Compression-bond-connection substrate, liquid crystal device, and electronic equipment

• US 6,542,213 B1
• Filed: 11/30/1999
• Issued: 04/01/2003
• Est. Priority Date: 04/09/1998
• Status: Expired due to Term

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Uchiyama, Kenji
• Primary Examiner(s): Ton, Toan
• Assistant Examiner(s): Rude, Timothy L.
• Application Number:
  US09/445,010
• Time in Patent Office: 1,218 Days
• Field of Search: 349/149-152, 349/158, 174/52.1, 174/52.4, 174/174, 174/176, 174/255, 174/259, 257/666, 257/678, 257/734, 257/736, 257/773, 257/776, 257/781, 257/785
• US Class Current: 349/149
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: H05K 2201/09672 Superposed layout, i.e. in different planes
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process

Abstract

A compression-bond-connection substrate compression-bonded to a compression-bonding target object has front-side terminals conductively connected to opposing-side terminals and backside terminals formed at the backsides thereof. The backside terminals are formed diagonally to the front-side terminals. Pressure is exerted uniformly on substrate-side terminals in the pressure application in compression-bonding. Therefore, a highly reliable compression-bonding connected assembly can be stably obtained.

Claims

1. A compression-bond-connection assembly comprising:

a substrate having a first side and a second side, said first side being opposite said second side;

a first plurality of terminals formed on said first side of said substrate;

a second plurality of terminals formed on said second side of said substrate, said second plurality of terminals being generally arranged so as to cross and overlap with said first plurality of terminals; and

a target object having a third plurality of terminals, said third plurality of terminals being conductively connected to and adjacent said first plurality of terminals generally in a stacked relationship;

wherein conductive connected portions compressively bonded together are formed above overlapping regions; and

wherein said second plurality of terminals is conductively connected to an elastic connector.

2. The compression-bond-connection assembly as stated in claim 1 wherein said first plurality of terminals is conductively connected to transmissive electrodes formed at least on one of a pair of liquid crystal substrates of a liquid crystal panel, said liquid crystal panel having said pair of liquid crystal substrates opposing each other and a liquid crystal sealed between said pair of liquid crystal substrates.

3. The compression-bond-connection assembly as stated in claim 1 wherein said first plurality of terminals is conductively connected to said third plurality of terminals via an anisotropic conductive film.

4. A liquid crystal device comprising:

a target object;

a plurality of terminals formed on said target object;

a substrate opposite said target object, said substrate having first and second sides;

a plurality of terminals formed on said first side of said substrate opposite said terminals formed on said target object;

an adhesive material disposed between said target object and said substrate; and

a plurality of external terminals formed on said second side of said substrate and at a diagonal so as to cross and overlap with said terminals formed on said first side of said substrate such that said plurality of terminals formed on said target object is in a stacked relationship with said plurality of terminals formed on said first side of said substrate and said plurality of external terminals formed on said second side of said substrate to facilitate compression-bonding thereof;

wherein a conductive connecting structure is formed within the adhesive material above overlapping terminal regions; and

wherein said plurality of external terminals formed on said second side of said substrate are conductively connected to an elastic connector.

5. The liquid crystal device of claim 4 wherein said adhesive material is an anisotropic conductive film.