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Circuitry with integrated passive components and method for producing

  • US 6,542,379 B1
  • Filed: 07/15/1999
  • Issued: 04/01/2003
  • Est. Priority Date: 07/15/1999
  • Status: Expired due to Term
First Claim
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1. A circuit structure comprising:

  • a) a substrate including a first conductive copper layer;

    b) a layer of a photoimaged dielectric material over the first conductive copper layer, the dielectric material including at least one passive electrical device;

    c) a layer of a second conductive copper layer over the layer of dielectric material; and

    d) a plurality of photovias electrically joining the first conductive layer to the second conductive layer.

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