Bus bar assembly

• US 6,538,878 B1
• Filed: 08/21/2001
• Issued: 03/25/2003
• Est. Priority Date: 02/22/1999
• Status: Expired due to Term

• Current Assignee: World Properties Incorporated
• Original Assignee: World Properties Incorporated
• Inventors: Acker, Stefan Van, Leclercq, Didier
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/914,126
• Time in Patent Office: 581 Days
• Field of Search: 174/71.B, 174/72.B, 174/88.B, 174/117.F, 174/260, 174/6, 174/267, 361/690, 361/611, 361/775, 361/622, 361/713
• US Class Current: 361/624
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02G 5/005 Laminated bus-bars
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

The present invention relates to a bus bar assembly comprising a high power transistor module directly mounted to a bus bar. The bus bar has an improved solderability characteristic and is designed so that a solid, effective soldered connection results during a conventional soldering process in which the high power transistor module is securely mounted to the bus bar to form the bus bar assembly of the present invention. Accordingly, the soldering process involves soldering a pin which is a part of the high power transistor module to a surface of the bus bar using sufficient heat. The improved solderabilty of the present bus bar results by forming a soldering island in the bus bar at predetermined points thereof. The soldering island comprises a central soldering opening, which receives the soldering pin, and a plurality of thermal barrier openings distributed around the soldering opening.

Claims

1. A bus bar assembly, comprising:

bus bar comprising at least one plate, said plate comprising at least one conductive lug;

a soldering opening formed in the bus bar;

a thermal barrier opening formed in the bus bar proximate said soldering opening, wherein a plurality of thermal barrier openings in combination with the soldering opening define a solderings island; and

a high power transistor module mounted to the bus bar, the high power transistor module having a plurality of solderable pins electrically connecting the high power transistor module to the bus bar, wherein each solderable pin is disposed within a corresponding soldering opening formed in the bus bar.

2. The bus bar assembly as set forth in claim 1, further comprising an electrically insulating material disposed at said bus bar to prevent said plate or said conductive lug of the plate from contacting a second plate or a conductive lug of the second plate.

3. The bus bar assembly set forth in claim 2, further comprising:

a thermally conductive, electrically insulating outer coating disposed at said bus bar such that a peripheral edge of said bus bar and an integral lug portion of said bus bar extend beyond a peripheral edge of the outer coating.

4. The bus bar assembly set forth in claim 1, wherein the soldering island comprises said soldering opening surrounded by four thermal barrier openings arranged as two opposing pairs of thermal barrier opening and forming a generally rectangular soldering island with the soldering opening being centrally located.

5. The bus bar assembly set forth in claim 1, further comprising:

a capacitor mounted to the bus bar, said capacitor having a first soldering pin at a first end and a second soldering pin at a second end, the first soldering pin being received at said plate and the second soldering pin being received at a second plate of said bus bar.

6. The bus bar assembly set forth in claim 1, wherein the soldering opening is generally circular in nature and the thermal barrier openings are generally rectangular.

7. The bus bar assembly set forth in claim 1, wherein the soldering island comprises three soldering openings surrounded by six thermal barrier openings.

8. The bus bar assembly set forth in claim 1, wherein each of said plates and each of said conductive lugs comprise a copper layer having tin plating disposed on outer surfaces of said copper layer.

9. The bus bar assembly as set forth in claim 3, wherein the thermally conductive electrically insulating outer coating comprises a polymeric material.

10. A bus bar assembly, comprising:

a bus bar comprising at least one plate and at least one conductive lug disposed at said plate;

a solderable opening formed in said bus bar;

a thermal barrier opening formed in said bus bar at said solderable opening, wherein said barrier opening in combination with said solderable opening defines a soldering island; and

an electrical device mounted to said bus bar.

11. A bus bar assembly, comprising:

a bus bar comprising at least one plate and at least one conductive lug disposed at said plate;

a solderable opening formed in said bus bar; and

a thermal barrier opening formed in said bus bar at said solderable opening, wherein said thermal barrier opening in combination with said solderable opening defines a soldering island.