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Microneedle structure and production method therefor

  • US 6,533,949 B1
  • Filed: 10/02/2000
  • Issued: 03/18/2003
  • Est. Priority Date: 08/28/2000
  • Status: Expired due to Term
First Claim
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1. A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate, the method comprising the steps of:

  • (a) forming by use of a dry etching process a plurality of groups of recessed features, each group of recessed features including at least one slot deployed to form an open shape having an included area and at least one hole located within said included area;

    (b) coating internal surfaces of said holes and said slots with a protective layer;

    (c) performing an anisotropic wet etching process in such a manner as to remove material from outside said included areas while leaving a projecting feature within each of said included areas; and

    (d) removing said protective layer.

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