Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices

• US 6,542,720 B1
• Filed: 03/01/1999
• Issued: 04/01/2003
• Est. Priority Date: 03/01/1999
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tandy, Patrick W.
• Primary Examiner(s): Le, Thanh Cong
• Assistant Examiner(s): Tran, Pablo N
• Application Number:
  US09/260,997
• Time in Patent Office: 1,492 Days
• Field of Search: 455/73, 455/80, 455/84, 455/66, 455/575, 455/77, 455/550, 455/556, 455/90, 455/87, 455/41, 455/74, 455/300, 455/333, 455/83, 257/723, 257/924, 257/724, 257/787, 257/679, 257/700, 257/702, 257/725, 257/728, 257/778, 340/825.32, 340/825.54, 342/42, 342/44, 342/51
• US Class Current: 455/90.3
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H04B 1/3816 : Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
• CPC Class Codes: H04B 1/3833 : Hand-held transceivers

Abstract

Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals.

Claims

1. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received;

an integrated circuit die received within the microelectronic package and having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive radio frequency signals; and

second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package, wherein the die is void of external electrical connections for anything other than at least one of power and ground.

2. The microelectronic device of claim 1, wherein the microelectronic package contains more than one die.

3. The microelectronic device of claim 1, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die.

4. The microelectronic device of claim 1, further comprising a substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the substrate.

5. The microelectronic device of claim 1, further comprising a printed circuit board substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the printed circuit board substrate.

6. The microelectronic device of claim 1, wherein the microelectronic device is hand-carriable.

7. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry are disposed within 24 inches of one another within the microelectronic package.

8. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication.

9. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless RF communication.

10. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within 24 inches of one another within the microelectronic package.

11. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one inch of one another within the microelectronic package.

12. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one half inch of one another within the microelectronic package.

13. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received, and an integrated circuitry-supporting substrate inside the housing;

an integrated circuit die received within the microelectronic package and supported by the integrated circuitry-supporting substrate, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive wireless communication; and

second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive wireless communication, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package sufficient to enable the integrated circuitry on the integrated circuitry die to operate in a designed manner, wherein the integrated circuit die has physical-electrical connection structure securing it to the integrated circuitry-supporting substrate, said structure supplying electrical connections only for power and ground.

14. The microelectronic device of claim 13, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die supported by the integrated circuitry-supporting substrate.

15. The microelectronic device of claim 13, wherein the second transmit/receive circuitry is supported by the integrated circuitry-supporting substrate.

16. The microelectronic device of claim 13, wherein the device is hand-transportable.

17. The microelectronic device of claim 13, further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within 24 inches of one another.

18. The microelectronic device of claim 13, further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within one inch of one another.

19. The microelectronic device of claim 13, further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within one half inch of one another.

20. The microelectronic device of claim 13, wherein the wireless communication comprises RF communication.

21. The microelectronic device of claim 13, wherein the microelectronic device comprises a hermetically-sealed device.

22. An integrated circuit die comprising:

a processor; and

a radio frequency communications circuit including an antenna, and further including;

a ground interconnection; and

a power supply interconnection, wherein the ground and power supply interconnections are the only electrical interconnections to the die.

23. The integrated circuit die of claim 22, wherein the radio frequency communications circuit comprises a receiver having an input coupled to the antenna and having an output coupled to the processor.

24. The integrated circuit die of claim 22, wherein the radio frequency communications circuit comprises a transmitter having an input coupled to the processor and having an output coupled to the antenna.

25. The integrated circuit die of claim 22, wherein the radio frequency communications circuit is configured to;

receive incoming data and couple the incoming data to the processor; and

accept output data from the processor and transmit radio waves corresponding to the output data from the antenna.

26. The integrated circuit die of claim 22, wherein the radio frequency communications circuit is configured to receive incoming data and couple the incoming data to the processor and wherein the incoming data comprises instructions configured to cause the processor to execute a predetermined task.

27. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received;

an integrated circuit die received within the microelectronic package and having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive radio frequency signals and including a processor coupled to the first transmit/receiver circuitry and configured to be operable via communications passed through the first transmit/receive circuitry; and

second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package, wherein the die is void of external electrical connections for anything other than at least one of power and ground, and wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless RF communication.

28. The microelectronic device of claim 27, wherein the antennas are disposed within 24 inches of one another within the microelectronic package.

29. The microelectronic device of claim 27, wherein the antennas are disposed within one inch of one another within the microelectronic package.

30. The microelectronic device of claim 27, the antennas being disposed within one half inch of one another within the microelectronic package.

31. The microelectronic device of claim 27, wherein the microelectronic device is hand-carriable.