METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS
First Claim
1. A method for securing at least two semiconductor device components to one another, comprising:
- providing a first semiconductor device component;
applying an adhesive material comprising a pressure sensitive component and a thermoset component to a surface of said first semiconductor component;
pressing a second semiconductor device component against said adhesive material to secure said second semiconductor device component to said first semiconductor device component with at least said pressure sensitive component of said adhesive material; and
heating at least said thermoset component of said adhesive material to cure at least said thermoset component.
7 Assignments
0 Petitions
Accused Products
Abstract
A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.
-
Citations
24 Claims
-
1. A method for securing at least two semiconductor device components to one another, comprising:
-
providing a first semiconductor device component;
applying an adhesive material comprising a pressure sensitive component and a thermoset component to a surface of said first semiconductor component;
pressing a second semiconductor device component against said adhesive material to secure said second semiconductor device component to said first semiconductor device component with at least said pressure sensitive component of said adhesive material; and
heating at least said thermoset component of said adhesive material to cure at least said thermoset component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
repositioning said first and second semiconductor device components relative to one another before said heating.
-
-
13. A method for securing at least two semiconductor device components to one another, comprising:
-
applying an adhesive material comprising a pressure sensitive component and a thermoset component to at least one of the at least two semiconductor device components;
pressing the at least two semiconductor device components together with said adhesive material positioned therebetween to secure the at least two semiconductor device components to one another with at least said pressure sensitive component of said adhesive material; and
heating at least said thermoset component of said adhesive material to cure at least said thermoset component. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
repositioning the at least two semiconductor device components relative to one another before said heating.
-
Specification