Encapsulation package and method of packaging an electronic circuit module

• US 6,534,711 B1
• Filed: 08/17/2000
• Issued: 03/18/2003
• Est. Priority Date: 04/14/1998
• Status: Expired due to Fees

• Current Assignee: Goodyear Tire & Rubber Company
• Original Assignee: Goodyear Tire & Rubber Company
• Inventors: Pollack, Richard Stephen
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): OLIVA, CARMELO B
• Application Number:
  US09/622,548
• Time in Patent Office: 943 Days
• Field of Search: 174/52.2, 264/272.11, 438/112, 438/126, 438/127, 438/124, 257/678, 257/685, 257/687, 257/698, 257/787
• US Class Current: 174/529
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). Electronic components and modules within the chambers are interconnected by a leadframe (130) extending between the two chambers. One chamber may surround (FIGS. 1A, 2A) the other chamber, or it may be adjacent the other chamber (FIGS. 4, 4A, 8A, 9A). The sidewall (310) of one chamber (314) may be higher than the sidewall (308) of the other chamber (312). Each of the chambers may individually be filled with encapsulating material (713, 715). Temporary connections (742) to the leadframe may be made after one chamber is filled with encapsulating material, in an unfilled other chamber of the package which is subsequently filled with encapsulating material. A portion of a leadframe may extend to the exterior of the package. Openings (656, 658) may be provided in an external surface of the package for making connections with external components (650). The electronic components may include an RF-transponder and a pressure sensor, and the package may be mounted within a pneumatic tire (1012).

Claims

1. Encapsulation package for sequentially potting a circuit module followed by its electrical connections, the package comprising:

a base having an inner surface and an outer surface opposite the inner surface;

the circuit module disposed on the inner surface of the base, wherein the circuit module requires exercising after being potted;

a first sidewall extending up from the inner surface of the base such that the first sidewall surrounds the circuit module and is open above the circuit module, thereby defining a first chamber;

a second sidewall extending up from the inner surface of the base and defining a second chamber that is open at its top and is separate from the first chamber;

elongate conductive elements forming the electrical connections of the circuit module wherein at least a portion of each of the elongate conductive elements has a one end disposed in the first chamber and an opposite end disposed in the second chamber;

such that the circuit module is connected to the one ends of the at least a portion of the elongate conductive elements, wherein the circuit module'"'"'s electrical connections can at least be used to exercise the circuit module after potting; and

potting compound wherein the first chamber and the second chamber are separately and sequentially filled with potting compound at different stages of an encapsulation process which includes exercising the circuit module after filling the first chamber but before filling the second chamber.

2. Encapsulation package, according to claim 1, characterized in that:

the second chamber surrounds the first chamber.

3. Encapsulation package, according to claim 1, characterized in that:

the second chamber is adjacent the first chamber.

4. Encapsulation package, according to claim 1, characterized in that:

the base is in the form of a disc.

5. Encapsulation package, according to claim 1, characterized in that:

the base is in the form of a rectangle.

6. Encapsulation package, according to claim 1, characterized in that:

the first sidewall extends further from the inner surface of the base than the second sidewall.

7. Encapsulation package, according to claim 1, characterized in that:

the second chamber is formed separately from the first chamber; and

an inner portion of the second sidewall abuts an inner portion of the first sidewall.

8. Encapsulation package, according to claim 1, further characterized by:

at least one opening extending through the second sidewall.

9. Encapsulation package, according to claim 1, farther characterized by:

the elongate conductive elements comprising a leadframe having a plurality of leadframe fingers, at least a portion of which extend from the first chamber, through the first sidewall into the second chamber.

10. Encapsulation package, according to claim 1, further characterized by:

the elongate conductive elements comprising a leadframe having a plurality of leadframe fingers, at least a portion of which extend through the second sidewall to an exterior of the encapsulation package.

11. Encapsulation package for sequentially potting a circuit module followed by its electrical connections, the package comprising:

a first base having an inner surface and an outer surface opposite the inner surface;

the circuit module disposed on the inner surface of the first base, wherein the circuit module requires exercising after being potted;

a first sidewall extending up from a periphery of the inner surface of the first base such that the first sidewall surrounds the circuit module and is open above the circuit module, thereby defining a first chamber;

a second base that is separate from the first base;

a second sidewall extending up from a periphery of the second base and defining a second chamber that is open at its top;

an inner portion of the first sidewall that is shaped for abutting against an inner portion of the second sidewall;

a means for joining the first chamber and the second chamber with the inner portion of the first sidewall abutting against the inner portion of the second sidewall;

elongate conductive elements forming the electrical connections of the circuit module wherein at least a portion of each of the elongate conductive elements has a one end disposed in the first chamber and an opposite end disposed in the second chamber;

such that the circuit module is connected to the one ends of the at least a portion of the elongate conductive elements, wherein the circuit module'"'"'s electrical connections can at least be used to exercise the circuit module after potting; and

potting compound wherein the first chamber and the second chamber are separately and sequentially filled with potting compound at different stages of an encapsulation process which includes exercising the circuit module after filling the first chamber but before filling the second chamber.