Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
First Claim
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1. A micro-electro-mechanical device, comprising:
- a mono-crystalline silicon wafer having movable elements fabricated thereto; and
an epoxy adhesive layer bonding said mono-crystalline silicon wafer to a substrate wafer, wherein said movable elements comprise capacitors for detecting acceleration forces parallel and perpendicular to the surface of said silicon wafer.
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Abstract
A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.
34 Citations
1 Claim
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1. A micro-electro-mechanical device, comprising:
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a mono-crystalline silicon wafer having movable elements fabricated thereto; and
an epoxy adhesive layer bonding said mono-crystalline silicon wafer to a substrate wafer, wherein said movable elements comprise capacitors for detecting acceleration forces parallel and perpendicular to the surface of said silicon wafer.
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Specification
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Current AssigneeChang-Feng Wan
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Original AssigneeChang-Feng Wan
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InventorsWan, Chang-Feng
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Primary Examiner(s)Cao, Phat X.
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Application NumberUS09/461,018Time in Patent Office1,196 DaysField of Search257/415, 257/417, 257/254, 257/275, 257/783US Class Current257/415CPC Class CodesB81C 1/0019 Flexible or deformable stru...B81C 2201/0108 Sacrificial polymer, ashing...B81C 2201/019 Bonding or gluing multiple ...
