Chip size image sensor bumped package

• US 6,528,857 B1
• Filed: 11/13/2000
• Issued: 03/04/2003
• Est. Priority Date: 11/13/2000
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Liebhard, Markus K., Glenn, Thomas P.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Forde, Remmon R.
• Application Number:
  US09/712,313
• Time in Patent Office: 841 Days
• Field of Search: 257/432, 257/433, 257/434, 257/789, 438/116, 361/783
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED

Abstract

An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. Interior traces are formed on a lower surface of a step up ring. Electrically conductive bumps are formed between the interior traces on the lower surface of the step up ring and the bond pads on the upper surface of the image sensor thus flip chip mounting the step up ring to the image sensor. Electrically conductive vias extend through the step up ring to electrically connect the interior traces to exterior traces formed on an upper surface of the step up ring.

Claims

1. An assembly comprising:

a sensor device having a first surface, said sensor device comprising;

an active area on said first surface; and

a bond pad on said first surface,

a step up ring;

an electrically conductive first trace on a first surface of said step up ring;

an electrically conductive bump between said bond pad and said first trace, said step up ring being mounted to said sensor device by said bump; and

an electrically conductive second trace on a second surface of said step up ring, said second trace being electrically connected to said first trace.

2. The assembly of claim 1 wherein said bump is a gold ball.

3. The assembly of claim 1 wherein said bump is an electrically conductive epoxy paste.

4. The assembly of claim 1 wherein said bump is an electrically conductive epoxy film.

5. The assembly of claim 1 wherein said bump is solder.

6. The assembly of claim 1 further comprising an electrically conductive via extending through said step up ring from said first surface to said second surface of said step up ring, said first trace being electrically connected to said second trace by said via.

7. The assembly of claim 1 further comprising an electrically conductive interconnection ball on said second trace.

8. The assembly of claim 1 wherein said sensor device comprises a plurality of bond pads including said bond pad, said bond pads being arranged in rows adjacent sides of said sensor device.

9. The assembly of claim 1 wherein said sensor device comprises a plurality of bond pads including said bond pad, said bond pads being distributed on said first surface of said image sensor.

10. The assembly of claim 1 further comprising a package body between said first surface of said step up ring and said first surface of said sensor device.

11. The assembly of claim 10 further comprising:

a window; and

a window support supporting said window above said active area.

12. The assembly of claim 11 wherein said step up ring comprises a central aperture, said window and window support being located within or adjacent to said central aperture.

13. The assembly of claim 1 wherein said sensor device is an image sensor.

14. The assembly of claim 13 wherein said active area is responsive to radiation.

15. An assembly comprising:

a sensor device having a first surface, said sensor device comprising;

an active area on said first surface; and

a bond pad on said first surface,

a step up ring;

an electrically conductive first trace on a first surface of said step up ring;

an electrically conductive bump between said bond pad and said first trace, said step up ring being mounted to said sensor device by said bump; and

a package body between said first surface of said step up ring and said first surface of said sensor device, wherein sides of said package body, sides of said step up ring, and sides of said sensor device are coplanar.

16. The assembly of claim 15 wherein a size of said assembly is the same as a size of said sensor device.

17. An assembly comprising:

a sensor device having a first surface, said sensor device comprising;

an active area on said first surface; and

a bond pad on said first surface,

a step up ring;

an electrically conductive first trace on a first surface of said step up ring;

an electrically conductive bump between said bond pad and said first trace, said step up ring being mounted to said sensor device by said bump;

a package body between said first surface of said step up ring and said first surface of said sensor device;

a window; and

a window support supporting said window above said active area, wherein said step up ring comprises a central aperture, said package body filling said central aperture and enclosing said window support.

18. An assembly comprising:

a sensor device having an active area and bond pads on a first surface of said sensor device;

a step up ring having a lower surface;

electrically conductive interior traces on said lower surface of said step up ring;

electrically conductive bumps between said bond pads and said interior traces, wherein said step up ring is flip chip mounted to said sensor device by said bumps;

a window; and

a window support supporting said window above said active area, wherein said window support entirely encloses said first surface of said sensor device.

19. The assembly of claim 18 wherein said window support is formed around said active area.

20. The assembly of claim 19 wherein said window support is an epoxy bead.

21. The assembly of claim 19 wherein said window, said window support, and said sensor device define a sealed cavity, said active area being located within said sealed cavity.

22. An assembly comprising:

a sensor device having an active area and bond pads on a first surface of said sensor device;

a step up ring having a lower surface;

electrically conductive interior traces on said lower surface of said step up ring;

electrically conductive bumps between said bond pads and said interior traces, wherein said step up ring is flip chip mounted to said sensor device by said bumps;

a window; and

a window support supporting said window above said active area, wherein said window support is formed around said active area and wherein said window support and said window are formed of a same material.

23. The assembly of claim 22 wherein said material is borosilicate glass.

24. An assembly comprising:

means for mounting a window above an active area on a first surface of a sensor device, said sensor device comprising a bond pad on said first surface, wherein said means for mounting is formed around said active area and wherein said means for mounting and said window are formed of a same material; and

means for physically and electrically connecting a first trace on a first surface of a step up ring to said bond pad to mount said step up ring to said sensor device.