Integrated optoelectronic devices having pop-up mirrors therein and methods of forming and operating same

• US 6,535,318 B1
• Filed: 02/23/2000
• Issued: 03/18/2003
• Est. Priority Date: 11/12/1999
• Status: Expired due to Term

• Current Assignee: Memscap Incorporated
• Original Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Inventors: Wood, Robert L., Hill, Edward A.
• Primary Examiner(s): Lester, Evelyn A
• Application Number:
  US09/511,928
• Time in Patent Office: 1,119 Days
• Field of Search: 359/223-226, 359/290, 359/291, 359/298, 359/280, 359/292
• US Class Current: 359/225.1
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

Integrated optoelectronic devices include a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening. A pop-up mirror is provided in the opening. The mirror has an underside edge that is supported by an upward facing portion of the ledge when the mirror is in a closed position. A hinge is also provided. The hinge mechanically couples the mirror to the substrate so that the mirror can be rotated from the closed position to an open position.

Claims

1. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening;

a pop-up mirror in the opening, said mirror having an underside edge that is supported by an upward facing portion of the ledge when said mirror is in a closed position; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from the closed position to an open position.

2. The device of claim 1, wherein said mirror has an optically reflective mirror surface thereon that is self-aligned to the opening.

3. The device of claim 2, wherein said optically reflective mirror surface comprises a material selected from the group consisting of gold and aluminum.

4. The device of claim 1, wherein said substrate has an electrically conductive layer therein that is substantially coplanar with said mirror when said mirror is in the closed position.

5. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a pop-up mirror that extends in the opening and comprises a monocrystalline silicon mirror backing layer having a thickness greater than about 10 μ

m; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from a closed position to an open position.

6. The device of claim 5, wherein said mirror has an optically reflective mirror surface thereon that is self-aligned to the opening.

7. The device of Claim 6, wherein said mirror is rectangular in shape and has a length greater than about 200 μ

m.

8. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening;

a mirror in the opening, said mirror having an edge that is supported by the ledge when said mirror is in a closed position; and

a polycrystalline silicon hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from the closed position to an open position.

9. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a mirror that extends in the opening and comprises a monocrystalline silicon mirror backing layer having a thickness greater than about 10 μ

m, said mirror having an optically reflective mirror surface thereon that is self-aligned to the opening; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from a closed position to an open position, said hinge comprising a ring-shaped polycrystalline silicon layer that is attached to a back surface of said monocrystalline silicon mirror backing layer and is attached to a surface of said substrate at a location adjacent the opening.

10. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening;

a mirror in the opening, said mirror having an edge that is supported by the ledge when said mirror is in a closed position; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from the closed position to an open position, said hinge comprising a ring-shaped polycrystalline silicon layer that is attached to a back surface of said mirror and is attached to a surface of said substrate at a location adjacent the opening.

11. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a mirror in the opening; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from a closed position to an open position;

wherein said substrate has an electrically conductive layer therein that is substantially coplanar with said mirror when said mirror is in the closed position;

wherein said mirror comprises a monocrystalline silicon mirror backing layer having a thickness of greater than about 10 μ

m; and

wherein said hinge comprises a polycrystalline silicon layer that is attached to a back surface of said monocrystalline silicon mirror backing layer and is attached to a surface of said electrically conductive layer at a location adjacent the opening.

12. The device of claim 11, further comprising an electrostatic polysilicon clamp electrode that is attached to the back surface of said monocrystalline silicon mirror backing layer.

13. The device of claim 12, wherein said electrostatic polysilicon clamp electrode extends opposite the surface of said electrically conductive layer.

14. The device of claim 13, wherein said substrate comprises a silicon-on-insulator (SOI) substrate.

15. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a mirror that extends in the opening and comprises a monocrystalline silicon mirror backing layer having a thickness greater than about 10 μ

m; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from a closed position to an open position; and

a metallic frame attached to a back surface of said monocrystalline silicon mirror backing layer, said metallic frame having an area that is sufficient to cause said mirror to rotate from the closed position to the open position when a magnetic field is established through the opening.

16. The device of claim 15, wherein said metallic frame comprises nickel.

17. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough and a ledge extending inwardly from a sidewall of the opening, said substrate comprising;

a monocrystalline silicon supporting layer having a thickness of greater than about 100 μ

m;

an intermediate oxide layer on a surface of said monocrystalline silicon supporting layer; and

a monocrystalline silicon conductive layer having a thickness of greater than about 10 μ

m on the intermediate oxide layer;

a mirror in the opening, said mirror having an edge that is supported by the ledge when said mirror is in a closed position; and

a hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from the closed position to an open position.

18. The device of claim 17, wherein the opening extends through the monocrystalline silicon supporting layer, the intermediate oxide layer and the monocrystalline silicon conductive layer;

wherein a size of the opening in the monocrystalline silicon supporting layer is less than a size of the opening in the monocrystalline silicon conductive layer; and

wherein the edge of said mirror rests on the surface of said monocrystalline silicon supporting layer when said mirror is in a closed position.

19. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a pop-up mirror that extends in the opening and comprises a monocrystalline silicon mirror backing layer having a thickness greater than about 10 μ

m; and

a polycrystalline silicon hinge that mechanically couples said mirror to said substrate so that said mirror can be rotated from a closed position to an open position.

20. The device of claim 19, wherein said mirror has an optically reflective mirror surface thereon that is self-aligned to the opening.

21. An optoelectronic device, comprising:

a silicon-on-insulator substrate having an opening therein;

a mirror that is disposed in the opening when in a closed position; and

a polysilicon hinge that mechanically couples said mirror to said silicon-on-insulator substrate so that said mirror can be rotated from the closed position to an open position when a magnetic field is directed to pass through the opening.

22. The device of claim 21, wherein said mirror comprises:

a monocrystalline silicon backing layer having a thickness of greater than about 10 μ

m; and

an optically reflective mirror surface on a front surface of said monocrystalline silicon backing layer.

23. The device of claim 22, further comprising an electrostatic polysilicon clamp electrode that is attached to the back surface of said monocrystalline silicon backing layer.

24. The device of claim 23, wherein said electrostatic polysilicon clamp electrode extends opposite said silicon-on-insulator substrate and provides mechanical support to said mirror when in the closed position.

25. The device of claim 22, wherein said optically reflective mirror surface is self-aligned to the opening.

26. The device of claim 25, wherein said optically reflective mirror surface comprises a material selected from the group consisting of aluminum and gold.

27. A method of operating an optoelectronic device comprising a semiconductor substrate having an opening therein, a pop-up mirror that is disposed in the opening when in a closed position and has an optically reflective mirror surface thereon that is self-aligned to the opening and a hinge that mechanically couples the mirror to the semiconductor substrate, said method comprising the step of:

applying a magnetic field of sufficient strength through the opening to cause the pop-up mirror to rotate about the hinge from the closed position to an upright open position.

28. A method of operating an optoelectronic device comprising a semiconductor substrate having an opening therein, a mirror disposed in the opening when in a closed position, an electrostatic clamping electrode that is attached to the mirror and extends opposite a first portion of a surface of the semiconductor substrate when the mirror is in the closed position and a polysilicon hinge that mechanically couples the mirror to the semiconductor substrate and electrically couples the mirror to a second portion of the surface of the semiconductor substrate, said method comprising the steps of:

applying a magnetic field of sufficient strength through the opening to cause the mirror to rotate about the hinge from the closed position to an open position; and

clamping the mirror in the closed position by establishing an electrostatic potential between the electrostatic clamping electrode and the surface of the semiconductor substrate, while simultaneously applying a magnetic field through the opening.

29. An optoelectronic device, comprising:

a substrate having an opening therein that extends at least partially therethrough;

a pop-up mirror in the opening, said pop-up mirror having an optically reflective mirror surface thereon that is self-aligned to the opening; and

a hinge that mechanically couples said pop-up mirror to said substrate so that said mirror can be rotated from the closed position to an upright open position.