Feature-based defect detection

• US 6,539,106 B1
• Filed: 01/08/1999
• Issued: 03/25/2003
• Est. Priority Date: 01/08/1999
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Rhoads, Adam, Gallarda, Harry S., Lo, Chiwoei Wayne, Talbot, Christopher G.
• Primary Examiner(s): WERNER, BRIAN P
• Application Number:
  US09/227,747
• Time in Patent Office: 1,537 Days
• Field of Search: 382/144-151, 382/173, 382/204, 382/205, 382/264, 382/219, 382/274, 382/275, 348/87, 348/126, 356/237.4, 356/237.5, 250/492.3, 250/492.2, 250/559.45, 438/16, 438/17, 700/110, 700/121, 702/82, 702/172
• US Class Current: 382/149
• CPC Class Codes: G01R 31/307 of integrated circuits
• CPC Class Codes: G06T 2207/10056 Microscopic image
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach
• CPC Class Codes: G06V 10/751 Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
• CPC Class Codes: G06V 10/987 with the intervention of an operator
• CPC Class Codes: G06V 2201/06 Recognition of objects for industrial automation
• CPC Class Codes: H01J 2237/2594 Measuring electric fields or potentials
• CPC Class Codes: H01J 2237/2817 Pattern inspection

Abstract

Methods and apparatus are provided for inspecting a patterned substrate, comprising: preparing a reference image and a test image, extracting features from the reference image and extracting features from the test image, matching features of the reference image and features of the test image; and comparing features of the reference image and of the test image to identify defects. Embodiments include apparatus for inspecting patterned substrates, computer-readable media containing instructions for controlling a system having a processor for inspecting patterned substrates, and computer program products comprising a computer usable media having computer-readable program code embodied therein for controlling a system for inspecting patterned substrates. The images can be electron-beam voltage-contrast images.

Claims

1. A method of inspecting a patterned substrate, comprising:

preparing a reference image and a test image of at least a portion of the patterned substrate;

extracting features from the reference image and extracting features from the test image;

matching features of the reference image and features of the test image; and

comparing features of the reference image and of the test image to identify defects;

wherein comparing features of the reference image and of the test image to identify defects comprises;

computing feature properties in the reference image;

computing feature properties in the test image; and

comparing the computed feature properties in the test image with the computed feature properties in the reference image;

wherein the computed feature properties comprise;

area, size, center of gravity, average intensity, sum of intensity, and standard deviation of intensity;

wherein comparing the computed feature properties comprises;

calculating feature properties comparison statistics that include one or more of differences, ratios, greater-than or less-than functions, means, standard deviations, linear regressions, and adaptive thresholds; and

determining whether the feature properties comparison statistics meet predetermined defect criteria.

2. The method of claim 1, further comprising the step of aligning the test image with the reference image prior to matching features of the reference image and features of the test image.

3. The method of claim 1, further comprising the step of recording defects identified when comparing features of the reference image and of the test image.

4. The method of claim 1, wherein the reference image is a voltage-contrast image of a first patterned substrate and the test image is a voltage-contrast image of a second substrate.

5. The method of claim 1, wherein the reference image is a voltage-contrast image of a first region of a patterned substrate and the test image is a voltage-contrast image of a second region of the same patterned substrate.

6. The method of claim 5, wherein the reference image is an image of repeating cells of a patterned substrate and the test image is a duplicate of the reference image shifted by one cell relative to the reference image.

7. The method of claim 1, wherein preparing the reference image and test image comprises smoothing the reference image and smoothing the test image.

8. The method of claim 1, wherein preparing the reference image and test image comprises normalizing the reference image and normalizing the test image.

9. The method of claim 1, wherein preparing the reference image and test image comprises storing a reference image and storing a test image.

10. The method of claim 1, wherein extracting features comprises extracting features from the reference image and thereafter extracting features from the test image.

11. The method of claim 1, wherein preparing a reference image and a test image and extracting features from the images comprise:

storing a reference image and extracting features from the reference image, and storing a test image and extracting features from the test image.

12. The method of claim 1, further comprising reporting defect property statistics.

13. The method of claim 1:

wherein the reference image and the test image comprise pixel data having location and intensity information;

wherein the extracting comprises;

thresholding the intensity information of the test image to produce a binary-level image having feature regions and non-feature regions, and

using the binary-level image as a mask to define those regions of the test image as features which correspond to the feature regions of the binary-level image.

14. The method of claim 13, wherein

extracting features from the reference image comprises:

computing an average background level of the reference image, removing the average background level from the reference image to produce a first modified reference image,

thresholding the first modified reference image to produce a second modified reference image, and

identifying features in the second modified reference image;

the matching comprises matching features of the second modified reference image and features of the test image; and

the comparing comprises comparing features of the second modified reference image and of the test image to identify defects.

15. The method of claim 13, wherein

extracting features from the test image comprises

computing an average background level of the test image,

removing the average background level from the test image to produce a first modified test image,

thresholding the first modified test image to produce a second modified test image, and

identifying features in the second modified test image;

the matching comprises matching features of the reference image and features of the second modified test image; and

the comparing comprises comparing features of the reference image and of the second modified test image to identify defects.

16. The method of claim 13, wherein extracting features from the reference image comprises:

computing an average background level of the reference image,

removing the average background level from the reference image to produce a first modified reference image,

matching a feature template in the first modified reference image, and

identifying features in the first modified reference image that match the feature template.

17. The method of claim 13, wherein extracting features from the test image comprises:

computing an average background level of the test image,

removing the average background level from the test image to produce a first modified test image,

matching a feature template the first modified test image, and identifying features in the first modified test image that match the feature template.

18. The method of claim 1 wherein:

wherein the extracting comprises;

repetitively comparing the test image with a model feature to produce correlation data representing correlation features of the test image with the model feature,

thresholding the correlation data to identify feature locations within the test image, and

detecting edges of features at the identified feature locations.

19. Apparatus for inspecting a patterned substrate that comprises:

a computer system; and

instructions for controlling the computer system;

to prepare a reference image and a test image of at least a portion of the patterned substrate;

to extract features from the reference image and extract features from the test image;

to match features of the reference image and features of the test image; and

to compare features of the reference image and of the test image to identify defects;

wherein comparing features of the reference image and of the test image to identify defects comprises;

computing feature properties in the reference image;

computing feature properties in the test image; and

comparing the computed feature properties in the test image with the computed feature properties in the reference image;

wherein the computed feature properties comprise;

area, size, center of gravity, average intensity, sum of intensity, and standard deviation of intensity;

wherein comparing the computed feature properties comprises;

calculating feature properties comparison statistics that include one or more of differences, ratios, greater-than or less-than functions, means, standard deviations, linear regressions, and adaptive thresholds; and

determining whether the feature properties comparison statistics meet predetermined defect criteria.

20. The apparatus of claim 19, wherein the instructions control the computer system to align the test image with the reference image prior to matching features of the reference image and features of the test image.

21. The apparatus of claim 19, wherein the instructions control the computer system to record defects identified when comparing features of the reference image and of the test image.

22. The apparatus of claim 19, further comprising an electron-beam imaging subsystem for acquiring voltage-contrast images of a patterned substrate for use as test images.

23. The apparatus of claim 19, wherein the instructions control the computer system to smooth at least one of the reference image and the test image.

24. The apparatus of claim 19, wherein the instructions control the computer system to normalize at least one of the reference image and the test image.

25. The apparatus of claim 19, wherein the instructions control the computer system to first extract features from the reference image and then extract features from the test image.