formulated for a diffused reflection light,
Specification