Method of sorting a group of integrated circuit devices for those devices requiring special testing

• US 6,529,793 B1
• Filed: 06/28/2000
• Issued: 03/04/2003
• Est. Priority Date: 02/17/1997
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Beffa, Raymond J.
• Primary Examiner(s): PATEL, RAMESH B
• Application Number:
  US09/607,201
• Time in Patent Office: 979 Days
• Field of Search: 700/95, 700/96, 700/97, 700/108-112, 700/121, 700/117, 700/213, 700/215, 257/777, 257/712, 341/134, 341/133, 341/154, 323/281, 323/313, 323/907, 250/306, 250/492.1, 250/234, 250/391.1, 250/492.2, 250/492.3, 250/307, 250/233
• US Class Current: 700/121
• CPC Class Codes: G01R 31/2894 Aspects of quality control [QC] G01R31/31718 takes precedence; program control for QC G05B19/41875
• CPC Class Codes: G01R 31/31718 Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis mechanical aspects G01R31/2808, G01R31/2851
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits
• CPC Class Codes: G06F 11/006 Identification G06F11/2289 takes precedence
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2223/5444 for electrical read out

Abstract

A method for sorting integrated circuit (IC) devices of the type having a fuse identification (ID) into those devices requiring enhanced reliability testing and those requiring standard testing includes storing fabrication deviation data, probe data, and test data in association with the fuse ID of each of the devices indicating each of the devices requires either enhanced reliability testing or standard testing. The fuse ID of each of the devices is then automatically read before, during, or after standard testing of the devices. The testing process requirement data stored in association with the fuse ID of each of the devices is then accessed, and the devices are sorted in accordance with the accessed data into those devices requiring enhanced reliability testing and those requiring standard testing. The method thus directs those devices needing enhanced reliability testing to such testing without the need for all devices from the same wafer or wafer lot to proceed through special testing.

Claims

1. An integrated circuit manufacturing process for grouping a plurality of integrated circuit devices of a type having an identification code into those integrated circuit devices to undergo a first process and those integrated circuit devices to undergo a second process different than the first process, the method comprising:

storing data in association with an individual identification code of each of the integrated circuit devices indicating each of the integrated circuit devices undergoes one of the first process and the second process;

reading the individual identification code of each of the integrated circuit devices;

accessing the data stored in association with the individual identification code of each of the integrated circuit devices; and

grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process.

2. The method of claim 1, wherein the act of storing data in association with the individual identification code of each of the integrated circuit devices comprises storing at least one of fabrication deviation data, probe data, standard test data, special test data, and enhanced reliability testing data in association with the individual identification code of at least some of the integrated circuit devices.

3. The method of claim 1, wherein the act of storing data comprises storing a Quality Deviation Report (QDR).

4. The method of claim 1, wherein the act of storing data comprises storing data indicating one or more semiconductor wafers have been misprocessed.

5. The method of claim 1, wherein the act of storing data comprises storing data indicating one or more semiconductor wafers have relatively low yields.

6. The method of claim 1, wherein the act of storing data comprises storing data indicating one or more semiconductor wafer lots have relatively low yields.

7. The method of claim 1, wherein the IC devices come from a plurality of die locations on each of a plurality of semiconductor wafers, wherein the act of storing data comprises storing data indicating that integrated circuit devices from identical die locations on each of a series of the plurality of semiconductor wafers have relatively low yields.

8. The method of claim 1, wherein the integrated circuit devices come from a plurality of semiconductor wafers each fabricated on one of a plurality of pieces of fabrication equipment, wherein the act of storing data comprises storing data indicating that a series of the plurality of semiconductor wafers fabricated using the same piece of fabrication equipment have relatively low yields.

9. The method of claim 1, wherein the integrated circuit devices come from a plurality of semiconductor wafers each tested on one of a plurality of pieces of test equipment, wherein the act of storing data comprises storing data indicating that a group of the plurality of semiconductor wafers tested using the same piece of test equipment have relatively low yields.

10. The method of claim 1, wherein the first and second processes comprise respective standard and special testing processes, wherein the act of storing data comprises storing special test data indicating that integrated circuit devices previously indicated to require the special testing process instead require the standard testing process.

11. The method of claim 1, wherein the act of storing data in association with the individual identification code of each of the integrated circuit devices comprises storing data in association with the individual identification code of one or more integrated circuit devices other than those integrated circuit devices that are in the plurality of integrated circuit devices to be grouped, the other integrated circuit devices being at a different point in the integrated circuit manufacturing process than the integrated circuit devices in the plurality of integrated circuit devices to be grouped.

12. The method of claim 1, wherein the act of reading the individual identification code of each of the IC devices comprises electrically retrieving a unique fuse identification programmed into each of the integrated circuit devices.

13. The method of claim 1, wherein the act of reading the individual identification code of each of the integrated circuit devices comprises optically reading a unique identification code provided on each of the integrated circuit devices.

14. The method of claim 13, wherein the act of optically reading a unique identification code provided on each of the integrated circuit devices comprises optically reading a unique laser fuse identification programmed into each of the integrated circuit devices.

15. The method of claim 1, wherein the act of grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices before the standard testing process into those integrated circuit devices requiring an enhanced reliability testing process and those integrated circuit devices requiring the standard testing process.

16. The method of claim 1, wherein the act of grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices during the standard testing process into those integrated circuit devices requiring the enhanced reliability testing process and those integrated circuit devices requiring the standard testing process.

17. The method of claim 1, wherein the act of grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuit devices to undergo the second process comprises sorting the integrated circuit devices after the standard testing process into those integrated circuit devices requiring the enhanced reliability testing process and those integrated circuit devices finished with testing.

18. The method of claim 1, wherein the act of accessing the data comprises accessing one of fabrication equipment data, fabrication personnel data, fabrication set-up data, time and date data, yield data, and test data.

19. The method of claim 1, wherein each of the integrated circuit devices has an associated lot identification, wherein the act of accessing the data comprises accessing data associated with the lot identification of the integrated circuit device that is associated with each of the read identification codes.

20. A manufacturing method for integrated circuit devices from semiconductor wafers, the method comprising:

providing a plurality of semiconductor wafers;

fabricating a plurality of integrated circuit devices on each of the semiconductor wafers;

causing each of the integrated circuit devices on each of the semiconductor wafers to store an individual identification code;

separating each of the integrated circuit devices on each of the semiconductor wafers forming one of a plurality of integrated circuit devices;

storing data in association with the individual identification code associated with each of the integrated circuit devices that indicates each of the integrated circuit devices to undergo one of a first process and a second process;

reading the individual identification code associated with each of the separated integrated circuit devices;

accessing the data stored in association with the individual identification code that is associated with each of the separated integrated circuit devices;

grouping the integrated circuit devices in accordance with the accessed data into those integrated circuit devices to undergo the first process and those integrated circuti devices to undergo the second process; and

testing the grouped integrated circuit devices using the first process and the second process.

21. The method of claim 20, wherein the act of fabricating a plurality of integrated circuit devices on each of the semiconductor wafers comprises fabricating integrated circuit devices selected from a group comprising Dynamic Random Access Memory (DRAM) integrated circuit devices, Static Random Access Memory (SRAM) integrated circuit devices, Synchronous DRAM (SDRAM) integrated circuit devices, and processor integrated circuit devices.

22. The method of claim 20, wherein the act of causing each of the integrated circuit devices on each of the semiconductor wafers to store an individual identification code comprises programming each of the integrated circuit devices on each of the semiconductor wafers to permanently store a unique fuse identification.

23. The method of claim 22, wherein the act of programming each of the integrated circuit devices on each of the semiconductor wafers to permanently store the unique fuse identification comprises programming at least one of fuses and anti-fuses in each of the integrated circuit devices on each of the wafers to permanently store the unique fuse identification indicating at least one of a lot identification, work week, wafer identification, die location, and fabrication facility identification.

24. The method of claim 20, wherein the act of storing data occurs during at least one of the acts of fabricating and testing.

25. The method of claim 20, wherein the acts of reading the individual identification code and grouping occur at one of a point before the act of testing, a point during the act of testing, and a point after the act of testing.

26. A manufacturing method for integrated circuit modules from semiconductor wafers, the method comprising:

providing a plurality of semiconductor wafers;

fabricating a plurality of integrated circuit dice on each of the semiconductor wafers;

causing each of the integrated circuit dice on each of the semiconductor wafers to store an individual identification code;

separating each of the integrated circuit dice on each of the semiconductor wafers from its wafer to form one of a plurality of separated integrated circuit dice;

assembling the separated integrated circuit dice into a plurality of integrated circuit modules;

storing data in association with the individual identification code associated with each of the integrated circuit dice in each of the integrated circuit modules indicating each of the integrated circuit modules undergoes one of a first process and a second process;

reading the individual identification code associated with each of the integrated circuit dice in each of the integrated circuit modules;

accessing the data stored in association with the individual identification code associated with each of the integrated circuit dice in each of the integrated circuit modules;

grouping the integrated circuit modules in accordance with the accessed data into those integrated circuit modules that undergo the first process and those integrated circuit modules that undergo the second process; and

causing the grouped integrated circuit modules to advance through the first process and the second process according to their grouping.

27. The method of claim 26, wherein the integrated IC modules are selected from a group comprising Single In-Line Memory Modules (SIMM'"'"'s) and Dual In-line Memory Modules (DIMM'"'"'s).

28. An integrated circuit manufacturing process for separating integrated circuit devices to undergo special testing from a group of integrated circuit devices undergoing standard test procedures, the integrated circuit devices being of the type to have an identification code, the method comprising:

storing data in association with an individual identification code of each of the integrated circuit devices indicating each of the integrated circuit devices undergoes one of special testing and standard testing;

reading the individual identification code of each of the integrated circuit devices;

accessing the data stored in association with the individual identification code of each of the integrated circuit devices; and

sorting the integrated circuit devices during the standard test procedures in accordance with the accessed data for those integrated circuit devices undergoing the special testing.

29. An integrated circuit manufacturing process for separating integrated circuit devices undergoing special testing from a group of integrated circuit devices undergoing standard test procedures, the integrated circuit devices having an identification code, the method comprising:

storing fabrication deviation data in association with an individual identification code of at least one of the integrated circuit devices indicating the integrated circuit device undergoes the special testing;

reading the individual identification code of the integrated circuit device;

accessing the fabrication deviation data stored in association with the individual identification code of the integrated circuit device; and

sorting the integrated circuit devices in accordance with the accessed data for the integrated circuit device undergoing the special testing.

30. An integrated circuit manufacturing process separating integrated circuit devices undergoing special testing from a group of integrated circuit devices that have undergone standard test procedures, the integrated circuit devices having an identification code, the method comprising:

storing data in association with an individual identification code of at least one of the integrated circuit devices that indicates the integrated circuit device undergoes the special testing;

reading the individual identification code of the integrated circuit device;

accessing the data stored in association with the individual identification code of the integrated circuit device; and

sorting the integrated circuit devices in accordance with the accessed data for the integrated circuit device undergoing the special testing.

31. An integrated circuit manufacturing process for using special test data generated by a first group of integrated circuit devices undergoing special testing to sort a second group of integrated circuit devices into those to undergo the special testing and those to undergo standard testing, the integrated circuit devices having an identification code, the method comprising:

storing data in association with an individual identification code of at least one of the second group of integrated circuit devices indicating the at least one of the second group of integrated circuit devices undergoes the special testing;

storing special test data generated by the first group of integrated circuit devices in association with the individual identification code of the at least one of the second group of integrated circuit devices indicating at least one of the second group of integrated circuit devices undergoes the standard testing instead of the special testing;

reading the individual identification code of the at least one of the second group of integrated circuit devices;

accessing the data stored in association with the individual identification code of the at least one of the second group of integrated circuit devices; and

sorting the second group of integrated circuit devices in accordance with the accessed data so the at least one of the second group of integrated circuit devices undergoes the standard testing.

32. An integrated circuit manufacturing process for grouping a first group of integrated circuit devices of the type having an identification code into those integrated circuit devices to undergo a first process and those integrated circuit devices to undergo a second process, the method comprising:

storing data generated by a second group of integrated circuit devices in association with an individual identification code of each of the first group of integrated circuit devices indicating each of the first group of integrated circuit devices undergoes one of the first process and the second process;

reading the individual identification code of each of the first group of integrated circuit devices;

accessing the data stored in association with the individual identification code of each of the first group of integrated circuit devices; and

grouping the integrated circuit devices in the first group in accordance with the accessed data into those integrated circuit devices undergoing the first process and those integrated circuit devices undergoing the second process.