Test structures and methods for inspection of semiconductor integrated circuits

• US 6,528,818 B1
• Filed: 08/25/2000
• Issued: 03/04/2003
• Est. Priority Date: 12/14/1999
• Status: Expired due to Term

• Current Assignee: Kla-Temcor
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: Walker, David J., Weiner, Kurt H., Pinto, Gustavo A., Mantalas, Lynda C., Long, Robert Thomas, Satya, Akella V. S., Adler, David L., Richardson, Neil
• Primary Examiner(s): Cao, Phat X.
• Application Number:
  US09/648,380
• Time in Patent Office: 921 Days
• Field of Search: 257/48, 257/758, 324/751
• US Class Current: 257/48
• CPC Class Codes: G01N 21/66 electrically excited, e.g. electroluminescence
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/307 of integrated circuits
• CPC Class Codes: H01J 2237/2817 Pattern inspection
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633

Abstract

Disclosed is a semiconductor die having a scanning area. The semiconductor die includes a first plurality of test structures wherein each of the test structures in the first plurality of test structures is located entirely within the scanning area. The semiconductor die further includes a second plurality of test structures wherein each of the test structures in the first plurality of test structures is located only partially within the scanning area. The test structures are arranged so that a scan of the scanning area results in detection of defects outside of the scanning area.

Claims

1. A method of forming a semiconductor die having a scanning area, the method comprising:

forming a first plurality of test structures entirely within the scanning area;

forming a second plurality of test structures partially within the scanning area; and

scanning the scanning area with an electron beam to detect defects outside of the scanning area.

2. The method of claim 1, wherein the first plurality of test structures comprises test structures that are electrically isolated and others that are not.

3. The method of claim 1 wherein the second plurality of test structures comprises test structures that are electrically isolated and others that are not.

4. The method of claim 1 the first plurality of test structures comprises test structures that are electrically isolated and others that are not and the second plurality of test structures comprises test structures that are electrically isolated and others that are not.

5. The method of claim 1 wherein the second plurality of test structures comprises test structures that are primarily located outside the scanning area.

6. A method as recited in claim 5 wherein the second plurality of test structures are arranged such that a short associated with a portion of the second plurality of test structures that is located outside the scanning area is detectable by performing voltage contrast on a portion of the second plurality of test structures that is located within the scanning area.

7. The method of claim 1 further comprising forming product circuitry on the semiconductor die outside of the primary scan area.

8. The method of claim 1 wherein the scanning area is located in the middle of semiconductor die.

9. The method of claim 1, further comprising forming a wafer from the plurality semiconductor dies.

10. A method as recited in claim 1, wherein at least two of the scanning areas from two of the semiconductor dies are aligned along their longitudinal axis.

11. The method of claim 1, wherein the semiconductor die has a plurality of scanning areas.

12. The method of claim 1, wherein the second plurality of test structures form a rectangular shape and the scanning areas are arranged to optimize an aspect ratio of the second plurality of test structures of each scanning area.

13. The method of claim 1, wherein the scanning areas are arranged in a checkerboard pattern.

14. The method of claim 1, wherein the first plurality of test structures include a mix of test structure types.

15. The method of claim 11 wherein the first plurality of test structures include a first type of test structure and a second type of test structure, the first type differing from the second type, and the first and second test structures are selected from a group consisting of a via chain test structure, a chemical mechanical polishing (CMP) test structure, a contact array test structure, a test structure for measuring misalignment, and a CMP dummy metal filler test structure.

16. The method of claim 15, wherein the CMP test structure is arranged for measurement of a CMP parameter selected from a group consisting of a pitch value, a density value, and a horizontal aspect ratio value.

17. The method of claim 1, wherein the first plurality of test structures form a contiguous single structure that is coupled to a predefined voltage potential and the second plurality of test structures form a plurality of separate lines interleaved between portions of the first test structures.

18. The method of claim 17, wherein the first test structures form a serpentine shaped structure and includes one or more contacts that are coupled to the predefined voltage potential.

19. The method of claim 18, wherein the one or more contacts are located within the middle of the first test structures and is coupled to a ground potential, the second test structures being designed to be floating.