Microneedle structure and production method therefor
First Claim
1. A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate, the method comprising the steps of:
- (a) forming by use of a dry etching process a plurality of groups of recessed features, each group of recessed features including at least one slot deployed to form an open shape having an included area and at least one hole located within said included area;
(b) coating internal surfaces of said holes and said slots with a protective layer;
(c) performing an anisotropic wet etching process in such a manner as to remove material from outside said included areas while leaving a projecting feature within each of said included areas; and
(d) removing said protective layer.
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Abstract
A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
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Citations
11 Claims
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1. A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate, the method comprising the steps of:
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(a) forming by use of a dry etching process a plurality of groups of recessed features, each group of recessed features including at least one slot deployed to form an open shape having an included area and at least one hole located within said included area;
(b) coating internal surfaces of said holes and said slots with a protective layer;
(c) performing an anisotropic wet etching process in such a manner as to remove material from outside said included areas while leaving a projecting feature within each of said included areas; and
(d) removing said protective layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification