Micro-electromechanical hinged flap structure

• US 6,543,087 B2
• Filed: 06/01/2001
• Issued: 04/08/2003
• Est. Priority Date: 06/01/2001
• Status: Expired due to Fees

• Current Assignee: AIP Networks Incorporated
• Original Assignee: AIP Networks Incorporated
• Inventors: Van Kampen, Robertus Petrus, Yeh, J. Andrew, Kwa, Tom A.
• Primary Examiner(s): Mah, Chuck Y.
• Application Number:
  US09/872,074
• Publication Number:
  US 20020180311A1
• Time in Patent Office: 676 Days
• Field of Search: 162/92, 163/21, 163/26--28, 163/19, 163/24, 163/33, 163/43, 163/35, 162/97, 163/08, 16/82, 16/85, 16/86.B, 292/95, 292/109, 292/116, 292/121, 292/102, 292/107, 292/108, 108/1, 108/2, 108/4, 108/9, 108/10, 310/328, 310/326
• US Class Current: 16/292
• CPC Class Codes: B81B 3/0054 For holding or placing an element in a given position
• CPC Class Codes: B81B 3/0062 Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension

Abstract

The micro-electromechanical hinged flap system includes a substantially horizontal substrate and a main flap hinged on one side thereof to the substrate. The system also includes at least one locking flap, preferably two, for securing the main flap in a substantially vertical position. The locking flap is coupled to the substrate by means of a biasing mechanism that continually forces the locking flap toward a position parallel to the substrate. Also provided is a method for assembling a micro-electromechanical hinged flap system. A locking flap is rotated through an acute angle against a biasing force. The biasing force is caused by a biasing mechanism coupling the locking flap to a substrate. A main flap is then raised, whereafter the locking flap is released, such that the biasing force causes the locking flap to engage with the main flap, thereby, securing the main flap in position at the predetermined angle.

Claims

1. A micro-electromechanical hinged flap system comprising:

a substantially horizontal substrate;

a main flap hinged on one side thereof to said substrate; and

at least one locking flap for securing said main flap in a substantially vertical position, where said locking flap is coupled to said substrate by means of a biasing mechanism that continually forces said locking flap toward a position parallel to said substrate.

2. The micro-electromechanical hinged flap system of claim 1, wherein said biasing mechanism comprises at least one locking flap torsion bar coupled on a side thereof to said locking flap , and coupled on another side thereof to said substrate.

3. The micro-electromechanical hinged flap system of claim 1, wherein said biasing mechanism comprises a bending mode spring coupled on a side thereof to said locking flap, and coupled on another side thereof to said substrate.

4. The micro-electromechanical hinged flap system of claim 1, wherein said biasing mechanism comprises:

at least one locking flap torsion bar coupled on a side thereof to said locking flap, and coupled on another side thereof to said substrate; and

a bending mode spring coupled on a side thereof to said locking flap, and coupled on another side thereof to said substrate.

5. The micro-electromechanical hinged flap system of claim 1, further comprising an additional locking flap coupled to said substrate, where said additional locking flap is disposed n ear an opposing side of said main flap to where said locking flap is disposed.

6. The micro-electromechanical hinged flap system of claim 1, wherein said main flap is hinged to said substrate along a hinge axis that is substantially perpendicular to a rotational axis of said locking flap.

7. The micro-electromechanical hinged flap system of claim 1, wherein said main flap is hinged to said substrate by means of multiple hinges.

8. The micro-electromechanical hinged flap system of claim 7, wherein said multiple hinges are spring-loaded structures.

9. The micro-electromechanical hinged flap system of claim 1, wherein said main flap is additionally coupled to said substrate by means of an additional torsion bar.

10. The micro-electromechanical hinged flap system of claim 1, wherein said locking flap is additionally coupled to said substrate by means of an additional hinge.

11. The micro-electromechanical hinged flap system of claim 10, wherein said additional hinge is a staple hinge.

12. The micro-electromechanical hinged flap system of claim 1, wherein said main flap and said locking flap also include a ferrous metal tab configured to attract a magnetic source.

13. The micro-electromechanical hinged flap system of claim 1, wherein said main flap includes a stress relieving mechanism that distributes a biasing force directed at said main flap from said locking flap.

14. A method for assembling a micro-electromechanical hinged flap system, comprising:

rotating a locking flap through an acute angle against a biasing force caused by a biasing mechanism coupling said locking flap to a substrate;

raising a main flap;

releasing said locking flap, such that said biasing force causes said locking flap to engage with said main flap, thereby, securing said main flap in position at a predetermined angle.

15. The method of claim 14, wherein said rotating further comprises rotating an additional locking flap through an acute angle against a biasing force caused by an additional biasing mechanism coupling said additional locking flap to said substrate.

16. The method of claim 15, wherein said releasing further comprises releasing said locking flap and said additional flap, such that said biasing forces cause said locking flap and said additional locking flap to engage with said main flap on opposing sides thereof, thereby, securing said main flap in position between equal and opposite biasing forces.

17. The method of claim 14, wherein said raising comprises raising said main flap through approximately ninety degrees.

18. The method of claim 14, further comprising initially manufacturing said locking flap, substrate, and main flap using micro-electromechanical systems (MEMS) technology.

19. The method of claim 14, wherein said rotating is accomplished by magnetically attracting said locking flap to a magnetic source.

20. The method of claim 14, wherein said raising is accomplished by magnetically attracting said main flap to a magnetic source.

21. The method of claim 14, wherein said rotating overcomes a biasing force caused by a torsion bar that couples said locking flap to said substrate.

22. The method of claim 14, wherein said rotating overcomes a biasing force caused by a bending mode spring that couples said locking flap to said substrate.

23. The method of claim 14, wherein said raising overcomes a biasing force caused by a spring-loaded structure that couples said main flap to said substrate.

24. The method of claim 14, wherein said raising overcomes a biasing force caused by a main flap torsion bar that couples said main flap to said substrate.

25. The method of claim 14, further comprising translating said main flap along a direction parallel to said substrate in a direction normal to said main flap.

26. The method of claim 25, wherein said translating step is caused by a micro-electromechanical system (MEMS) spring.