Integrated inorganic/organic complementary thin-film transistor circuit and a method for its production
First Claim
1. An integrated inorganic/organic complementary thin-film transistor circuit comprising:
- a first and a second transistor which are operatively connected and provided on a common substrate, wherein the first transistor is an inorganic thin-film transistor, and wherein the complementary thin-film transistor circuit forms a multilayer thin-film structure, wherein the inorganic thin-film transistor is an n-channel transistor and the organic thin-film transistor is a p-channel transistor, or vice versa, the organic active transistor material in each case being respectively a p-channel organic semiconductor material or an n-channel organic semiconductor material, separate gate electrodes are provided for each of the transistors, the organic active semicondutor in an organic p-channel transistor in each case is provided electrically isolated from the inorganic n-channel transistor, and the organic active semiconductor in an organic n-channel transistor optionally is provided electrically isolated from the inorganic p-channel transistor.
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Accused Products
Abstract
An integrated organic/inorganic complementary thin-film transistor circuit comprises a first and a second transistor which are operatively connected on a common substrate, wherein the first transistor is an inorganic thin-film transistor and the second an organic thin-film transistor. The inorganic thin-film transistor is an n-channel transistor and the organic thin-film transistor is a p-channel transistor or vice versa. Each of the transistors has a separate gate electrode and the organic active semiconductor material is in the case of a p-channel semiconductor in the organic thin-film transistor electrically isolated from the inorganic thin-film transistor. In a first method for fabricating a transistor circuit of this kind separate gate electrodes are deposited for each transistor on a common substrate, the material for the source and the drain electrode of the organic thin-film transistor are deposited on the same layer level in the thin-film structure of the organic thin-film transistor and in each case the organic active semiconductor material in an organic p-channel transistor is provided electrically isolated from the inorganic n-channel transistor, and the organic active semiconductor material in an organic n-channel transistor optionally electrically isolated from the inorganic p-channel transistor.
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Citations
16 Claims
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1. An integrated inorganic/organic complementary thin-film transistor circuit comprising:
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a first and a second transistor which are operatively connected and provided on a common substrate, wherein the first transistor is an inorganic thin-film transistor, and wherein the complementary thin-film transistor circuit forms a multilayer thin-film structure, wherein the inorganic thin-film transistor is an n-channel transistor and the organic thin-film transistor is a p-channel transistor, or vice versa, the organic active transistor material in each case being respectively a p-channel organic semiconductor material or an n-channel organic semiconductor material, separate gate electrodes are provided for each of the transistors, the organic active semicondutor in an organic p-channel transistor in each case is provided electrically isolated from the inorganic n-channel transistor, and the organic active semiconductor in an organic n-channel transistor optionally is provided electrically isolated from the inorganic p-channel transistor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating an integrated inorganic/organic complementary thin-film transistor circuit comprising a first and a second transistor which are operatively connected and provided on a common substrate, wherein the first transistor is an inorganic thin-film transistor and the second transistor a organic thin-film transistor, and wherein the complementary thin-film transistor circuit forms a multilayer thin-film structure with successively deposited and patterned thin-film layers, the method comprising:
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forming the inorganic thin-film transistor as an n-channel transistor and the organic thin-film transistor as a p-channel transistor by depositing respectively an n-channel inorganic active semiconductor material and a p-channel organic active semiconductor material or correspondingly forming the organic thin-film transistor as an n-channel transistor and the inorganic thin-film transistor as a p-channel transistor by depositing respectively an n-channel organic active semiconductor material and a p-channel inorganic active semiconductor material;
depositing separate gate electrodes for respectively the first and the second transistor on a common substrate;
depositing material for the source electrode and the drain electrode of the organic thin-film transistor on the same level in the thin-film structure of the organic thin-film transistor and in each case providing the organic active semiconductor material in an organic p-channel transistor electrically isolated from the inorganic n-channel transistor; and
optionally providing the organic active semiconductive material in an organic n-channel transistor electrically isolated from the inorganic p-channel transistor.
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11. A method for fabricating an inorganic/organic complementary thin-film transistor circuit comprising a first and a second transistor which are operatively connected and provided on a common substrate, wherein the first transistor is an inorganic thin-film transistor and the second transistor an organic thin-film transistor, wherein the complementary thin-film transistor circuit forms a multilayer thin-film structure with successively deposited and patterned thin-film layers, and wherein the method comprises;
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depositing separate gate electrodes of a first metal for each of the two transistors on a common substrate;
depositing separate inorganic isolators of silicon nitride (SiNx) over each gate electrode;
depositing an inorganic active semiconductor in the form of hydrogenated amorphous silicon (a-Si;
H) above one of the gate electrodes which thus forms the gate electrode of the first transistor, depositing and patterning an n+ doped layer of either hydrogenated amorphous silicon (n+a-Si;
H) or hydrogenated microcrystalline silicon (n+ μ
c-Si;
H) or hydrogenated polycrystalline silicon (n+pc-Si;
H) as source and drain contacts for the first transistor;
depositing and patterning the source and drain electrodes of the first transistor in form of a second metal over the source and drain contacts thereof;
depositing and patterning the source and drain electrodes for the second transistor in the form of a third metal in the same layer level in the thin-film structure; and
forming an isolating double layer over the whole organic thin-film transistor and patterning this such that the source and drain electrodes and the gate isolator in the second transistor become exposed, whereafter a layer of pentacene is deposited above the isolating double layer and the exposed portion of the second transistor, the pentacene layer in the exposed portion forming the active semiconductor material of the organic thin-film transistor and being provided electrically isolated against the additional pentacene layer broken by a re-entrant edge of the profile of the isolating double layer. - View Dependent Claims (12, 13, 14, 15, 16)
isolating the active semiconductor in the form of pentacene in the organic thin-film transistor by a re-entrant profile of a broken double layer of polymethylmetacrylate (PMMA) and Novolac photoresist.
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15. A method according to claim 11, further comprising:
evaporating gold thermally for forming the source and drain electrodes of the organic thin-film transistor.
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16. A method according to claim 11, further comprising:
removing the pentacene layer which has been deposited over the isolating double layer.
Specification