Assembly and methods for packaged die on pcb with heat sink encapsulant
First Claim
1. A semiconductor assembly comprising:
- a substrate;
a semiconductor chip having a first surface and a second surface, at least a portion of the first surface attached to a portion of said substrate and electrically connected to a portion of said substrate;
a barrier material adhered to a periphery of the second surface of said semiconductor chip substantially forming a wall, said barrier material substantially contacting a portion of said substrate;
a recess defined by said wall about said periphery of the semiconductor chip second surface; and
a heat-dissipating material disposed within said recess.
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Accused Products
Abstract
An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface (“opposing surface”) opposite the surface attached to the substrate to form a wall around a periphery of an opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface for the semiconductor chip.
54 Citations
69 Claims
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1. A semiconductor assembly comprising:
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a substrate;
a semiconductor chip having a first surface and a second surface, at least a portion of the first surface attached to a portion of said substrate and electrically connected to a portion of said substrate;
a barrier material adhered to a periphery of the second surface of said semiconductor chip substantially forming a wall, said barrier material substantially contacting a portion of said substrate;
a recess defined by said wall about said periphery of the semiconductor chip second surface; and
a heat-dissipating material disposed within said recess. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of making a semiconductor assembly comprising:
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providing a substrate;
providing a semiconductor chip having a first surface and a second surface;
attaching at least a portion of said semiconductor chip first surface to at least a portion of said substrate;
forming an electrical connection between said semiconductor chip and said substrate;
forming a wall substantially around a periphery of the second surface of said semiconductor chip using a barrier material, said wall around the periphery of said second surface of said semiconductor chip defining a recess;
extending said barrier material for contacting said substrate; and
disposing a heat-dissipating material substantially within said recess. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor assembly comprising:
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a semiconductor chip having a first surface and a second surface, the first surface attached to at least a portion of a substrate and electrically connected to a portion of the substrate;
a barrier material adhered to a periphery of the second surface of said semiconductor chip substantially forming a wall, a portion of said wall extending beyond said semiconductor chip forming a recess located above said second surface of said semiconductor chip, said barrier material substantially extending to and contacting portions of said substrate; and
a heat-dissipating material disposed within said recess. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method for making a semiconductor assembly comprising:
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providing a substrate;
providing a semiconductor chip having a first surface and a second surface;
attaching at least a portion of said first surface of said semiconductor chip to at least a portion of said substrate;
disposing an underfill material substantially between said substrate and said semiconductor chip;
forming an electrical connection between said semiconductor chip and said substrate;
forming a wall substantially around a periphery of said second surface of said semiconductor chip using a barrier material, said wall and said second surface of said semiconductor chip defining a recess;
extending said barrier material to contact at least a portion of said substrate; and
disposing a heat-dissipating material substantially within said recess. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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32. A semiconductor assembly comprising:
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a substrate;
a semiconductor chip having a first surface and a second surface, a portion of said first surface attached to and electrically connected to said substrate;
an underfill material substantially filling a space between said substrate and said semiconductor chip;
a barrier material substantially adhered to a periphery of the second surface of said semiconductor chip substantially forming a wall, a portion of said wall extending beyond the said semiconductor chip forming a recess located above said second surface of said semiconductor chip, said barrier material substantially extending to and contacting said substrate; and
a heat-dissipating material disposed within said recess. - View Dependent Claims (33, 34, 35, 36, 37, 38)
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39. A semiconductor assembly comprising:
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a substrate;
at least one semiconductor chip having a first surface and a second surface, the first surface attached to and electrically connected to said substrate;
a barrier material adhered to a periphery of the second surface of said at least one semiconductor chip substantially forming a wall, said barrier material substantially extending to and contacting a portion of said substrate;
a recess defined by said wall about said periphery of the second surface of the at least one semiconductor chip; and
a heat-dissipating material disposed within said recess. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46)
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47. A semiconductor assembly comprising:
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a substrate;
at least two semiconductor chips, each semiconductor chip of said at least two semiconductor chips having a first surface and a second surface, the first surface of said each semiconductor chip attached to and electrically connected to said substrate;
a barrier material adhered to a periphery of the second surface of said each semiconductor chip substantially forming a wall, said barrier material substantially extending to and contacting a portion of said substrate;
a recess defined by said wall; and
a heat-dissipating material disposed within said recess of said each semiconductor chip. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54)
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55. A semiconductor assembly comprising:
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a substrate;
a plurality of semiconductor chips, each semiconductor chip of said plurality having a first surface and a second surface, the first surface attached to and electrically connected to said substrate;
a barrier material adhered to a periphery of the second surface of said each semiconductor chip substantially forming a wall, said barrier material substantially extending to and contacting a portion of said substrate;
a recess defined by said wall; and
a heat-dissipating material disposed within said recess of said each semiconductor chip. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62)
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63. A method of making a semiconductor assembly comprising:
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providing a substrate;
providing a plurality of semiconductor chips, each semiconductor chip of said plurality having a first surface and a second surface;
attaching a portion of said first surface of said each semiconductor chip to a portion of said substrate;
disposing an underfill material substantially between said substrate and said each semiconductor chip;
forming an electrical connection between said each semiconductor chip and said substrate;
forming a wall substantially around a periphery of second surface of said each semiconductor chip using a barrier material, said wall and said second surface of said each semiconductor chip defining a recess;
extending said barrier material for contacting and adhering to said substrate; and
disposing a heat-dissipating material substantially within said recess.- View Dependent Claims (64, 65, 66, 67, 68, 69)
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Specification