Mounting method and mounting apparatus for electronic part

• US 6,543,668 B1
• Filed: 04/07/1999
• Issued: 04/08/2003
• Est. Priority Date: 04/09/1998
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Suzuki, Kazutaka, Fujii, Tomonori
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): JOHNSON, JONATHAN J
• Application Number:
  US09/287,639
• Time in Patent Office: 1,462 Days
• Field of Search: 228/102, 228/103, 228/105, 228/110.1, 228/234.1, 228/1.1, 228/8, 228/12, 228/10, 228/9, 228/180.22, 156/73.1
• US Class Current: 228/103
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: B23K 20/025 Bonding tips therefor
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 20/106 Features related to sonotrodes
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B29C 65/08 using ultrasonic vibrations non-plastics element to plastics elements B29C65/645
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/81121 Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/81206 Direction of oscillation
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor. The mounting apparatus is constructed so that the amount of compression of the bumps (sinking amounts of bumps) when a predetermined weight R and an ultrasonic vibration US are applied to the bumps for a predetermined time are monitored by the laser displacement meter, a judgment is made as to whether or not the sinking amounts respectively fall within desired ranges, and then a judgment is made as to whether the joint formed by the ultrasonic wave and thermocompression bonding connection utilizing the flip-chip bonding system is defective or non-defective.

Claims

1. A mounting apparatus of a flip-chip having a plurality of bonding areas said bonding areas constituting bumps, utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system which monitors the connection of a plurality of bonding areas on said flip-chip to assure a non-defective bond thereof comprising:

an ultrasonic vibration generating device;

a horn attached to the ultrasonic vibration generating device;

a collet tool for holding a flip-chip attached to said horn;

a control unit being connected to the ultrasonic vibration generating device;

a substrate conductor heating unit connected to said control unit;

a height measuring device for monitoring a height of the flip-chip with respect to a substrate conductor connected to the control unit, by monitoring a first bump sinking amount and a second bump sinking amount of a flip-chip having a plurality of bumps thereon; and

a vibration measuring device for monitoring a vibrating state of a plurality of bonding areas of the flip-chip connected with said control unit;

wherein the control unit controls operation of the ultrasonic vibration generating device based on change in height between the flip-chip and the substrate conductor heating unit and on the vibrating state of the plurality of bonding areas of the flip-chip.

2. A mounting apparatus for mounting a flip-chip having a plurality of bumps constituting bonding areas on a substrate using ultrasonic wave and thermocompression bonding utilizing a flip-chip bonding system which monitors the connection of a plurality of bonding areas of a flip-chip to assure a non-defective bond thereof comprising:

an ultrasonic vibration generating device;

a horn connected to said ultrasonic vibration generating device;

a collet tool attached to said horn;

a control;

a substrate conductor heating unit connected with said control unit; and

a measuring device for monitoring a voltage, an electric current, or both, to be applied to the ultrasonic vibration generating device, connected with said control unit, which monitors the condition of a plurality of bumps of the flip-chip during the bonding process,

wherein the formed plurality of ultrasonic and thermocompression bonding connections are inspected and judged defective or non-defective by applying and measuring a voltage, an electric current, or both to the ultrasonic vibration generating device, and then comparing the measured voltage, electric current, or both, with reference waveforms to determine whether the voltage of electric current are applied normally in the mounting apparatus.