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Method and system for in-situ cleaning of semiconductor manufacturing equipment using combination chemistries

  • US 6,544,345 B1
  • Filed: 07/12/2000
  • Issued: 04/08/2003
  • Est. Priority Date: 07/12/1999
  • Status: Expired due to Fees
First Claim
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1. A method of cleaning deposits in semiconductor manufacturing equipment wherein there are different types of deposits including powdery and dense film-like deposits, characterized in that the equipment is cleaned using two separate steps, each of said steps using different fluorine containing chemicals to selectively clean the different deposits.

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