Circuitry with integrated passive components and method for producing
First Claim
1. A circuit structure comprising:
- a) a substrate including a first conductive copper layer;
b) a layer of a photoimaged dielectric material over the first conductive copper layer, the dielectric material including at least one passive electrical device;
c) a layer of a second conductive copper layer over the layer of dielectric material; and
d) a plurality of photovias electrically joining the first conductive layer to the second conductive layer.
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Accused Products
Abstract
Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated in to electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material. The dielectric is photoimaged and etched to provide one or more recesses or openings for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric is described as well as the method of manufacturing the same.
104 Citations
24 Claims
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1. A circuit structure comprising:
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a) a substrate including a first conductive copper layer;
b) a layer of a photoimaged dielectric material over the first conductive copper layer, the dielectric material including at least one passive electrical device;
c) a layer of a second conductive copper layer over the layer of dielectric material; and
d) a plurality of photovias electrically joining the first conductive layer to the second conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of producing a high density electronic package composed of an imageable dielectric material having at least one planar surface, at least one active device mounted on said planar surface, and at least one passive device integrated into the dielectric material and electrically joined to the at least one active device, said passive device including at least one capacitor functioning as a decoupling capacitor or as an in-circuit capacitor, comprising the steps of:
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a) applying a layer of an imageable dielectric material over a circuit pattern;
b) imaging a pattern for said at least one passive device on the surface of the dielectric material to create at least one recess in the surface of the dielectric material; and
c) filling the said at least one recess with a material having the requisite properties of the passive device, said in-circuit capacitor prepared by applying a photoresist over a copper layer having an initial thickness of between about 1.5 mils and about 2.5 mils;
exposing and developing the photoresist in a pattern of a first capacitor electrode;
removing the photoresist from the entire copper surface except for the first capacitor electrode, etching the copper to a thickness of about 1 mil or less;
applying a second photoresist over the copper;
defining and etching a circuit pattern into the copper;
removing the second photoresist; and
applying the imageable dielectric material over the etched surface of the copper to a thickness of between about 2 and about 3 mils to form a sub-composite.- View Dependent Claims (16, 17, 18, 19)
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20. A method of producing a high density electronic package composed of an imageable dielectric material having at least one planar surface, at least one active device mounted on said planar surface and at least one passive device integrated into the dielectric material and electrically joined to the at least one active device, wherein the at least one passive device is an integrated inductor, comprising the steps of
a) applying a layer of an imageable dielectric material over a circuit pattern; -
b) imaging a pattern for said at least one passive device on the surface of the dielectric material to create at least one recess in the surface of the dielectric material; and
c) filling the said at least one recess with a material having the requisite properties of the passive device, the method further including the steps of etching a first set of parallel lines into the surface of a first copper layer to form one half of the windings of the inductor, applying the imageable dielectric material over the first set of parallel lines, developing a pattern in the said dielectric material to form photovias near each end of the first set of parallel lines, etching a second set of parallel lines in the surface of a second copper layer, and connecting the second set of parallel lines through the photovias to the first set of parallel lines. - View Dependent Claims (21, 22, 23)
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24. A method of producing a high density electronic package composed of an imageable dielectric material having at least one planar surface, at least one active device mounted on said planar surface and at least one passive device comprising an integrated transformer integrated into the dielectric material and electrically joined to the at least one active device, comprising the steps of
a) etching first and second rows of parallel lines spaced from one another into a first copper layer to form a circuit pattern, b) applying a layer of dielectric material over the first set of parallel lines, c) creating and developing a pattern in said dielectric material to create photovias near each end of the parallel lines and to create a recess in the dielectric material, d) etching first and second rows of parallel lines spaced from one another into a second copper layer, e) connecting the first row of lines in the first copper layer through the photovias to the first row of lines in the second copper layer to form a first set of secondary windings, f) connecting the second row of lines in the first copper layer through additional photovias to the second row of lines in the second copper layer to form a second set of secondary windings, and g) introducing a transformer core into the recess between the first and second sets of windings.
Specification