Method for mounting electronic elements
First Claim
1. A method for mounting an electronic element comprising the step of arranging a thermosetting adhesive between a circuit board arranged on a stage and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the side of the electronic element,wherein the electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element, and thereafter the thermosetting adhesive is set finally in order to bond the electronic element to the circuit board.
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Accused Products
Abstract
A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.
97 Citations
17 Claims
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1. A method for mounting an electronic element comprising the step of arranging a thermosetting adhesive between a circuit board arranged on a stage and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the side of the electronic element,
wherein the electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element, and thereafter the thermosetting adhesive is set finally in order to bond the electronic element to the circuit board.
Specification