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Apparatus and method for endpoint control and plasma monitoring

  • US 6,535,779 B1
  • Filed: 03/06/1998
  • Issued: 03/18/2003
  • Est. Priority Date: 03/06/1998
  • Status: Expired due to Fees
First Claim
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1. A process monitoring system capable of monitoring a substrate processing step in a processing chamber, the process monitoring system comprising:

  • a controller capable of operating the processing chamber to perform the substrate processing step and generating a plurality of first signals comprising a signal that communicates a start of performing the substrate processing step in the processing chamber;

    an endpoint destection capable of detecting an endpoint of the substrate processing step and generating one or more second signals that communicate that the endpoint has been reached; and

    a bi-directional communication link coupling the endpoint detection system and the controller, the bi-directional communication link adapted to pass the first signals from the controller to the endpoint detection system and the second signals from the endpoint detection system to the controller.

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