Method of controlling photolithography processes based upon scatterometric measurements of photoresist thickness, and system for accomplishing same

• US 6,529,282 B1
• Filed: 06/11/2001
• Issued: 03/04/2003
• Est. Priority Date: 06/11/2001
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Stirton, James Broc, Markle, Richard J.
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): SEYRAFI, SAEED HMT
• Application Number:
  US09/879,338
• Time in Patent Office: 631 Days
• Field of Search: 356/630, 356/631, 356/632, 356/394, 438/401
• US Class Current: 356/630
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Abstract

The present invention is generally directed to a method of controlling photolithography processes based upon scatterometric measurements of photoresist thickness, and system for accomplishing same. In one embodiment, the method comprises providing a library of optical characteristic traces, each of which corresponds to a grating structure comprised of a plurality of photoresist features having a known thickness, forming at least one grating structure in a layer of photoresist, the formed grating structure being comprised of a plurality of photoresist features having an unknown thickness, and illuminating the formed grating structure. The method further comprises measuring light reflected off of the formed grating structure to generate an optical characteristic trace for the formed grating structure, and determining the unknown thickness of the photoresist features by comparing the generated optical characteristic trace to at least one optical characteristic trace from the library.

Claims

1. A method of determining a thickness of a layer of photoresist, comprising:

providing a library of optical characteristic traces, each of which corresponds to a grating structure comprised of a plurality photoresist features having a known thickness;

forming at least one grating structure in a layer of photoresist, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness;

illuminating said formed grating structure;

measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said formed grating structure; and

determining said unknown thickness of said photoresist features by comparing said generated optical characteristic trace to at least one optical characteristic trace from said library.

2. The method of claim 1, further comprising modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer based upon said determined thickness of said photoresist features.

3. The method of claim 1, wherein said at least one formed grating structure is formed within an area defined by a single exposure field of a stepper exposure process.

4. The method of claim 1, wherein forming at least one grating structure in a layer of photoresist comprises forming at least three grating structures in a layer of photoresist.

5. The method of claim 1, wherein forming at least one grating structure in a layer of photoresist comprises forming at least five grating structures in a layer of photoresist.

6. The method of claim 2, wherein modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer comprises modifying at least one of a rotational speed of a wafer during a spin coating process, a duration of a spin coating process, a quantity of a photoresist material initially deposited on a wafer prior to performing a spin coating process, a temperature of a cooling process performed on a wafer prior to application of a photoresist material to the wafer, a temperature of a pre-exposure bake process, and a duration of a pre-exposure bake process of a wafer for at least one subsequently processed wafer.

7. The method of claim 1, wherein said photoresist features comprising said grating structure are comprised of lines or trenches.

8. The method of claim 1, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

9. The method of claim 1, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

10. The method of claim 1, wherein forming at least one grating structure in a layer of photoresist, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness comprises forming at least one grating structure in a layer of photoresist in each of a plurality of exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness.

11. The method of claim 1, wherein forming at least one grating structure in a layer of photoresist, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness comprises forming at least one grating structure in a layer of photoresist in each of at least five exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness.

12. The method of claim 10, wherein forming at least one grating structure comprises forming at least three grating structures.

13. The method of claim 10, wherein forming at least one grating structure comprises forming at least five grating structures.

14. The method of claim 11, wherein forming at least one grating structure comprises forming at least three grating structures.

15. The method of claim 11, wherein forming at least one grating structure comprises forming at least five grating structures.

16. A method, comprising:

providing a library of optical characteristic traces, each of which corresponds to a grating structure comprised of a plurality of photoresist features having a known thickness;

forming at least one grating structure in a layer of photoresist in each of a plurality of exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness;

illuminating said formed grating structure;

measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said formed grating structure;

determining said unknown thickness of said photoresist features by comparing said generated optical characteristic trace to at least one optical characteristic trace from said library; and

modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer based upon said comparison of said generated optical characteristic trace and said at least one optical characteristic trace from said library.

17. The method of claim 16, wherein forming at least one grating structure in a layer of photoresist comprises forming at least three grating structures in a layer of photoresist.

18. The method of claim 16, wherein forming at least one grating structure in a layer of photoresist comprises forming at least five grating structures in a layer of photoresist.

19. The method of claim 16, wherein modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer comprises modifying at least one of a rotational speed of a wafer during a spin coating process, a duration of a spin coating process, a quantity of a photoresist material initially deposited on a wafer prior to performing a spin coating process, a temperature of a cooling process performed on a wafer prior to application of a photoresist material to the wafer, a temperature of a pre-exposure bake process, and a duration of a pre-exposure bake process of a wafer for at least one subsequently processed wafer.

20. The method of claim 16, wherein said photoresist features comprising said grating structure are comprised of lines or trenches.

21. The method of claim 16, wherein forming at least one grating structure in a layer of photoresist comprises forming at least one grating structure in a layer of photoresist, one of which is formed in an approximate middle of said exposure field.

22. The method of claim 16, wherein each of said plurality of exposure fields is defined by a top edge, a bottom edge, a plurality of side edges and four corners.

23. The method of claim 16, wherein forming at least one grating structure in a layer of photoresist comprises forming at least five grating structures in a layer of photoresist, one of said grating structures being positioned at approximately a middle of said exposure field, and each of four of said grating structures being positioned proximate a corner of said exposure field.

24. The method of claim 16, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

25. The method of claim 16, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

26. The method of claim 16, wherein forming at least one grating structure in a layer of photoresist in each of a plurality of exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness comprises forming at least one grating structure in a layer of photoresist in each of at least five exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness.

27. The method of claim 26, wherein forming at least one grating structure comprises forming at least three grating structures.

28. A method, comprising:

providing a library of optical characteristic traces, each of which corresponds to a grating structure comprised of a plurality of photoresist features having a known thickness;

forming at least one grating structures in a layer of photoresist in each of at least five exposure fields of a stepper exposure process, each of said formed grating structures being comprised of a plurality of photoresist features having an unknown thickness;

illuminating said formed grating structures;

measuring light reflected off of each of said plurality of formed grating structures to generate an optical characteristic trace for each of said plurality of formed grating structures;

determining said unknown thickness of said photoresist features by comparing each of said generated optical characteristic traces to at least one optical characteristic trace from said library; and

modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer based upon said comparison of said generated optical characteristic traces and said at least one optical characteristic trace from said library.

29. The method of claim 28, wherein forming at least one grating structure in a layer of photoresist comprises forming at least three grating structures in a layer of photoresist.

30. The method of claim 28, wherein forming at least one grating structure in a layer of photoresist comprises forming at least five grating structures in a layer of photoresist.

31. The method of claim 28, wherein modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer comprises modifying at least one of a rotational speed of a wafer during a spin coating process, a duration of a spin coating process, a quantity of a photoresist material initially deposited on a wafer prior to performing a spin coating process, a temperature of a cooling process performed on a wafer prior to application of a photoresist material to the wafer, a temperature of a pre-exposure bake process, and a duration of a pre-exposure bake process of a wafer for at least one subsequently processed wafer.

32. The method of claim 28, wherein said photoresist features comprising said grating structure are comprised of lines or trenches.

33. The method of claim 28, wherein at least one of said grating structures is formed proximate a middle of each of said exposure fields.

34. The method of claim 28, wherein each of said exposure fields is defined by a top edge, a bottom edge, a plurality of said edges and four corners.

35. The method of claim 34, wherein forming at least one grating structure in a layer of photoresist comprises forming at least three grating structures in a layer of photoresist, one of said grating structures being positioned proximate said top edge of each of said exposure fields, and each of two of said grating structures being positioned adjacent a corner adjacent said bottom edge of each of said exposure fields.

36. The method of claim 34, wherein forming at least one grating structure in a layer of photoresist comprises forming at least five grating structures in a layer of photoresist, one of said grating structures being positioned at approximately a middle of each of said exposure fields, and each of four of said grating structures being positioned proximate a corner of each of said exposure fields.

37. The method of claim 28, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

38. The method of claim 28, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

39. A method, comprising:

providing a wafer having at least one process layer and a layer of photoresist formed thereabove;

forming at least one grating structure in said layer of photoresist;

illuminating said formed grating structures;

measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said formed grating structure;

comparing the generated optical characteristic trace for said formed grating structure to a target optical characteristic trace; and

determining, based upon a comparison of said generated optical characteristic trace and said target optical characteristic trace, at least one parameter of a process to be performed to form a layer of photoresist on a subsequently processed wafer.

40. The method of claim 39, wherein providing a wafer having at least one process layer and a layer of photoresist formed thereabove comprises providing a wafer having at least one process layer and a layer of photoresist formed thereabove, said layer of photoresist being comprised of either a negative or positive photoresist material.

41. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least one grating structure in said layer of photoresist within an area defined by a single exposure field of a stepper exposure process.

42. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least three grating structures in said layer of photoresist.

43. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least five grating structures in said layer of photoresist.

44. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least three grating structures in said layer of photoresist within an area defined by a single exposure field of a stepper exposure process.

45. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least five grating structures in said layer of photoresist within an area defined by a single exposure field of a stepper exposure process.

46. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least one grating structure in said layer of photoresist within an area defined by a single exposure field of a stepper exposure process, one of said grating structures being formed proximate a middle of said exposure field.

47. The method of claim 39, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

48. The method of claim 39, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

49. The method of claim 39, further comprising modifying, based upon a comparison of said generated optical characteristic trace and said target optical characteristic trace, at least one parameter of a process used to form a layer of photoresist on a subsequently processed wafer.

50. The method of claim 39, wherein modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer comprises modifying at least one of a rotational speed of a wafer during a spin coating process, a duration of a spin coating process, a quantity of a photoresist material initially deposited on a wafer prior to performing a spin coating process, a temperature of a cooling process performed on a wafer prior to application of a photoresist material to the wafer, a temperature of a pre-exposure bake process, and a duration of a pre-exposure bake process of a wafer for at least one subsequently processed wafer.

51. The method of claim 39, wherein measuring the reflected light comprises measuring the intensity of the reflected light.

52. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least one grating structure in a layer of photoresist in each of a plurality of exposure fields of a stepper exposure process.

53. The method of claim 39, wherein forming at least one grating structure in said layer of photoresist comprises forming at least one grating structure in a layer of photoresist in each of at least five exposure fields of a stepper exposure process.

54. A method, comprising:

providing a wafer having at least one process layer and a layer of photoresist formed thereabove;

forming at least one grating structure in said layer of photoresist in each of a plurality of exposure fields of a stepper exposure process;

illuminating said formed grating structure;

measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said formed grating structure;

comparing the generated optical characteristic trace for said formed grating structure to a target optical characteristic trace; and

determining, based upon a comparison of said generated optical characteristic trace and said target optical characteristic trace, at least one parameter of a process to be performed to form a layer of photoresist on a subsequently processed wafer.

55. The method of claim 54, wherein providing a wafer having at least one process layer and a layer of photoresist formed thereabove comprises providing a wafer having at least one process layer and a layer of photoresist formed thereabove, said layer of photoresist being comprised of either a negative or positive photoresist material.

56. The method of claim 54, wherein forming at least one grating structure in said layer of photoresist comprises forming at least three grating structures in said layer of photoresist.

57. The method of claim 54, wherein forming at least one grating structure in said layer of photoresist comprises forming at least five grating structures in said layer of photoresist.

58. The method of claim 54, wherein forming at least one grating structure in said layer of photoresist in each of a plurality of exposure fields of a stepper exposure process comprises forming at least one grating structure in said layer of photoresist in each of a plurality of exposure fields of a stepper exposure process, one of said grating structures being formed proximate a middle of each of said exposure fields.

59. The method of claim 54, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

60. The method of claim 54, wherein measuring light reflected off of said at least one grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

61. The method of claim 54, further comprising modifying, based upon a comparison of said generated optical characteristic trace and said target optical characteristic trace, at least one parameter of a process used to form a layer of photoresist on a subsequently processed wafer.

62. The method of claim 61, wherein modifying at least one parameter of a process used to form a layer of photoresist on at least one subsequently processed wafer comprises modifying at least one of a rotational speed of a wafer during a spin coating process, a duration of a spin coating process, a quantity of a photoresist material initially deposited on a wafer prior to performing a spin coating process, a temperature of a cooling process performed on a wafer prior to application of a photoresist material to the wafer, a temperature of a pre-exposure bake process, and a duration of a pre-exposure bake process of a wafer for at least one subsequently processed wafer.

63. The method of claim 54, wherein measuring the reflected light comprises measuring the intensity of the reflected light.

64. The method of claim 54, wherein forming at least one grating structure in said layer of photoresist in each of a plurality of exposure fields of a stepper exposure process comprises forming at least one grating structure in said layer of photoresist in each of at least five exposure fields of a stepper exposure process.

65. The method of claim 54, wherein forming at least one grating structure comprises forming at least three grating structures.

66. A method, comprising:

providing a wafer having at least one process layer and a layer of photoresist formed thereabove;

forming at least one grating structure in said layer of photoresist in each of at least five exposure fields of a stepper exposure process;

illuminating said formed grating structure;

measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said formed grating structure;

comparing the generated optical characteristic trace for said formed grating structure to a target optical characteristic trace; and

modifying, based upon a comparison of said generated optical characteristic trace and said target optical characteristic trace, at least one parameter of a process to be performed to form a layer of photoresist on a subsequently processed wafer.

67. The method of claim 66, wherein providing a wafer having at least one process layer and a layer of photoresist formed thereabove comprises providing a wafer having at least one process layer and a layer of photoresist formed thereabove, said layer of photoresist being comprised of either a negative or positive photoresist material.

68. The method of claim 66, wherein forming at least one grating structure in said layer of photoresist comprises forming at least three grating structures in said layer of photoresist.

69. The method of claim 66, wherein forming at least one grating structure in said layer of photoresist comprises forming at least five grating structures in said layer of photoresist.

70. The method of claim 66, wherein forming at least one grating structure in said layer of photoresist comprises forming at least one grating structure in said layer of photoresist proximate a middle of each of said exposure fields.

71. The method of claim 66, wherein measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist has been subjected to a post-exposure bake process and prior to said layer of photoresist being subjected to a development process.

72. The method of claim 66, wherein measuring light reflected off of said formed grating structure to generate an optical characteristic trace for said grating structure is performed after said layer of photoresist is subjected to a development process.

73. The method of claim 66, wherein forming at least one grating structure in a layer of photoresist in each of a plurality of exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness comprises forming at least one grating structure in a layer of photoresist in each of at least five exposure fields of a stepper exposure process, said formed grating structure being comprised of a plurality of photoresist features having an unknown thickness.

74. The method of claim 66, wherein forming at least one grating structure comprises forming at least three grating structures.